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Asia Pacific Gate Driver ICs Market Size, Share & Trends Analysis Report By Transistor Type (MOSFET, and IGBT), By Semiconductor Material (SiC, and GaN), By Mode of Attachment, By Application, By Country and Growth Forecast, 2023 - 2030

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    Report

  • 173 Pages
  • February 2024
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5945586
The Asia Pacific Gate Driver ICs Market would witness market growth of 5.5% CAGR during the forecast period (2023-2030). In the year 2021, the Asia Pacific market's volume surged to 272.8 million units, showcasing a growth of 11.2% (2019-2022).

Technological advancements and innovations in the semiconductor industry propel the market into new frontiers of efficiency and performance. With each iteration, gate driver ICs undergo refinement and enhancement, integrating cutting-edge features such as built-in protection circuits, advanced isolation technologies, and intelligent thermal management systems. These advancements bolster the reliability and safety of power electronics systems and unlock new possibilities for innovation and application across diverse industries.

Gate driver ICs increasingly integrate additional functionalities to enhance system performance and simplify design complexity. Integrated features such as protection circuits, fault detection, under-voltage lockout (UVLO), over-current protection (OCP), and thermal management enable more robust and reliable operation of power electronics systems while reducing the need for external components. With the rise of fast-switching semiconductor devices, these are optimized for ultra-fast switching speeds to maximize efficiency and minimize switching losses.

According to the International Trade Administration (ITA), the South Korean government (the Ministry of Trade, Industry and Energy: MOTIE) established the 3rd Energy Master Plan in June 2019. The master plan aims to reduce Korea's total energy consumption by 14.4% by 2030, 17.2% by 2035, and 18.6% by 2040, below the projected business-as-usual (BAU) level. In October 2021, Korea announced its revised Nationally Defined Contribution (NDC), which includes plans to reduce carbon emissions by 40% by 2030 from 2018. Therefore, the expansion of the semiconductor industry and rising zero carbon emission policies in the region are propelling the market's growth.

The China market dominated the Asia Pacific Gate Driver ICs Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $279.2 Million by 2030. The Japan market is registering a CAGR of 4.8% during (2023 - 2030). Additionally, The Taiwan market would showcase a CAGR of 6.5% during (2023 - 2030).

Based on Transistor Type, the market is segmented into MOSFET, and IGBT. Based on Semiconductor Material, the market is segmented into SiC, and GaN. Based on Mode of Attachment, the market is segmented into On-chip, and Discrete. Based on Application, the market is segmented into Industrial, Commercial, and Residential. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Taiwan, and Rest of Asia Pacific.

List of Key Companies Profiled

  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • NXP Semiconductors N.V.
  • Rohm Co., Ltd.
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Semtech Corporation
  • Microchip Technology Incorporated
  • ON Semiconductor Corporation
  • Renesas Electronics Corporation

Market Report Segmentation

By Transistor Type (Volume, Million Units, USD Billion, 2019-2030)
  • MOSFET
  • IGBT
By Semiconductor Material (Volume, Million Units, USD Billion, 2019-2030)
  • SiC
  • GaN
By Mode of Attachment (Volume, Million Units, USD Billion, 2019-2030)
  • On-chip
  • Discrete
By Application (Volume, Million Units, USD Billion, 2019-2030)
  • Industrial
  • Commercial
  • Residential
By Country (Volume, Million Units, USD Billion, 2019-2030)
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Taiwan
  • Rest of Asia Pacific

