The Asia Pacific Embedded Die Packaging Technology Market would witness market growth of 18.9% CAGR during the forecast period (2022-2028).
Embedded die packaging has excellent electrical performance at high frequencies, making it a potential method for developing microwave applications. The need for compact electrical circuitry is growing as electronic gadgets become smaller to make them more accessible for people to operate.
This desire is satisfied by embedded die packaging technology, which has benefits including excellent reliability, higher signal density, smaller size, signal inductance, and power inductance, as well as increased functionality and efficiency of the electronic circuit. In addition, with embedded die packaging, unlike previous approaches, the die is embedded and takes up no space on the chip.
The need for disruptive technologies such as IOT in the area would be driven by the need for smart building and space solutions in highly populated regions. Therefore, much money is being invested in the internet of things solutions by the rapidly rising economies of China, Japan, South Korea, Singapore, and India. Additionally, to enhance safety and quality of life, the regulatory organizations of these nations are working very hard to build smart city initiatives. The government of Singapore released a Smart Nation Plan in 2017 to develop into a global digital center. The government is attempting to use IoT technology to enhance city living. These components are anticipated to provide growth opportunities for embedded die packaging technology in the local market.
The China market dominated the Asia Pacific Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $27,074.5 Thousands by 2028.The Japan market is estimated to grow a CAGR of 18.2% during (2022 - 2028). Additionally, The India market would experience a CAGR of 19.7% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Embedded die packaging has excellent electrical performance at high frequencies, making it a potential method for developing microwave applications. The need for compact electrical circuitry is growing as electronic gadgets become smaller to make them more accessible for people to operate.
This desire is satisfied by embedded die packaging technology, which has benefits including excellent reliability, higher signal density, smaller size, signal inductance, and power inductance, as well as increased functionality and efficiency of the electronic circuit. In addition, with embedded die packaging, unlike previous approaches, the die is embedded and takes up no space on the chip.
The need for disruptive technologies such as IOT in the area would be driven by the need for smart building and space solutions in highly populated regions. Therefore, much money is being invested in the internet of things solutions by the rapidly rising economies of China, Japan, South Korea, Singapore, and India. Additionally, to enhance safety and quality of life, the regulatory organizations of these nations are working very hard to build smart city initiatives. The government of Singapore released a Smart Nation Plan in 2017 to develop into a global digital center. The government is attempting to use IoT technology to enhance city living. These components are anticipated to provide growth opportunities for embedded die packaging technology in the local market.
The China market dominated the Asia Pacific Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $27,074.5 Thousands by 2028.The Japan market is estimated to grow a CAGR of 18.2% during (2022 - 2028). Additionally, The India market would experience a CAGR of 19.7% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Scope of the Study
Market Segments Covered in the Report:
By Vertical
- Consumer Electronics
- IT & Telecommunication
- Automotive
- Healthcare
- Others
By Platform
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- General Electric (GE) Co
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd
- Amkor Technology, Inc
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
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- The highest number of Market tables and figures
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- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Embedded Die Packaging Technology Market, by Vertical
1.4.2 Asia Pacific Embedded Die Packaging Technology Market, by Platform
1.4.3 Asia Pacific Embedded Die Packaging Technology Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Embedded Die Packaging Technology Market
Chapter 4. Asia Pacific Embedded Die Packaging Technology Market by Vertical
4.1 Asia Pacific Consumer Electronics Market by Country
4.2 Asia Pacific IT & Telecommunication Market by Country
4.3 Asia Pacific Automotive Market by Country
4.4 Asia Pacific Healthcare Market by Country
4.5 Asia Pacific Others Market by Country
Chapter 5. Asia Pacific Embedded Die Packaging Technology Market by Platform
5.1 Asia Pacific Embedded Die in IC Package Substrate Market by Country
5.2 Asia Pacific Embedded Die in Rigid Board Market by Country
5.3 Asia Pacific Embedded Die in Flexible Board Market by Country
Chapter 6. Asia Pacific Embedded Die Packaging Technology Market by Country
6.1 China Embedded Die Packaging Technology Market
6.1.1 China Embedded Die Packaging Technology Market by Vertical
6.1.2 China Embedded Die Packaging Technology Market by Platform
6.2 Japan Embedded Die Packaging Technology Market
6.2.1 Japan Embedded Die Packaging Technology Market by Vertical
6.2.2 Japan Embedded Die Packaging Technology Market by Platform
6.3 India Embedded Die Packaging Technology Market
6.3.1 India Embedded Die Packaging Technology Market by Vertical
6.3.2 India Embedded Die Packaging Technology Market by Platform
6.4 South Korea Embedded Die Packaging Technology Market
6.4.1 South Korea Embedded Die Packaging Technology Market by Vertical
6.4.2 South Korea Embedded Die Packaging Technology Market by Platform
6.5 Singapore Embedded Die Packaging Technology Market
6.5.1 Singapore Embedded Die Packaging Technology Market by Vertical
6.5.2 Singapore Embedded Die Packaging Technology Market by Platform
6.6 Malaysia Embedded Die Packaging Technology Market
6.6.1 Malaysia Embedded Die Packaging Technology Market by Vertical
6.6.2 Malaysia Embedded Die Packaging Technology Market by Platform
6.7 Rest of Asia Pacific Embedded Die Packaging Technology Market
6.7.1 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical
6.7.2 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform
Chapter 7. Company Profiles
7.1 General Electric (GE) Co.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Acquisition and Mergers:
7.2.5.2 Geographical Expansions:
7.2.6 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.5.2 Acquisition and Mergers:
7.4 Fujikura Ltd.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments:
7.5.5.1 Geographical Expansions:
7.6 Taiwan Semiconductor Manufacturing Company Limited
7.6.1 Company overview
7.6.2 Financial Analysis
7.6.3 Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Partnerships, Collaborations, and Agreements:
7.7 ASE Group (ASE Technology Holding)
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expenses
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Product Launches and Product Expansions:
7.8 Microsemi Corporation (Microchip Technology)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Schweizer Electronic AG (Wus Printed Circuit)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expenses
7.10. AT&S Group
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
Companies Mentioned
- General Electric (GE) Co.
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd.
- Amkor Technology, Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
Methodology
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