The Asia Pacific Solid State Cooling Market would witness market growth of 13.7% CAGR during the forecast period (2024-2031).
The China market dominated the Asia Pacific Solid State Cooling Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $205.1 million by 2031. The Japan market is registering a CAGR of 12.8% during (2024 - 2031). Additionally, The India market would experience a CAGR of 14.4% during (2024 - 2031).
The solid-state cooling market also benefits from advancements in materials science and manufacturing processes. Manufacturers and researchers persistently endeavor to improve the efficiency as well as performance of solid-state cooling devices through the development of innovative materials and processes. These advancements have led to developing more efficient and reliable solid-state cooling solutions, further driving the market's growth.
Environmental regulations to reduce greenhouse gas emissions drive the adoption of environmentally friendly cooling solutions. Traditional cooling systems, such as air conditioners and refrigerators, often rely on refrigerants that can significantly impact the environment. Refrigerants, including hydrochlorofluorocarbons (HCFCs) or hydrofluorocarbons (HFCs), contribute significantly to ozone depletion and global warming as potent greenhouse gases.
With the expansion of the semiconductor industry in China, there is a rising demand for thermoelectric cooling solutions to manage heat dissipation in electronic devices and semiconductor components. As per the State Council of the People's Republic of China, China's integrated circuit industry registered stable growth in 2021, with its sales exceeding 1 trillion yuan (about $158 billion). Hence, the increasing electronics and rising semiconductor industry in the region is propelling the growth of the market.
Based on Product, the market is segmented into Cooling Systems and Refrigeration Systems. Based on Type, the market is segmented into Single-Stage, Multi-Stage, and Thermocycler. Based on Technology, the market is segmented into Thermoelectric Cooling, Electrocaloric Cooling, Magnetocaloric Cooling and Others. Based on Vertical, the market is segmented into Healthcare, Semiconductor & Electronics, Automotive, Residential and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The China market dominated the Asia Pacific Solid State Cooling Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $205.1 million by 2031. The Japan market is registering a CAGR of 12.8% during (2024 - 2031). Additionally, The India market would experience a CAGR of 14.4% during (2024 - 2031).
The solid-state cooling market also benefits from advancements in materials science and manufacturing processes. Manufacturers and researchers persistently endeavor to improve the efficiency as well as performance of solid-state cooling devices through the development of innovative materials and processes. These advancements have led to developing more efficient and reliable solid-state cooling solutions, further driving the market's growth.
Environmental regulations to reduce greenhouse gas emissions drive the adoption of environmentally friendly cooling solutions. Traditional cooling systems, such as air conditioners and refrigerators, often rely on refrigerants that can significantly impact the environment. Refrigerants, including hydrochlorofluorocarbons (HCFCs) or hydrofluorocarbons (HFCs), contribute significantly to ozone depletion and global warming as potent greenhouse gases.
With the expansion of the semiconductor industry in China, there is a rising demand for thermoelectric cooling solutions to manage heat dissipation in electronic devices and semiconductor components. As per the State Council of the People's Republic of China, China's integrated circuit industry registered stable growth in 2021, with its sales exceeding 1 trillion yuan (about $158 billion). Hence, the increasing electronics and rising semiconductor industry in the region is propelling the growth of the market.
Based on Product, the market is segmented into Cooling Systems and Refrigeration Systems. Based on Type, the market is segmented into Single-Stage, Multi-Stage, and Thermocycler. Based on Technology, the market is segmented into Thermoelectric Cooling, Electrocaloric Cooling, Magnetocaloric Cooling and Others. Based on Vertical, the market is segmented into Healthcare, Semiconductor & Electronics, Automotive, Residential and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
List of Key Companies Profiled
- Crystal Ltd.
- CUI Devices (Back Porch International, Inc.)
- Delta Electronics, Inc.
- Ferrotec Holdings Corporation
- Coherent Corp.
- Komatsu Ltd.
- Laird Thermal Systems, Inc.
- Solid State Cooling Systems, Inc.
- TE Technology, Inc.
- TEC Microsystems GmbH
Market Report Segmentation
By Product- Cooling Systems
- Refrigeration Systems
- Single-Stage
- Multi-Stage
- Thermocycler
- Thermoelectric Cooling
- Electrocaloric Cooling
- Magnetocaloric Cooling
- Others
- Healthcare
- Semiconductor & Electronics
- Automotive
- Residential
- Others
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Asia Pacific Solid State Cooling Market by Product
Chapter 5. Asia Pacific Solid State Cooling Market by Type
Chapter 6. Asia Pacific Solid State Cooling Market by Technology
Chapter 7. Asia Pacific Solid State Cooling Market by Vertical
Chapter 8. Asia Pacific Solid State Cooling Market by Country
Chapter 9. Company Profiles
Companies Mentioned
- Crystal Ltd.
- CUI Devices (Back Porch International, Inc.)
- Delta Electronics, Inc.
- Ferrotec Holdings Corporation
- Coherent Corp.
- Komatsu Ltd.
- Laird Thermal Systems, Inc.
- Solid State Cooling Systems, Inc.
- TE Technology, Inc.
- TEC Microsystems GmbH
Methodology
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