In the aerospace and defense sector, FPCBs are crucial for mission-critical applications, including avionics, communication systems, and guidance systems. Their ability to handle extreme conditions makes them an ideal choice. Manufacturing machinery, industrial robots, and automation systems rely on FPCBs to ensure consistent and reliable performance. Their flexibility and resistance to harsh environments are highly advantageous. Telecommunication equipment and networking devices often require FPCBs for compact design and high-speed signal transmission. These boards are essential for 5G infrastructure and data centers.
Furthermore, from foldable smartphones and tablets to curved LED displays, FPCBs are integral to developing cutting-edge consumer electronic products. Their flexibility allows for unique and eye-catching form factors. In the automotive industry, FPCBs are used in everything from dashboard displays and navigation systems to airbag systems and LED lighting. They withstand the harsh conditions of vehicle environments and contribute to safety and performance. Medical devices often require flexible and biocompatible PCBs, and FPCBs are a natural choice. They are used in medical sensors, wearable health monitors, and diagnostic equipment.
As per the data from Invest India, India’s domestic electronics production is expected to reach $ 300 Bn by FY26. At present, India’s domestic production has increased at a CAGR of 13% from $49 Bn in FY17 to $101 Bn in FY23. By FY26, the nation's exports of electronic goods are expected to reach $120 billion. The export of electronic goods from India has increased from $5 Bn in FY17 to $24 Bn in FY23. Therefore, the growing electronics industry in Asia Pacific will pose lucrative growth prospects for the market in the region.
The China market dominated the Asia Pacific Flexible Printed Circuit Boards Market, by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $5,210.6 Million by 2030. The Japan market is showcasing a CAGR of 10.2% during (2023 - 2030). Additionally, The India market would register a CAGR of 11.7% during (2023 - 2030).
Based on End User, the market is segmented into Consumer Electronics, Industrial Electronics, Automotive, and Others. Based on Type, the market is segmented into Double Sided FPCB, Multilayer FPCB, Rigid FPCB, Single Sided FPCB, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Sumitomo Electric Industries, Ltd., Nitto Denko Corporation, Suzhou Dongshan Precision Manufacturing Co., Ltd., Fujikura Ltd., Benchmark Electronics, Inc., NOK Corporation, Ichia Technologies Inc., Zhen Ding Technology Holding Limited, Flexium Interconnect, Inc. and Interflex co., ltd.
Scope of the Study
Market Segments Covered in the Report:
By End User (Volume, Million Units, USD Billion/Million, 2019-2030)- Consumer Electronics
- Industrial Electronics
- Automotive
- Others
- Double Sided FPCB
- Multilayer FPCB
- Rigid FPCB
- Single Sided FPCB
- Others
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Sumitomo Electric Industries, Ltd.
- Nitto Denko Corporation
- Suzhou Dongshan Precision Manufacturing Co., Ltd.
- Fujikura Ltd.
- Benchmark Electronics, Inc.
- NOK Corporation
- Ichia Technologies Inc.
- Zhen Ding Technology Holding Limited
- Flexium Interconnect, Inc.
- Interflex co., ltd.
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Table of Contents
Companies Mentioned
- Sumitomo Electric Industries, Ltd.
- Nitto Denko Corporation
- Suzhou Dongshan Precision Manufacturing Co., Ltd.
- Fujikura Ltd.
- Benchmark Electronics, Inc.
- NOK Corporation
- Ichia Technologies Inc.
- Zhen Ding Technology Holding Limited
- Flexium Interconnect, Inc.
- Interflex co., ltd.
Methodology
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