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Gate Driver ICs Market, by Transistor Type
1.4.2 Asia Pacific Gate Driver ICs Market, by Semiconductor Material
1.4.3 Asia Pacific Gate Driver ICs Market, by Mode of Attachment
1.4.4 Asia Pacific Gate Driver ICs Market, by Application
1.4.5 Asia Pacific Gate Driver ICs Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Opportunities
3.2.3 Market Restraints
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Partnerships, Collaborations & Agreements : 2022, Jul - 2023, Nov) Leading Players
4.5 Porter’s Five Forces Analysis
Chapter 5. Asia Pacific Gate Driver ICs Market, By Transistor Type
5.1 Asia Pacific MOSFET Market, By Country
5.2 Asia Pacific IGBT Market, By Country
Chapter 6. Asia Pacific Gate Driver ICs Market, By Semiconductor Material
6.1 Asia Pacific SiC Market, By Country
6.2 Asia Pacific GaN Market, By Country
Chapter 7. Asia Pacific Gate Driver ICs Market, By Mode of Attachment
7.1 Asia Pacific On-chip Market, By Country
7.2 Asia Pacific Discrete Market, By Country
Chapter 8. Asia Pacific Gate Driver ICs Market, By Application
8.1 Asia Pacific Industrial Market, By Country
8.2 Asia Pacific Commercial Market, By Country
8.3 Asia Pacific Residential Market, By Country
Chapter 9. Asia Pacific Gate Driver ICs Market, By Country
9.1 China Gate Driver ICs Market
9.1.1 China Gate Driver ICs Market, By Transistor Type
9.1.2 China Gate Driver ICs Market, By Semiconductor Material
9.1.3 China Gate Driver ICs Market, By Mode of Attachment
9.1.4 China Gate Driver ICs Market, By Application
9.2 Japan Gate Driver ICs Market
9.2.1 Japan Gate Driver ICs Market, By Transistor Type
9.2.2 Japan Gate Driver ICs Market, By Semiconductor Material
9.2.3 Japan Gate Driver ICs Market, By Mode of Attachment
9.2.4 Japan Gate Driver ICs Market, By Application
9.3 Taiwan Gate Driver ICs Market
9.3.1 Taiwan Gate Driver ICs Market, By Transistor Type
9.3.2 Taiwan Gate Driver ICs Market, By Semiconductor Material
9.3.3 Taiwan Gate Driver ICs Market, By Mode of Attachment
9.3.4 Taiwan Gate Driver ICs Market, By Application
9.4 India Gate Driver ICs Market
9.4.1 India Gate Driver ICs Market, By Transistor Type
9.4.2 India Gate Driver ICs Market, By Semiconductor Material
9.4.3 India Gate Driver ICs Market, By Mode of Attachment
9.4.4 India Gate Driver ICs Market, By Application
9.5 South Korea Gate Driver ICs Market
9.5.1 South Korea Gate Driver ICs Market, By Transistor Type
9.5.2 South Korea Gate Driver ICs Market, By Semiconductor Material
9.5.3 South Korea Gate Driver ICs Market, By Mode of Attachment
9.5.4 South Korea Gate Driver ICs Market, By Application
9.6 Singapore Gate Driver ICs Market
9.6.1 Singapore Gate Driver ICs Market, By Transistor Type
9.6.2 Singapore Gate Driver ICs Market, By Semiconductor Material
9.6.3 Singapore Gate Driver ICs Market, By Mode of Attachment
9.6.4 Singapore Gate Driver ICs Market, By Application
9.7 Rest of Asia Pacific Gate Driver ICs Market
9.7.1 Rest of Asia Pacific Gate Driver ICs Market, By Transistor Type
9.7.2 Rest of Asia Pacific Gate Driver ICs Market, By Semiconductor Material
9.7.3 Rest of Asia Pacific Gate Driver ICs Market, By Mode of Attachment
9.7.4 Rest of Asia Pacific Gate Driver ICs Market, By Application
Chapter 10. Company Profiles
10.1 Infineon Technologies AG
10.1.1 Company Overview
10.1.2 Financial Analysis
10.1.3 Segmental and Regional Analysis
10.1.4 Research & Development Expense
10.1.5 Recent strategies and developments:
10.1.5.1 Partnerships, Collaborations, and Agreements:
10.1.5.2 Acquisition and Mergers:
10.1.6 SWOT Analysis
10.2 Mitsubishi Electric Corporation
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Research & Development Expense
10.2.5 Recent strategies and developments:
10.2.5.1 Partnerships, Collaborations, and Agreements:
10.2.5.2 Acquisition and Mergers:
10.2.6 SWOT Analysis
10.3 NXP Semiconductors N.V.
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Regional Analysis
10.3.4 Research & Development Expense
10.3.5 Recent strategies and developments:
10.3.5.1 Partnerships, Collaborations, and Agreements:
10.3.5.2 Product Launches and Product Expansions:
10.3.6 SWOT Analysis
10.4 Rohm Co., Ltd.
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Segmental and Regional Analysis
10.4.4 Research & Development Expense
10.4.5 Recent strategies and developments:
10.4.5.1 Partnerships, Collaborations, and Agreements:
10.4.6 SWOT Analysis
10.5 STMicroelectronics N.V.
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Segmental and Regional Analysis
10.5.4 Research & Development Expense
10.5.5 Recent strategies and developments:
10.5.5.1 Partnerships, Collaborations, and Agreements:
10.5.5.2 Product Launches and Product Expansions:
10.5.5.3 Acquisition and Mergers:
10.5.6 SWOT Analysis
10.6 Toshiba Corporation
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Segmental and Regional Analysis
10.6.4 Research and Development Expense
10.6.5 Recent strategies and developments:
10.6.5.1 Product Launches and Product Expansions:
10.6.6 SWOT Analysis
10.7 Semtech Corporation
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Regional & Segmental Analysis
10.7.4 Product Development and Engineering expenses
10.7.5 Recent strategies and developments:
10.7.5.1 Acquisition and Mergers:
10.7.6 SWOT Analysis
10.8 Microchip Technology Incorporated
10.8.1 Company Overview
10.8.2 Financial Analysis
10.8.3 Segmental and Regional Analysis
10.8.4 Research & Development Expenses
10.8.5 Recent strategies and developments:
10.8.5.1 Acquisition and Mergers:
10.8.6 SWOT Analysis
10.9 ON Semiconductor Corporation
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 Segmental and Regional Analysis
10.9.4 Research & Development Expense
10.9.5 Recent strategies and developments:
10.9.5.1 Acquisition and Mergers:
10.9.6 SWOT Analysis
10.10. Renesas Electronics Corporation
10.10.1 Company Overview
10.10.2 Financial Analysis
10.10.3 Segmental and Regional Analysis
10.10.4 Research & Development Expense
10.10.5 Recent strategies and developments:
10.10.5.1 Acquisition and Mergers:
10.10.6 SWOT Analysis

Companies Mentioned

  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • NXP Semiconductors N.V.
  • Rohm Co., Ltd.
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Semtech Corporation
  • Microchip Technology Incorporated
  • ON Semiconductor Corporation
  • Renesas Electronics Corporation

Methodology

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