The Asia Pacific Low Profile Additives Market would witness market growth of 5.3% CAGR during the forecast period (2023-2030). In the year 2021, the Asia Pacific market's volume surged to 131.92 kilo tonnes, showcasing a growth of 4.1% (2019-2022).
Low-profile additives (LPAs) are substances used in thermoplastics, particularly in producing thermoplastic composites, to improve their processability and performance. LPAs are added to the polymer matrix to reduce viscosity, improving the wetting of reinforcing fibers.
Additionally, LPAs are especially useful in applications with high fiber content or complex geometries, as they can help reduce the viscosity of the polymer matrix, allowing for better impregnation and wetting of the fibers.
As per the National Investment Promotion & Facilitation Agency, India’s electronics export is expected to reach $120 Bn by FY26. Furthermore, from April to November 2023, electronic goods exports were recorded at $17.74 Bn compared to $14.36 Bn from April to November 2022, registering a growth of 23.56%. Domestic production of electronics is valued at $101 Bn in FY23 and is segmented (based on FY22 data) as mobile phones (43%), IT hardware (5%), consumer electronics (12%), strategic electronics (5%), industrial electronics (12%).
The China market dominated the Asia Pacific Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $127,229.9 Thousands by 2030. The Japan market is experiencing a CAGR of 4.6% during (2023 - 2030). Additionally, The India market would exhibit a CAGR of 5.9% during (2023 - 2030).
Based on Application, the market is segmented into Shrink & Bulk Molding Compounds (SMC/BMC), Resin Transfer Molding, Pultrusion, and Others. Based on Product, the market is segmented into Polyvinyl Acetate (PVAc), Polymethyl Methacrylate (PMMA), Polystyrene (PS), Polyurethane (PU), and High-density Polyethylene (HDPE). Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Low-profile additives (LPAs) are substances used in thermoplastics, particularly in producing thermoplastic composites, to improve their processability and performance. LPAs are added to the polymer matrix to reduce viscosity, improving the wetting of reinforcing fibers.
Additionally, LPAs are especially useful in applications with high fiber content or complex geometries, as they can help reduce the viscosity of the polymer matrix, allowing for better impregnation and wetting of the fibers.
As per the National Investment Promotion & Facilitation Agency, India’s electronics export is expected to reach $120 Bn by FY26. Furthermore, from April to November 2023, electronic goods exports were recorded at $17.74 Bn compared to $14.36 Bn from April to November 2022, registering a growth of 23.56%. Domestic production of electronics is valued at $101 Bn in FY23 and is segmented (based on FY22 data) as mobile phones (43%), IT hardware (5%), consumer electronics (12%), strategic electronics (5%), industrial electronics (12%).
The China market dominated the Asia Pacific Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $127,229.9 Thousands by 2030. The Japan market is experiencing a CAGR of 4.6% during (2023 - 2030). Additionally, The India market would exhibit a CAGR of 5.9% during (2023 - 2030).
Based on Application, the market is segmented into Shrink & Bulk Molding Compounds (SMC/BMC), Resin Transfer Molding, Pultrusion, and Others. Based on Product, the market is segmented into Polyvinyl Acetate (PVAc), Polymethyl Methacrylate (PMMA), Polystyrene (PS), Polyurethane (PU), and High-density Polyethylene (HDPE). Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
List of Key Companies Profiled
- Wacker Chemie AG
- INEOS Group Holdings S.A.
- BASF SE
- LyondellBasell Industries Holdings B.V.
- Ashland Inc.
- Arkema S.A.
- Evonik Industries AG (RAG-Stiftung)
- Taak Resin Co.
- AOC, LLC
- Synthomer PLC
Market Report Segmentation
By Application (Volume, Kilo Tonnes, USD Million, 2019-2030)- Shrink & Bulk Molding Compounds (SMC/BMC)
- Resin Transfer Molding
- Pultrusion
- Others
- Polyvinyl Acetate (PVAc)
- Polymethyl Methacrylate (PMMA)
- Polystyrene (PS)
- Polyurethane (PU)
- High-density Polyethylene (HDPE)
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Asia Pacific Low Profile Additives Market by Application
Chapter 5. Asia Pacific Low Profile Additives Market by Product
Chapter 6. Asia Pacific Low Profile Additives Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- Wacker Chemie AG
- INEOS Group Holdings S.A.
- BASF SE
- LyondellBasell Industries Holdings B.V.
- Ashland Inc.
- Arkema S.A.
- Evonik Industries AG (RAG-Stiftung)
- Taak Resin Co.
- AOC, LLC
- Synthomer PLC
Methodology
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