The Asia Pacific Wafer Cleaning Equipment Market would witness market growth of 9.8% CAGR during the forecast period (2023-2030). In the year 2021, the Asia Pacific market's volume surged to 164.4 thousand units, showcasing a growth of 9.7% (2019-2022).
A wafer is a thin slice or base made from a semiconducting substance essential in electronics to fabricate integrated circuits (ICs). These wafers are meticulously produced utilizing silicon and pure, fault-free materials. Before being incorporated into devices, these wafers endure a thorough chemical cleaning. There are numerous alternatives for automated, semi-automated, and manual wafer cleaning equipment, including single-wafer cryogenic systems, batch immersion cleaning systems, batch spray cleaning systems, and scrubbers. The choice of cleaning apparatus depends on variables, including wafer size, the nature of contaminants, throughput requirements, and the device configurations.
Removing contaminants from the wafer's surface during cleaning improves their suitability for semiconductor devices. These wafer-cleaning tools are used to clean printed circuit boards (PCBs), read/write heads for hard disk drives, photomasks, MEMS, silicon wafers, flat-panel displays, and compound semiconductor device wafers. Wafers are in significant demand across various industries, including MEMS, CIS, memory, RF devices, LEDs, interposers, and logic. To undertake thorough and effective wafer fabrication and cleaning processes, wafer cleaning equipment is increasingly adopted as demand for wafers increases.
The rapid expansion of telecommunications networks, including deploying 4G and 5G infrastructure, relies on semiconductor technology. Asia Pacific nations are at the forefront of 5G adoption. The widespread hastion of 5G technology, the rising popularity of cryptocurrency mining, which requires a greater number of processing units, and the government's persistent efforts toward digitalization have all contributed to an increase in the demand for semiconductors in recent years. As the region continues to innovate and invest in semiconductor capabilities, its role in shaping the future of semiconductor technology remains significant. As a result of the rising semiconductor industry in Asia Pacific region, the market is expected to grow.
The China market dominated the Asia Pacific Wafer Cleaning Equipment Market, by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $2,063.9 million by 2030. The Japan market is anticipated to grow at a CAGR of 9.1% during (2023 - 2030). Additionally, The India market would showcase a CAGR of 10.4% during (2023 - 2030).
Based on Equipment Type, the market is segmented into Batch Spray Cleaning System, Batch Immersion Cleaning System, Single Wafer Cryogenic System, Single Wafer Spray System, and Scrubbers. Based on Application, the market is segmented into Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others. Based on Wafer Size, the market is segmented into 300 mm, 200 mm and Less than Equals 150 mm. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Tokyo Electron Ltd., SCREEN Holdings Co., Ltd., Applied Materials, Inc., Lam Research Corporation, Veeco Instruments, Inc., Axus Technology, Entegris, Inc. (Sumitomo Mitsui Financial Group), SEMES Co., Ltd. (Samsung Electronics Co., Ltd), Ultron Systems, Inc., and Toho Technology Co., Ltd.
A wafer is a thin slice or base made from a semiconducting substance essential in electronics to fabricate integrated circuits (ICs). These wafers are meticulously produced utilizing silicon and pure, fault-free materials. Before being incorporated into devices, these wafers endure a thorough chemical cleaning. There are numerous alternatives for automated, semi-automated, and manual wafer cleaning equipment, including single-wafer cryogenic systems, batch immersion cleaning systems, batch spray cleaning systems, and scrubbers. The choice of cleaning apparatus depends on variables, including wafer size, the nature of contaminants, throughput requirements, and the device configurations.
Removing contaminants from the wafer's surface during cleaning improves their suitability for semiconductor devices. These wafer-cleaning tools are used to clean printed circuit boards (PCBs), read/write heads for hard disk drives, photomasks, MEMS, silicon wafers, flat-panel displays, and compound semiconductor device wafers. Wafers are in significant demand across various industries, including MEMS, CIS, memory, RF devices, LEDs, interposers, and logic. To undertake thorough and effective wafer fabrication and cleaning processes, wafer cleaning equipment is increasingly adopted as demand for wafers increases.
The rapid expansion of telecommunications networks, including deploying 4G and 5G infrastructure, relies on semiconductor technology. Asia Pacific nations are at the forefront of 5G adoption. The widespread hastion of 5G technology, the rising popularity of cryptocurrency mining, which requires a greater number of processing units, and the government's persistent efforts toward digitalization have all contributed to an increase in the demand for semiconductors in recent years. As the region continues to innovate and invest in semiconductor capabilities, its role in shaping the future of semiconductor technology remains significant. As a result of the rising semiconductor industry in Asia Pacific region, the market is expected to grow.
The China market dominated the Asia Pacific Wafer Cleaning Equipment Market, by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $2,063.9 million by 2030. The Japan market is anticipated to grow at a CAGR of 9.1% during (2023 - 2030). Additionally, The India market would showcase a CAGR of 10.4% during (2023 - 2030).
Based on Equipment Type, the market is segmented into Batch Spray Cleaning System, Batch Immersion Cleaning System, Single Wafer Cryogenic System, Single Wafer Spray System, and Scrubbers. Based on Application, the market is segmented into Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others. Based on Wafer Size, the market is segmented into 300 mm, 200 mm and Less than Equals 150 mm. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Tokyo Electron Ltd., SCREEN Holdings Co., Ltd., Applied Materials, Inc., Lam Research Corporation, Veeco Instruments, Inc., Axus Technology, Entegris, Inc. (Sumitomo Mitsui Financial Group), SEMES Co., Ltd. (Samsung Electronics Co., Ltd), Ultron Systems, Inc., and Toho Technology Co., Ltd.
Scope of the Study
Market Segments Covered in the Report:
By Equipment Type (Volume, Thousand units, USD Million, 2019-2030)- Batch Spray Cleaning System
- Batch Immersion Cleaning System
- Single Wafer Cryogenic System
- Single Wafer Spray System
- Scrubbers
- Memory
- Interposer
- MEMS
- Logic
- CIS
- LED
- RF Device
- Others
- 300 mm
- 200 mm
- Less than Equals 150 mm
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Tokyo Electron Ltd.
- SCREEN Holdings Co., Ltd
- Applied Materials, Inc.
- Lam Research Corporation
- Veeco Instruments, Inc.
- Axus Technology
- Entegris, Inc. (Sumitomo Mitsui Financial Group)
- SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
- Ultron Systems, Inc.
- Toho Technology Co., Ltd.
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. Asia Pacific Wafer Cleaning Equipment Market, by Equipment Type
Chapter 6. Asia Pacific Wafer Cleaning Equipment Market, by Application
Chapter 7. Asia Pacific Wafer Cleaning Equipment Market, by Wafer Size
Chapter 8. Asia Pacific Wafer Cleaning Equipment Market, by Country
Chapter 9. Company Profiles
Companies Mentioned
- Tokyo Electron Ltd.
- SCREEN Holdings Co., Ltd
- Applied Materials, Inc.
- Lam Research Corporation
- Veeco Instruments, Inc.
- Axus Technology
- Entegris, Inc. (Sumitomo Mitsui Financial Group)
- SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
- Ultron Systems, Inc.
- Toho Technology Co., Ltd.
Methodology
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