The Asia Pacific Semiconductor Etch Equipment Market would witness market growth of 8.3% CAGR during the forecast period (2023-2030).
In the plasma etching process, the molecular and atomic ions and/or reactive neutrals from plasma can be utilized to remove material from the substrate by either physical or chemical pathways or even by mechanisms that employ both. Purely physical etching is accomplished by utilizing robust electric fields to speed up the positive atomic ions (generally an ion of a heavy inert element such as argon) towards the substrate.
This acceleration impacts energy to the ions, and their internal energy is transferred to the atoms in the substrate when they impact its surface. If sufficient energy is transferred, a substrate atom will be ejected into the gas phase and pumped away by the vacuum system. In the collision, the incident ion is neutralized, and as it is gas, it desorbs into the gas phase to be re-ionized or pumped out of the system.
The Chinese government’s financial support contains funding from government guidance funds, streamlined bond & equity listings, and technology & IP insurance. The Chinese government has channelled around $150 billion to China’s semiconductor industry and has allocated $1.4 trillion for strategic initiatives, including semiconductors, in their 14th five-year plan. These new measures are expected to widen the door for international firms to obtain Chinese state funding and other financial preferences, including access to debt markets and domestic capital. Government assistance to enhance the semiconductor market and attract more foreign investments will surge the semiconductor etch equipment market in the region. These elements are assisting the market's expansion in the region.
The China market dominated the Asia Pacific Semiconductor Etch Equipment Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $6,119.8 million by 2030. The Japan market is exhibiting a CAGR of 7.5% during (2023 - 2030). Additionally, The India market would experience a CAGR of 9.3% during (2023 - 2030).
Based on Type, the market is segmented into Dry and Wet. Based on Process, the market is segmented into Conductor and Dielectric. Based on End User, the market is segmented into Integrated Device Manufacturers, Foundry and Memory Manufacturers. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation), ULVAC, Inc., Hitachi High-Tech Corporation (Hitachi, Ltd.), Tokyo Electron Ltd., Applied Materials, Inc., SPTS Technologies Ltd. (KLA Corporation), ASML Holding N.V., Samco, Inc., EV Group, Suzhou Delphi Laser Co., Ltd and Lam Research Corporation.
In the plasma etching process, the molecular and atomic ions and/or reactive neutrals from plasma can be utilized to remove material from the substrate by either physical or chemical pathways or even by mechanisms that employ both. Purely physical etching is accomplished by utilizing robust electric fields to speed up the positive atomic ions (generally an ion of a heavy inert element such as argon) towards the substrate.
This acceleration impacts energy to the ions, and their internal energy is transferred to the atoms in the substrate when they impact its surface. If sufficient energy is transferred, a substrate atom will be ejected into the gas phase and pumped away by the vacuum system. In the collision, the incident ion is neutralized, and as it is gas, it desorbs into the gas phase to be re-ionized or pumped out of the system.
The Chinese government’s financial support contains funding from government guidance funds, streamlined bond & equity listings, and technology & IP insurance. The Chinese government has channelled around $150 billion to China’s semiconductor industry and has allocated $1.4 trillion for strategic initiatives, including semiconductors, in their 14th five-year plan. These new measures are expected to widen the door for international firms to obtain Chinese state funding and other financial preferences, including access to debt markets and domestic capital. Government assistance to enhance the semiconductor market and attract more foreign investments will surge the semiconductor etch equipment market in the region. These elements are assisting the market's expansion in the region.
The China market dominated the Asia Pacific Semiconductor Etch Equipment Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $6,119.8 million by 2030. The Japan market is exhibiting a CAGR of 7.5% during (2023 - 2030). Additionally, The India market would experience a CAGR of 9.3% during (2023 - 2030).
Based on Type, the market is segmented into Dry and Wet. Based on Process, the market is segmented into Conductor and Dielectric. Based on End User, the market is segmented into Integrated Device Manufacturers, Foundry and Memory Manufacturers. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation), ULVAC, Inc., Hitachi High-Tech Corporation (Hitachi, Ltd.), Tokyo Electron Ltd., Applied Materials, Inc., SPTS Technologies Ltd. (KLA Corporation), ASML Holding N.V., Samco, Inc., EV Group, Suzhou Delphi Laser Co., Ltd and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Type- Dry
- Wet
- Conductor
- Dielectric
- Integrated Device Manufacturers
- Foundry
- Memory Manufacturers
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
- ULVAC, Inc.
- Hitachi High-Tech Corporation (Hitachi, Ltd.)
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- SPTS Technologies Ltd. (KLA Corporation)
- ASML Holding N.V.
- Samco, Inc.
- EV Group
- Suzhou Delphi Laser Co., Ltd.
- Lam Research Corporation
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 5. Asia Pacific Semiconductor Etch Equipment Market, By Type
Chapter 6. Asia Pacific Semiconductor Etch Equipment Market, By Process
Chapter 7. Asia Pacific Semiconductor Etch Equipment Market, By End User
Chapter 8. Asia Pacific Semiconductor Etch Equipment Market, By Country
Chapter 9. Company Profiles
Companies Mentioned
- Oracle Corporation
- Trilliant Holdings, Inc.
- Itron, Inc.
- Arad Group
- Siemens AG
- ABB Group
- Honeywell International, Inc.
- Eaton Corporation PLC
- Hubbell Incorporated
- Hansen Technologies, Ltd.
Methodology
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