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Asia Pacific Next Generation Non-Volatile Memory Market Size, Share & Trends Analysis Report By Type (High-bandwidth Memory (HBM) and Hybrid Memory Cube (HMC)), By Wafer Size (300 mm and 200 mm), By Application, By Country and Growth Forecast, 2024 - 2031

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    Report

  • 133 Pages
  • August 2024
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6004216
The Asia Pacific Next Generation Non-Volatile Memory Market would witness market growth of 17.7% CAGR during the forecast period (2024-2031).

The China market dominated the Asia Pacific Next Generation Non-Volatile Memory Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $2.18 billion by 2031. The Japan market is experiencing a CAGR of 17.1% during 2024-2031. Additionally, the India market would showcase a CAGR of 19% during 2024-2031.



Telecommunications equipment, such as routers and switches, employs NVMs for storing configuration settings and firmware. Their reliability and fast access times are important for maintaining efficient network operations and supporting high-speed data transmission. The rollout of 5G networks benefits from NVMs that can handle the high data throughput and low latency required for advanced telecommunications applications. NVMs support the infrastructure needed to deliver high-speed and reliable 5G connectivity.

The adoption of NVM technologies is accelerating across various sectors due to their superior performance, reliability, and efficiency compared to traditional memory solutions. Several factors drive this growth, each contributing to these advanced technologies' broader acceptance and integration. Next generation NVMs offer significant improvements in data access speeds and processing efficiency. Applications requiring high-speed data retrieval, such as gaming, high-performance computing, and data centres, increasingly rely on these technologies to meet their demanding performance criteria.

The rise in production and consumption of high-end smartphones and wearables in India drives the need for next generation NVM. These devices require fast and reliable memory solutions for high-resolution cameras, complex applications, and extensive data storage. In FY23, domestic electronics production in India was valued at $101 billion, with mobile phones accounting for 43% of this production value. Also, the Indian government’s initiatives to promote electronics manufacturing and semiconductor industries, such as the “Make in India” and “National Policy on Electronics,” foster growth in these sectors. These policies drive investment in next generation NVM technologies as part of the broader push for advanced electronics. In conclusion, the expansion of the consumer electronics industry and the rising telecommunication sector in the region are driving the market's growth.

List of Key Companies Profiled

  • Samsung Electronics Co. Ltd
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Intel Corporation
  • Kingston Technology Company, Inc.
  • Kioxia Holdings Corporation

Market Report Segmentation

By Type

  • High-bandwidth Memory (HBM)
  • Hybrid Memory Cube (HMC)

By Wafer Size

  • 300 mm
  • 200 mm

By Application

  • BFSI
  • Information Technology
  • Consumer Electronics
  • Telecommunications
  • Government
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Taiwan
  • Rest of Asia Pacific

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Next Generation Non-Volatile Memory Market, by Type
1.4.2 Asia Pacific Next Generation Non-Volatile Memory Market, by Wafer Size
1.4.3 Asia Pacific Next Generation Non-Volatile Memory Market, by Application
1.4.4 Asia Pacific Next Generation Non-Volatile Memory Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2023
4.2 Porter Five Forces Analysis
Chapter 5. Asia Pacific Next Generation Non-Volatile Memory Market by Type
5.1 Asia Pacific High-bandwidth Memory (HBM) Market by Country
5.2 Asia Pacific Hybrid Memory Cube (HMC) Market by Country
Chapter 6. Asia Pacific Next Generation Non-Volatile Memory Market by Wafer Size
6.1 Asia Pacific 300 mm Market by Country
6.2 Asia Pacific 200 mm Market by Country
Chapter 7. Asia Pacific Next Generation Non-Volatile Memory Market by Application
7.1 Asia Pacific BFSI Market by Country
7.2 Asia Pacific Information Technology Market by Country
7.3 Asia Pacific Consumer Electronics Market by Country
7.4 Asia Pacific Telecommunications Market by Country
7.5 Asia Pacific Government Market by Country
7.6 Asia Pacific Others Market by Country
Chapter 8. Asia Pacific Next Generation Non-Volatile Memory Market by Country
8.1 China Next Generation Non-Volatile Memory Market
8.1.1 China Next Generation Non-Volatile Memory Market by Type
8.1.2 China Next Generation Non-Volatile Memory Market by Wafer Size
8.1.3 China Next Generation Non-Volatile Memory Market by Application
8.2 Japan Next Generation Non-Volatile Memory Market
8.2.1 Japan Next Generation Non-Volatile Memory Market by Type
8.2.2 Japan Next Generation Non-Volatile Memory Market by Wafer Size
8.2.3 Japan Next Generation Non-Volatile Memory Market by Application
8.3 India Next Generation Non-Volatile Memory Market
8.3.1 India Next Generation Non-Volatile Memory Market by Type
8.3.2 India Next Generation Non-Volatile Memory Market by Wafer Size
8.3.3 India Next Generation Non-Volatile Memory Market by Application
8.4 South Korea Next Generation Non-Volatile Memory Market
8.4.1 South Korea Next Generation Non-Volatile Memory Market by Type
8.4.2 South Korea Next Generation Non-Volatile Memory Market by Wafer Size
8.4.3 South Korea Next Generation Non-Volatile Memory Market by Application
8.5 Singapore Next Generation Non-Volatile Memory Market
8.5.1 Singapore Next Generation Non-Volatile Memory Market by Type
8.5.2 Singapore Next Generation Non-Volatile Memory Market by Wafer Size
8.5.3 Singapore Next Generation Non-Volatile Memory Market by Application
8.6 Taiwan Next Generation Non-Volatile Memory Market
8.6.1 Taiwan Next Generation Non-Volatile Memory Market by Type
8.6.2 Taiwan Next Generation Non-Volatile Memory Market by Wafer Size
8.6.3 Taiwan Next Generation Non-Volatile Memory Market by Application
8.7 Rest of Asia Pacific Next Generation Non-Volatile Memory Market
8.7.1 Rest of Asia Pacific Next Generation Non-Volatile Memory Market by Type
8.7.2 Rest of Asia Pacific Next Generation Non-Volatile Memory Market by Wafer Size
8.7.3 Rest of Asia Pacific Next Generation Non-Volatile Memory Market by Application
Chapter 9. Company Profiles
9.1 Micron Technology, Inc.
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.1 Research & Development Expenses
9.1.2 Recent strategies and developments
9.1.2.1 Product Launches and Product Expansions
9.1.3 SWOT Analysis
9.2 Fujitsu Limited
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments
9.2.5.1 Product Launches and Product Expansions
9.2.6 SWOT Analysis
9.3 ROHM Co., Ltd.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expense
9.3.5 SWOT Analysis
9.4 Kingston Technology Company, Inc.
9.4.1 Company Overview
9.4.2 SWOT Analysis
9.5 Kioxia Holdings Corporation
9.5.1 Company Overview
9.5.2 Financial Analysis
9.6 Samsung Electronics Co., Ltd. (Samsung Group)
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 SWOT Analysis
9.7 Honeywell International, Inc.
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 SWOT Analysis
9.8 Infineon Technologies AG
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expense
9.8.5 Recent strategies and developments
9.8.5.1 Product Launches and Product Expansions
9.8.6 SWOT Analysis
9.9 Toshiba International Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Segmental and Regional Analysis
9.9.4 Research and Development Expense
9.9.5 SWOT Analysis
9.10. Intel Corporation
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis

Companies Mentioned

  • Samsung Electronics Co. Ltd
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Intel Corporation
  • Kingston Technology Company, Inc.
  • Kioxia Holdings Corporation

Methodology

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