The Asia Pacific Automotive Sensor Fusion Market would witness market growth of 23.3% CAGR during the forecast period (2022-2028).
One of the most important technologies for improving the precision and speed of the detection process in all weather conditions is sensor fusion. The perception algorithm's accuracy can be improved when one of the sensors is less effective than when we combine several sensors. In many nations, the semi-autonomous car is well developed.
One of the technologies that makes self-driving cars possible is sensor fusion. Active vehicle safety systems, both present and future, heavily rely on the fusion of sensor data. Without the application of more advanced signal processing techniques, such as data fusion approaches, the development of more advanced sensors is not complete.
Standalone sensors are unable to overcome several physical restrictions, such as those related to range and field of vision. Therefore, combining data from many sensors expands the region around the vehicle that is monitored by the sensors and improves the system's overall reliability in the event of sensor failure.
The PLI Scheme for the Auto Sector aims to remove the cost barriers that the industry faces when producing items utilizing Advanced Automotive Technology in India. The incentive system will encourage businesses to make new investments in the domestic supply chain for items utilizing advanced automotive technology. The PLI Scheme for the Automobile and Auto Components Industry is anticipated to generate new investments and increase employment possibilities over the course of five years. Existing automotive companies, as well as new non-automotive investor companies, are welcome to participate in the PLI Scheme for the auto sector. The Champion OEM Incentive Scheme and Component Champion Incentive Scheme are the two halves of the scheme. All these initiatives of governments of regional nations are predicted to support the growth of the regional automotive sensor fusion market.
The China market dominated the Asia Pacific Automotive Sensor Fusion Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $787.1 Million by 2028. The Japan market is estimated to grow a CAGR of 22.5% during (2022 - 2028). Additionally, The India market would experience a CAGR of 24% during (2022 - 2028).
Based on Propulsion Type, the market is segmented into ICE, BEV, and HEV. Based on Vehicle Type, the market is segmented into Passenger Cars, Light Commercial Vehicles, and Heavy Commercial Vehicles. Based on Technology, the market is segmented into IMU, Image Sensors, Radar Sensors, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include NVIDIA Corporation, NXP Semiconductors N.V., Robert Bosch GmbH, TE Connectivity Ltd., Infineon Technologies AG, ZF Friedrichshafen AG, TDK Corporation, STMicroelectronics N.V., Aptiv PLC, and Texas Instruments, Inc.
One of the most important technologies for improving the precision and speed of the detection process in all weather conditions is sensor fusion. The perception algorithm's accuracy can be improved when one of the sensors is less effective than when we combine several sensors. In many nations, the semi-autonomous car is well developed.
One of the technologies that makes self-driving cars possible is sensor fusion. Active vehicle safety systems, both present and future, heavily rely on the fusion of sensor data. Without the application of more advanced signal processing techniques, such as data fusion approaches, the development of more advanced sensors is not complete.
Standalone sensors are unable to overcome several physical restrictions, such as those related to range and field of vision. Therefore, combining data from many sensors expands the region around the vehicle that is monitored by the sensors and improves the system's overall reliability in the event of sensor failure.
The PLI Scheme for the Auto Sector aims to remove the cost barriers that the industry faces when producing items utilizing Advanced Automotive Technology in India. The incentive system will encourage businesses to make new investments in the domestic supply chain for items utilizing advanced automotive technology. The PLI Scheme for the Automobile and Auto Components Industry is anticipated to generate new investments and increase employment possibilities over the course of five years. Existing automotive companies, as well as new non-automotive investor companies, are welcome to participate in the PLI Scheme for the auto sector. The Champion OEM Incentive Scheme and Component Champion Incentive Scheme are the two halves of the scheme. All these initiatives of governments of regional nations are predicted to support the growth of the regional automotive sensor fusion market.
The China market dominated the Asia Pacific Automotive Sensor Fusion Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $787.1 Million by 2028. The Japan market is estimated to grow a CAGR of 22.5% during (2022 - 2028). Additionally, The India market would experience a CAGR of 24% during (2022 - 2028).
Based on Propulsion Type, the market is segmented into ICE, BEV, and HEV. Based on Vehicle Type, the market is segmented into Passenger Cars, Light Commercial Vehicles, and Heavy Commercial Vehicles. Based on Technology, the market is segmented into IMU, Image Sensors, Radar Sensors, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include NVIDIA Corporation, NXP Semiconductors N.V., Robert Bosch GmbH, TE Connectivity Ltd., Infineon Technologies AG, ZF Friedrichshafen AG, TDK Corporation, STMicroelectronics N.V., Aptiv PLC, and Texas Instruments, Inc.
