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Electronic Packaging Market by Material, Technology, Application - Global Forecast 2025-2030

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    Report

  • 194 Pages
  • October 2024
  • Region: Global
  • 360iResearch™
  • ID: 6013597
UP TO OFF until Dec 31st 2024
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The Electronic Packaging Market grew from USD 3.19 billion in 2023 to USD 3.69 billion in 2024. It is expected to continue growing at a CAGR of 16.55%, reaching USD 9.32 billion by 2030.

Electronic packaging encompasses the critical processes of designing, manufacturing, and assembling electronic components and systems, ensuring protection, interconnection, and thermal management of the electronic system. Its necessity stems from its role in safeguarding electronics against environmental hazards, enhancing functionality, and dissipating heat. This packaging is pivotal in applications across consumer electronics, automotive, telecommunications, and healthcare sectors. The end-use scope is vast, ranging from mobile devices and computers to advanced automotive systems and medical diagnostic equipment.

The electronic packaging market is poised for substantial growth, propelled by the rising consumer demand for smaller, lighter, and more efficient devices. Key growth factors include advancements in semiconductor technology, the proliferation of IoT devices, and the expansion of the automotive electronics market. Moreover, the adoption of 5G infrastructure and sustainable packaging solutions offer significant growth opportunities. To capitalize on these, companies should focus on developing eco-friendly packaging solutions and investing in R&D for advanced materials that enhance thermal management and miniaturization. However, challenges such as fluctuating raw material prices, stringent environmental regulations, and the complexities of integrating multi-functional components could impede market growth. Understanding these limitations is crucial for stakeholders to navigate potential pitfalls effectively.

Innovation opportunities lie in the development of advanced materials, such as graphene and nanocomposites, which offer improved thermal conductivity and mechanical strength. Additionally, embedding smart sensors within packaging could enable real-time monitoring of electronic components' performance and health. Research into reducing the carbon footprint of electronic packaging and developing biodegradable options can align with global sustainability goals, transforming market practices. The nature of the market is highly dynamic, characterized by rapid technological advancements and intense competition, necessitating continuous innovation and strategic partnerships. Ultimately, staying ahead in this market requires agility and a keen focus on technological trends and consumer needs.

Understanding Market Dynamics in the Electronic Packaging Market

The Electronic Packaging Market is rapidly evolving, shaped by dynamic supply and demand trends. These insights provide companies with actionable intelligence to drive investments, develop strategies, and seize emerging opportunities. A comprehensive understanding of market dynamics also helps organizations mitigate political, geographical, technical, social, and economic risks while offering a clearer view of consumer behavior and its effects on manufacturing costs and purchasing decisions.
  • Market Drivers
    • Growth in semiconductor industry driving the need for advanced electronic packaging
    • Expansion of the automotive industry with emphasis on electronic components and sensors
    • Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
    • Government regulations and standards mandating improved reliability and performance of electronic packaging
  • Market Restraints
    • Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
    • Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
  • Market Opportunities
    • Expansion of 5G technology and its impact on electronic packaging requirements
    • Increased utilization of system-in-package (SiP) technology for high-performance applications
    • Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
  • Market Challenges
    • Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
    • Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements

Exploring Porter’s Five Forces for the Electronic Packaging Market

Porter’s Five Forces framework further strengthens the insights of the Electronic Packaging Market, delivering a clear and effective methodology for understanding the competitive landscape. This tool enables companies to evaluate their current competitive standing and explore strategic repositioning by assessing businesses’ power dynamics and market positioning. It is also instrumental in determining the profitability of new ventures, helping companies leverage their strengths, address weaknesses, and avoid potential pitfalls.

Applying PESTLE Analysis to the Electronic Packaging Market

External macro-environmental factors deeply influence the performance of the Electronic Packaging Market, and the PESTLE analysis provides a comprehensive framework for understanding these influences. By examining Political, Economic, Social, Technological, Legal, and Environmental elements, this analysis offers organizations critical insights into potential opportunities and risks. It also helps businesses anticipate changes in regulations, consumer behavior, and economic trends, enabling them to make informed, forward-looking decisions.

Analyzing Market Share in the Electronic Packaging Market

The Electronic Packaging Market share analysis evaluates vendor performance. This analysis provides a clear view of each vendor’s standing in the competitive landscape by comparing key metrics such as revenue, customer base, and other critical factors. Additionally, it highlights market concentration, fragmentation, and trends in consolidation, empowering vendors to make strategic decisions that enhance their market position.

Evaluating Vendor Success with the FPNV Positioning Matrix in the Electronic Packaging Market

The Electronic Packaging Market FPNV Positioning Matrix is crucial in evaluating vendors based on business strategy and product satisfaction levels. By segmenting vendors into four quadrants - Forefront (F), Pathfinder (P), Niche (N), and Vital (V) - this matrix helps users make well-informed decisions that best align with their unique needs and objectives in the market.

Strategic Recommendations for Success in the Electronic Packaging Market

The Electronic Packaging Market strategic analysis is essential for organizations aiming to strengthen their position in the global market. A comprehensive review of resources, capabilities, and performance helps businesses identify opportunities for improvement and growth. This approach empowers companies to navigate challenges in the increasingly competitive landscape, ensuring they capitalize on new opportunities and align with long-term success.

