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Asia Pacific Thermal Management Technologies Market Size, Share & Trends Analysis Report By Material (Adhesive Material, and Non-adhesive Material), By Device, By Service, By End-use, By Country and Growth Forecast, 2024 - 2031

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    Report

  • 161 Pages
  • September 2024
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6007548
The Asia Pacific Thermal Management Technologies Market would witness market growth of 10.4% CAGR during the forecast period (2024-2031).

The China market dominated the Asia Pacific Thermal Management Technologies Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $2.21 billion by 2031. The Japan market is showcasing a CAGR of 9.8% during (2024 - 2031). Additionally, The India market would register a CAGR of 11.2% during (2024 - 2031).



The thermal management technologies market is also being significantly influenced by technological advancements. Carbon nanotubes, graphene, and advanced ceramics are among the new materials that are being developed to enhance thermal conductivity and efficacy.

Additionally, innovations in cooling systems, such as liquid immersion cooling, microchannel cooling, and heat recovery systems, are providing more efficient and effective ways to manage heat. Integrating artificial intelligence and machine learning into thermal management systems is also becoming more common, allowing smarter, more adaptive cooling solutions to optimize real-time performance. These advancements will drive market growth and open new opportunities for thermal management technology companies.

The Asia Pacific region has become a hub for data center expansion, which has resulted in a surge in the demand for thermal management technologies in numerous countries. China is experiencing a significant surge in the demand for thermal management technologies, driven by the rapid expansion of its service and data center sector. According to the data from the Chinese government, by the end of 2023, the scale of computing power across more than 2,200 computing centers nationwide had grown by approximately 30 percent year on year. Consequently, cooling systems will become critical to managing the heat generated by massive server farms.

Based on Material, the market is segmented into Adhesive Material, and Non-adhesive Material. Based on Device, the market is segmented into Conduction Cooling Device, Convection Cooling Devices, Advanced Cooling Devices, and Other Device. Based on Service, the market is segmented into Installation & Calibration, and Optimization & Post Sales Service. Based on End-use, the market is segmented into Consumer Electronics, Service & Data Centers, Automotive, Healthcare, and Other End-use. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

List of Key Companies Profiled

  • Schneider Electric SE
  • Delta Electronics, Inc.
  • Honeywell International Inc.
  • Siemens AG
  • STMicroelectronics N.V.
  • 3M Company
  • Vertiv Holdings Co.
  • Eaton Corporation plc
  • ANSYS, Inc.
  • Parker Hannifin Corporation

Market Report Segmentation

By Material

  • Adhesive Material
  • Non-adhesive Material

By Device

  • Conduction Cooling Device
  • Convection Cooling Devices
  • Advanced Cooling Devices
  • Other Device

By Service

  • Installation & Calibration
  • Optimization & Post Sales Service

By End-use

  • Consumer Electronics
  • Service & Data Centers
  • Automotive
  • Healthcare
  • Other End-use

