The Asia Pacific Semiconductor Bonding Market should witness market growth of 3.8% CAGR during the forecast period (2023-2030).
A semiconductor is a material with essential electric properties that make it useful for producing computers and electronic equipment. In addition, it is a solid substance that conducts electricity under certain conditions. Some profitable semiconductor uses include defense equipment, communications systems, transportation, computing, healthcare, and renewable energy. In semiconductor structures, atoms are bonded to create many integrated circuits and production tools.
Over the forecast period, the increased demand for semiconductor chips with greater efficiency, processing power, and smaller footprints is fueling the demand for these equipment. The impact of digitalization on lives and businesses has caused growth in the market. The market is projected to reach a trillion dollars by 2030, as chip demand is anticipated to increase over the next decade. This growth is largely the result of companies and nations investing heavily in semiconductor manufacturing, materials, and research to ensure a constant supply of chips and expertise to support the expansion of data-centric industries.
India's medical device industries have expanded substantially over the past decade. India produces many medical devices, from consumables to implantable medical devices. The medical devices industry is capital-intensive and requires continuous training of healthcare system providers to accommodate new technologies. On April 26, 2023, the National Medical Devices Policy 2023 was approved by the Union Cabinet. The medical equipment sector in China has grown rapidly during the last five years, with an industry size of 840 billion yuan (about $131.81 billion) in 2020. All these factors will uplift the regional market expansion in upcoming years.
The China market dominated the Asia Pacific Semiconductor Bonding Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $127 million by 2030. The Japan market is poised to grow at a CAGR of 3.1% during (2023-2030). Additionally, India's market should witness a CAGR of 4.4% during (2023-2030).
Based on Application, the market is segmented into LED, Mems & Sensors, RF Devices, CMOS Image Sensors, and 3D NAND. Based on Type, the market is segmented into Wafer Bonder, Die Bonder, and Flip Chip Bonder. Based on Bonding Technology, the market is segmented into Die Bonding Technology, and Wafer Bonding Technology (Direct & Anodic Wafer Bonding, and Indirect Wafer Bonding). Based on Process Type, the market is segmented into Die To Die Bonding, Wafer To Wafer Bonding, and Die To Wafer Bonding. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Mycronic AB, TDK Corporation, EV Group, Panasonic Holdings Corporation, Tokyo Electron Ltd., Mitsubishi Electric Corporation, Intel Corporation, SÜSS MicroTec SE, Fuji Corporation (Fasford Technology Co., Ltd.), Shibuara Mechatronics Corporation
A semiconductor is a material with essential electric properties that make it useful for producing computers and electronic equipment. In addition, it is a solid substance that conducts electricity under certain conditions. Some profitable semiconductor uses include defense equipment, communications systems, transportation, computing, healthcare, and renewable energy. In semiconductor structures, atoms are bonded to create many integrated circuits and production tools.
Over the forecast period, the increased demand for semiconductor chips with greater efficiency, processing power, and smaller footprints is fueling the demand for these equipment. The impact of digitalization on lives and businesses has caused growth in the market. The market is projected to reach a trillion dollars by 2030, as chip demand is anticipated to increase over the next decade. This growth is largely the result of companies and nations investing heavily in semiconductor manufacturing, materials, and research to ensure a constant supply of chips and expertise to support the expansion of data-centric industries.
India's medical device industries have expanded substantially over the past decade. India produces many medical devices, from consumables to implantable medical devices. The medical devices industry is capital-intensive and requires continuous training of healthcare system providers to accommodate new technologies. On April 26, 2023, the National Medical Devices Policy 2023 was approved by the Union Cabinet. The medical equipment sector in China has grown rapidly during the last five years, with an industry size of 840 billion yuan (about $131.81 billion) in 2020. All these factors will uplift the regional market expansion in upcoming years.
The China market dominated the Asia Pacific Semiconductor Bonding Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $127 million by 2030. The Japan market is poised to grow at a CAGR of 3.1% during (2023-2030). Additionally, India's market should witness a CAGR of 4.4% during (2023-2030).
Based on Application, the market is segmented into LED, Mems & Sensors, RF Devices, CMOS Image Sensors, and 3D NAND. Based on Type, the market is segmented into Wafer Bonder, Die Bonder, and Flip Chip Bonder. Based on Bonding Technology, the market is segmented into Die Bonding Technology, and Wafer Bonding Technology (Direct & Anodic Wafer Bonding, and Indirect Wafer Bonding). Based on Process Type, the market is segmented into Die To Die Bonding, Wafer To Wafer Bonding, and Die To Wafer Bonding. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Mycronic AB, TDK Corporation, EV Group, Panasonic Holdings Corporation, Tokyo Electron Ltd., Mitsubishi Electric Corporation, Intel Corporation, SÜSS MicroTec SE, Fuji Corporation (Fasford Technology Co., Ltd.), Shibuara Mechatronics Corporation
Scope of the Study
By Application
- LED
- Mems & Sensors
- RF Devices
- CMOS Image Sensors
- 3D NAND
By Type
- Wafer Bonder
- Die Bonder
- Flip Chip Bonder
By Bonding Technology
- Die Bonding Technology
- Wafer Bonding Technology
- Direct & Anodic Wafer Bonding
- Indirect Wafer Bonding
By Process Type
- Die To Die Bonding
- Wafer To Wafer Bonding
- Die To Wafer Bonding
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Mycronic AB
- TDK Corporation
- EV Group
- Panasonic Holdings Corporation
- Tokyo Electron Ltd.
- Mitsubishi Electric Corporation
- Intel Corporation
- SÜSS MicroTec SE
- Fuji Corporation (Fasford Technology Co., Ltd.)
- Shibuara Mechatronics Corporation
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 5. Asia Pacific Semiconductor Bonding Market by Application
Chapter 6. Asia Pacific Semiconductor Bonding Market by Type
Chapter 7. Asia Pacific Semiconductor Bonding Market by Bonding Technology
Chapter 8. Asia Pacific Semiconductor Bonding Market by Process Type
Chapter 9. Asia Pacific Semiconductor Bonding Market by Country
Chapter 10. Company Profiles
Companies Mentioned
- Mycronic AB
- TDK Corporation
- EV Group
- Panasonic Holdings Corporation
- Tokyo Electron Ltd.
- Mitsubishi Electric Corporation
- Intel Corporation
- SÜSS MicroTec SE
- Fuji Corporation (Fasford Technology Co., Ltd.)
- Shibuara Mechatronics Corporation
Methodology
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