DRAM Module and Component Global Market Report 2024

The dram module and component market size has grown steadily in recent years. It will grow from $96.63 billion in 2023 to $98.87 billion in 2024 at a compound annual growth rate (CAGR) of 2.3%. The growth in the historical period can be ascribed to the rising adoption of consumer electronics, expansion in data center infrastructure, the flourishing gaming industry, the globalized landscape of electronics manufacturing, and the increasing demand for high-bandwidth memory.

The dram module and component market size is expected to see steady growth in the next few years. It will grow to $109.12 billion in 2028 at a compound annual growth rate (CAGR) of 2.5%. The anticipated growth in the forecast period can be credited to the expansion of edge computing, the surge in demand for low-power DRAM, the escalating adoption of wearables, a concentrated focus on the development of quantum computing, and the heightened concerns related to supply chain resilience and security. Notable trends expected in the forecast period encompass the shift to DDR5 technology, the increasing adoption of artificial intelligence and machine learning, the driving force of mobile devices in LPDDR5 adoption, progressions in 3D NAND technology, and notable market consolidation and partnerships.

The anticipated growth in the DRAM module and component market is expected to be propelled by the increased utilization of smartphones. These mobile devices, known for their advanced features and cutting-edge technology, typically integrate DRAM modules into the system-on-a-chip (SoC) of high-end smartphones or place them on the main logic board, contributing to reduced power consumption in the battery. As of February 2023, reported by Uswitch Limited, the UK experienced a 3.8% increase in mobile connections in 2022, totaling 71.8 million connections. The data further projects that approximately 95% of the UK population, or around 65 million individuals, will own a smartphone by 2025. Consequently, the heightened use of smartphones acts as a driving force for the growth of the DRAM module and component market.

The advent of 5G technology is anticipated to further support the DRAM module and component market in the forecast period. The deployment of 5G cellular networks has expanded data pathways, facilitating faster and more efficient data movement, thereby reducing traffic congestion. The surge in demand for high-performance computing, artificial intelligence, and mobile devices has led to an increased need for memory, consequently contributing to the expansion of the DRAM market. As of 2021, Ericsson's Mobility Report revealed a threefold increase in global 5G smartphone subscriptions, reaching 600 million. Furthermore, 5G Americas reported a significant rise in global 5G connections, reaching 429 million in the second quarter of 2021. In summary, the growing adoption of 5G technology is expected to serve as a driver for the DRAM module and component market.


Technological advancement stands out as a prominent trend gaining traction in the DRAM module and component market. Leading companies within this market segment are prioritizing the development of innovative technologies to fortify their positions. An illustrative example is NEO Semiconductor, a US-based firm specializing in the design and development of architectures for 3D NAND flash and other memory systems. In 2023, NEO Semiconductor introduced its groundbreaking 3D X-DRAM technology, marking a significant milestone in the memory industry. This revolutionary technology presents various advantages, including the world's first 3D NAND-such as DRAM cell array structure, a 128 Gb density with 230 layers (eight times higher than current DRAM density), simplified manufacturing and scaling processes, reduced risk and cost compared to alternative 3D DRAM approaches, high yields, and a self-aligned, 3D NAND-such as process. The 3D X-DRAM technology aims to address DRAM's capacity bottleneck, potentially replacing the entire 2D DRAM market. This solution streamlines process steps while delivering a high-speed, high-density, low-cost, and high-yield outcome.

Companies engaged in the DRAM module and component market are actively embracing cutting-edge technologies, such as LPDDR5 DRAM chips, to maintain their market positions. LPDDR5 DRAM chips represent a type of random-access memory (RAM) that offers enhanced performance and lower power consumption compared to preceding generations of DDR memory. For instance, in November 2023, ChangXin Memory Technology (CXMT), a China-based semiconductor integrated device manufacturer, unveiled LPDDR5 DRAM chips, including 12GB LPDDR5 dies, 6GB DSC packaging LPDDR5 mobile DRAM, and 12GB POP packaging LPDDR5 mobile DRAM. These LPDDR5 DRAM chips are tailored for affordable smartphones and other low-power devices, providing CXMT with a diversified product portfolio and expanding its footprint in the burgeoning mobile market. The launch of CXMT's LPDDR5 DRAM chips represents a significant breakthrough for the company, which had previously focused on producing LPDDR4 and LPDDR4X for System-on-Chip (SoC) applications.

In January 2023, Novosense Microelectronics, a China-based company specializing in highly robust and reliable analog and mixed-signal IC design, acquired KT Micro for an undisclosed amount. This strategic acquisition is expected to bolster Novosense's capabilities in wireless connectivity, signal chains, and audio, strengthening its overall position in the semiconductor market. KT Micro, the acquired entity, is a China-based Analog & Mixed Signal fabless design company and a manufacturer of DRAM (Dynamic Random Access Memory).

Major companies operating in the dram module and component market report are Samsung Electronics Co Ltd., SK Hynix Inc., Micron Technology Inc., Super Micro Computer Inc., Winbond Electronics Corporation, Powerchip Technology Corporation, ADATA Technology Co Ltd., Smart Modular Technologies Inc., Nanya Technology Corporation, Kingston Technology Corporation, Team Group Inc., Corsair Gaming Inc., Innodisk Corporation, Apacer Technology Inc., Super Talent Technology Corporation, PNY Technologies Inc., Silicon Power Computer & Communications Inc., Patriot Memory Inc., Transcend Information Inc., ATP Electronics Inc., Avant Technology Inc., VisionTek Products LLC, G.Skill International Enterprise Co. Ltd., Etron Technology Inc., Buffalo Americas Inc., Alliance Memory Inc., Ramaxel Technology (Shenzhen) Co Ltd.

Asia-Pacific was the largest region in the DRAM module and component market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the dram module and component market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the dram module and component market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The primary types of DRAM modules and components include DDR2 DRAM, DDR3 DRAM, DDR4 DRAM, DDR5 DRAM, LPDRAM, GDDR, HBM, and others. DDR2 (Double Data Rate 2) DRAM is a module comprising a small circuit board containing multiple DDR2 memory chips, offering enhanced data transfer rates, increased capacities, and improved power efficiency. Memory capacities are categorized as 1GB, 2GB, 3-4GB, 6-8GB, and ABOVE 8GB, and these modules find applications in consumer electronics, mobile devices, servers, computers, automobiles, and other contexts.

The DRAM module and component market research report is one of a series of new reports that provides DRAM module and component market statistics, including DRAM module and component industry global market size, regional shares, competitors with a DRAM module and component market share, detailed DRAM module and component market segments, market trends and opportunities, and any further data you may need to thrive in the DRAM module and component industry. This DRAM module and component market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The DRAM module and component market consists of sales of products such as SRAM (static random-access memory), flash memory, and NVRAM (non-volatile random-access memory). Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.


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