Scope of the Study
Market Segments Covered in the Report:
By Propulsion Type
- ICE
- BEV
- HEV
By Vehicle Type
- Passenger Cars
- Light Commercial Vehicles
- Heavy Commercial Vehicles
By Technology
- IMU
- Image Sensors
- Radar Sensors
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- NVIDIA Corporation
- NXP Semiconductors N.V
- Robert Bosch GmbH
- TE Connectivity Ltd
- Infineon Technologies AG
- ZF Friedrichshafen AG
- TDK Corporation
- STMicroelectronics N.V
- Aptiv PLC
- Texas Instruments, Inc
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Automotive Sensor Fusion Market, by Propulsion Type
1.4.2 Asia Pacific Automotive Sensor Fusion Market, by Vehicle Type
1.4.3 Asia Pacific Automotive Sensor Fusion Market, by Technology
1.4.4 Asia Pacific Automotive Sensor Fusion Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 KBV Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2018-2022)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2019, Oct - 2022, Nov) Leading Players
Chapter 4. Asia Pacific Automotive Sensor Fusion Market by Propulsion Type
4.1 Asia Pacific ICE Market by Country
4.2 Asia Pacific BEV Market by Country
4.3 Asia Pacific HEV Market by Country
Chapter 5. Asia Pacific Automotive Sensor Fusion Market by Vehicle Type
5.1 Asia Pacific Passenger Cars Market by Country
5.2 Asia Pacific Light Commercial Vehicles Market by Country
5.3 Asia Pacific Heavy Commercial Vehicles Market by Country
Chapter 6. Asia Pacific Automotive Sensor Fusion Market by Technology
6.1 Asia Pacific IMU Market by Country
6.2 Asia Pacific Image Sensors Market by Country
6.3 Asia Pacific Radar Sensors Market by Country
6.4 Asia Pacific Others Market by Country
Chapter 7. Asia Pacific Automotive Sensor Fusion Market by Country
7.1 China Automotive Sensor Fusion Market
7.1.1 China Automotive Sensor Fusion Market by Propulsion Type
7.1.2 China Automotive Sensor Fusion Market by Vehicle Type
7.1.3 China Automotive Sensor Fusion Market by Technology
7.2 Japan Automotive Sensor Fusion Market
7.2.1 Japan Automotive Sensor Fusion Market by Propulsion Type
7.2.2 Japan Automotive Sensor Fusion Market by Vehicle Type
7.2.3 Japan Automotive Sensor Fusion Market by Technology
7.3 India Automotive Sensor Fusion Market
7.3.1 India Automotive Sensor Fusion Market by Propulsion Type
7.3.2 India Automotive Sensor Fusion Market by Vehicle Type
7.3.3 India Automotive Sensor Fusion Market by Technology
7.4 South Korea Automotive Sensor Fusion Market
7.4.1 South Korea Automotive Sensor Fusion Market by Propulsion Type
7.4.2 South Korea Automotive Sensor Fusion Market by Vehicle Type
7.4.3 South Korea Automotive Sensor Fusion Market by Technology
7.5 Singapore Automotive Sensor Fusion Market
7.5.1 Singapore Automotive Sensor Fusion Market by Propulsion Type
7.5.2 Singapore Automotive Sensor Fusion Market by Vehicle Type
7.5.3 Singapore Automotive Sensor Fusion Market by Technology
7.6 Malaysia Automotive Sensor Fusion Market
7.6.1 Malaysia Automotive Sensor Fusion Market by Propulsion Type
7.6.2 Malaysia Automotive Sensor Fusion Market by Vehicle Type
7.6.3 Malaysia Automotive Sensor Fusion Market by Technology
7.7 Rest of Asia Pacific Automotive Sensor Fusion Market
7.7.1 Rest of Asia Pacific Automotive Sensor Fusion Market by Propulsion Type
7.7.2 Rest of Asia Pacific Automotive Sensor Fusion Market by Vehicle Type
7.7.3 Rest of Asia Pacific Automotive Sensor Fusion Market by Technology
Chapter 8. Company Profiles
8.1 NVIDIA Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 NXP Semiconductors N.V.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments:
8.2.5.1 Partnerships, Collaborations, and Agreements:
8.2.5.2 Product Launches and Product Expansions:
8.2.6 SWOT Analysis
8.3 Robert Bosch GmbH
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expense
8.3.5 Recent strategies and developments:
8.3.5.1 Partnerships, Collaborations, and Agreements:
8.3.5.2 Acquisition and Mergers:
8.3.6 SWOT Analysis
8.4 TE Connectivity Ltd.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Infineon Technologies AG
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments:
8.5.5.1 Partnerships, Collaborations, and Agreements:
8.5.5.2 Product Launches and Product Expansions:
8.6 ZF Friedrichshafen AG
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Regional Analysis
8.6.4 Research & Development Expenses
8.6.5 Recent strategies and developments:
8.6.5.1 Partnerships, Collaborations, and Agreements:
8.6.5.2 Product Launches and Product Expansions:
8.7 TDK Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Regional & Segmental Analysis
8.7.4 Research & Development Expenses
8.7.5 Recent strategies and developments:
8.7.5.1 Product Launches and Product Expansions:
8.8 STMicroelectronics N.V.
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 Recent strategies and developments:
8.8.5.1 Partnerships, Collaborations, and Agreements:
8.8.5.2 Product Launches and Product Expansions:
8.9 Aptiv PLC
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 Recent strategies and developments:
8.9.5.1 Product Launches and Product Expansions:
8.9.5.2 Acquisition and Mergers:
8.10. Texas Instruments, Inc.
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Segmental and Regional Analysis
8.10.4 Research & Development Expense
Companies Mentioned
- NVIDIA Corporation
- NXP Semiconductors N.V.
- Robert Bosch GmbH
- TE Connectivity Ltd.
- Infineon Technologies AG
- ZF Friedrichshafen AG
- TDK Corporation
- STMicroelectronics N.V.
- Aptiv PLC
- Texas Instruments, Inc.
Methodology
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