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Thermal Management Technologies Market, by Material
1.4.2 Asia Pacific Thermal Management Technologies Market, by Device
1.4.3 Asia Pacific Thermal Management Technologies Market, by Service
1.4.4 Asia Pacific Thermal Management Technologies Market, by End-use
1.4.5 Asia Pacific Thermal Management Technologies Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 KBV Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.2.4 Geographical Expansion
4.3 Market Share Analysis, 2023
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2020-2024)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions: 2021, Jun - 2024, Jul) Leading Players
4.5 Porter Five Forces Analysis
Chapter 5. Asia Pacific Thermal Management Technologies Market by Material
5.1 Asia Pacific Adhesive Material Market by Country
5.2 Asia Pacific Non-adhesive Material Market by Country
Chapter 6. Asia Pacific Thermal Management Technologies Market by Device
6.1 Asia Pacific Conduction Cooling Device Market by Country
6.2 Asia Pacific Convection Cooling Devices Market by Country
6.3 Asia Pacific Advanced Cooling Devices Market by Country
6.4 Asia Pacific Other Device Market by Country
Chapter 7. Asia Pacific Thermal Management Technologies Market by Service
7.1 Asia Pacific Installation & Calibration Market by Country
7.2 Asia Pacific Optimization & Post Sales Service Market by Country
Chapter 8. Asia Pacific Thermal Management Technologies Market by End-use
8.1 Asia Pacific Consumer Electronics Market by Country
8.2 Asia Pacific Service & Data Centers Market by Country
8.3 Asia Pacific Automotive Market by Country
8.4 Asia Pacific Healthcare Market by Country
8.5 Asia Pacific Other End-use Market by Country
Chapter 9. Asia Pacific Thermal Management Technologies Market by Country
9.1 China Thermal Management Technologies Market
9.1.1 China Thermal Management Technologies Market by Material
9.1.2 China Thermal Management Technologies Market by Device
9.1.3 China Thermal Management Technologies Market by Service
9.1.4 China Thermal Management Technologies Market by End-use
9.2 Japan Thermal Management Technologies Market
9.2.1 Japan Thermal Management Technologies Market by Material
9.2.2 Japan Thermal Management Technologies Market by Device
9.2.3 Japan Thermal Management Technologies Market by Service
9.2.4 Japan Thermal Management Technologies Market by End-use
9.3 India Thermal Management Technologies Market
9.3.1 India Thermal Management Technologies Market by Material
9.3.2 India Thermal Management Technologies Market by Device
9.3.3 India Thermal Management Technologies Market by Service
9.3.4 India Thermal Management Technologies Market by End-use
9.4 South Korea Thermal Management Technologies Market
9.4.1 South Korea Thermal Management Technologies Market by Material
9.4.2 South Korea Thermal Management Technologies Market by Device
9.4.3 South Korea Thermal Management Technologies Market by Service
9.4.4 South Korea Thermal Management Technologies Market by End-use
9.5 Singapore Thermal Management Technologies Market
9.5.1 Singapore Thermal Management Technologies Market by Material
9.5.2 Singapore Thermal Management Technologies Market by Device
9.5.3 Singapore Thermal Management Technologies Market by Service
9.5.4 Singapore Thermal Management Technologies Market by End-use
9.6 Malaysia Thermal Management Technologies Market
9.6.1 Malaysia Thermal Management Technologies Market by Material
9.6.2 Malaysia Thermal Management Technologies Market by Device
9.6.3 Malaysia Thermal Management Technologies Market by Service
9.6.4 Malaysia Thermal Management Technologies Market by End-use
9.7 Rest of Asia Pacific Thermal Management Technologies Market
9.7.1 Rest of Asia Pacific Thermal Management Technologies Market by Material
9.7.2 Rest of Asia Pacific Thermal Management Technologies Market by Device
9.7.3 Rest of Asia Pacific Thermal Management Technologies Market by Service
9.7.4 Rest of Asia Pacific Thermal Management Technologies Market by End-use
Chapter 10. Company Profiles
10.1 Schneider Electric SE
10.1.1 Company Overview
10.1.2 Financial Analysis
10.1.3 Segmental and Regional Analysis
10.1.4 Research & Development Expense
10.1.5 Recent strategies and developments:
10.1.5.1 Geographical Expansions:
10.1.6 SWOT Analysis
10.2 Delta Electronics, Inc.
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Research & Development Expenses
10.2.5 Recent strategies and developments:
10.2.5.1 Partnerships, Collaborations, and Agreements:
10.2.5.2 Product Launches and Product Expansions:
10.2.5.3 Acquisition and Mergers:
10.2.5.4 Geographical Expansions:
10.3 Honeywell International, Inc.
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Segmental and Regional Analysis
10.3.4 Research & Development Expenses
10.3.5 Recent strategies and developments:
10.3.5.1 Partnerships, Collaborations, and Agreements:
10.3.5.2 Product Launches and Product Expansions:
10.3.5.3 Acquisition and Mergers:
10.3.6 SWOT Analysis
10.4 Siemens AG
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Segmental and Regional Analysis
10.4.4 Research & Development Expense
10.4.5 Recent strategies and developments:
10.4.5.1 Product Launches and Product Expansions:
10.4.6 SWOT Analysis
10.5 STMicroelectronics N.V.
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Segmental and Regional Analysis
10.5.4 Research & Development Expenses
10.5.5 SWOT Analysis
10.6 3M Company
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Segmental and Regional Analysis
10.6.4 Research & Development Expense
10.6.5 Recent strategies and developments:
10.6.5.1 Product Launches and Product Expansions:
10.6.6 SWOT Analysis
10.7 Vertiv Holdings Co.
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Regional Analysis
10.7.4 Recent strategies and developments:
10.7.4.1 Partnerships, Collaborations, and Agreements:
10.7.4.2 Product Launches and Product Expansions:
10.7.4.3 Acquisition and Mergers:
10.7.4.4 Geographical Expansions:
10.8 Eaton Corporation PLC
10.8.1 Company Overview
10.8.2 Financial Analysis
10.8.3 Segmental and Regional Analysis
10.8.4 Research & Development Expense
10.8.5 Recent strategies and developments:
10.8.5.1 Partnerships, Collaborations, and Agreements:
10.8.5.2 Acquisition and Mergers:
10.8.6 SWOT Analysis
10.9 ANSYS, Inc.
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 Regional Analysis
10.9.4 Research & Development Expenses
10.9.5 Recent strategies and developments:
10.9.5.1 Partnerships, Collaborations, and Agreements:
10.9.6 SWOT Analysis
10.10. Parker Hannifin Corporation
10.10.1 Company Overview
10.10.2 Financial Analysis
10.10.3 Segmental and Regional Analysis
10.10.4 Research & Development Expenses
10.10.5 Recent strategies and developments:
10.10.5.1 Product Launches and Product Expansions:
10.10.5.2 Acquisition and Mergers:
10.10.6 SWOT Analysis

Companies Mentioned

  • Schneider Electric SE
  • Delta Electronics, Inc.
  • Honeywell International Inc.
  • Siemens AG
  • STMicroelectronics N.V.
  • 3M Company
  • Vertiv Holdings Co.
  • Eaton Corporation plc
  • ANSYS, Inc.
  • Parker Hannifin Corporation

Methodology

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