Key Company Profiles

The report delves into recent significant developments in the Electronic Packaging Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., Amkor Technology, Inc., Analog Devices, Inc., ASE Technology Holding Co, Ltd, Avnet, Inc., Broadcom Inc., DuPont de Nemours, Inc., Infineon Technologies AG, Intel Corporation, Jabil, Inc., Microchip Technology Inc., Micron Technology, Inc., NXP B.V., ON Semiconductor Corporation, Power Integrations, Inc., Qualcomm Technologies, Inc, Renesas Electronics Corporation, ROHM Co., Ltd., Samsung Electronics Co., Ltd., Schott AG, Skyworks Solutions, Inc., Smart Global Holdings, Inc, Smurfit Kappa Group PLC, Sonoco Products Company, Specialized Packaging Group, Inc., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company, Ltd., Texas Instruments Incorporated, Toshiba Corporation, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Electronic Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:
  • Material
    • Glass
    • Metal
    • Plastic
  • Technology
    • Chip-on-Board
    • Surface Mount Technology
    • Through-Hole Technology
  • Application
    • Automotive
    • Consumer Electronics
    • Healthcare
    • Industrial
    • Telecommunications
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report provides a detailed overview of the market, exploring several key areas:

  1. Market Penetration: A thorough examination of the current market landscape, featuring comprehensive data from leading industry players and analyzing their reach and influence across the market.
  2. Market Development: The report identifies significant growth opportunities in emerging markets and assesses expansion potential within established segments, providing a roadmap for future development.
  3. Market Diversification: In-depth coverage of recent product launches, untapped geographic regions, significant industry developments, and strategic investments reshaping the market landscape.
  4. Competitive Assessment & Intelligence: A detailed analysis of the competitive landscape, covering market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, technological advancements, and innovations in manufacturing by key market players.
  5. Product Development & Innovation: Insight into groundbreaking technologies, R&D efforts, and product innovations that will drive the market in future.

Additionally, the report addresses key questions to assist stakeholders in making informed decisions:

  1. What is the current size of the market, and how is it expected to grow?
  2. Which products, segments, and regions present the most attractive investment opportunities?
  3. What are the prevailing technology trends and regulatory factors influencing the market?
  4. How do top vendors rank regarding market share and competitive positioning?
  5. What revenue sources and strategic opportunities guide vendors' market entry or exit decisions?

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Growth in semiconductor industry driving the need for advanced electronic packaging
5.1.1.2. Expansion of the automotive industry with emphasis on electronic components and sensors
5.1.1.3. Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
5.1.1.4. Government regulations and standards mandating improved reliability and performance of electronic packaging
5.1.2. Restraints
5.1.2.1. Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
5.1.2.2. Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
5.1.3. Opportunities
5.1.3.1. Expansion of 5G technology and its impact on electronic packaging requirements
5.1.3.2. Increased utilization of system-in-package (SiP) technology for high-performance applications
5.1.3.3. Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
5.1.4. Challenges
5.1.4.1. Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
5.1.4.2. Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements
5.2. Market Segmentation Analysis
5.2.1. Material: Increasing applications of Glass in electronic packaging due to thermal stability
5.2.2. Application: Emerging applications of electronic packaging in ??healthcare owing to biocompatible packaging
5.3. Porter’s Five Forces Analysis
5.3.1. Threat of New Entrants
5.3.2. Threat of Substitutes
5.3.3. Bargaining Power of Customers
5.3.4. Bargaining Power of Suppliers
5.3.5. Industry Rivalry
5.4. PESTLE Analysis
5.4.1. Political
5.4.2. Economic
5.4.3. Social
5.4.4. Technological
5.4.5. Legal
5.4.6. Environmental
6. Electronic Packaging Market, by Material
6.1. Introduction
6.2. Glass
6.3. Metal
6.4. Plastic
7. Electronic Packaging Market, by Technology
7.1. Introduction
7.2. Chip-on-Board
7.3. Surface Mount Technology
7.4. Through-Hole Technology
8. Electronic Packaging Market, by Application
8.1. Introduction
8.2. Automotive
8.3. Consumer Electronics
8.4. Healthcare
8.5. Industrial
8.6. Telecommunications
9. Americas Electronic Packaging Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States
10. Asia-Pacific Electronic Packaging Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Taiwan
10.12. Thailand
10.13. Vietnam
11. Europe, Middle East & Africa Electronic Packaging Market
11.1. Introduction
11.2. Denmark
11.3. Egypt
11.4. Finland
11.5. France
11.6. Germany
11.7. Israel
11.8. Italy
11.9. Netherlands
11.10. Nigeria
11.11. Norway
11.12. Poland
11.13. Qatar
11.14. Russia
11.15. Saudi Arabia
11.16. South Africa
11.17. Spain
11.18. Sweden
11.19. Switzerland
11.20. Turkey
11.21. United Arab Emirates
11.22. United Kingdom
12. Competitive Landscape
12.1. Market Share Analysis, 2023
12.2. FPNV Positioning Matrix, 2023
12.3. Competitive Scenario Analysis
12.3.1. Specialized Packaging Group Acquires Clark Foam to Boost Capabilities and Market Reach in Foam Packaging Sector
12.3.2. Micron and Namtech Join Forces to Train Skilled Workforce, Strengthening India's Semiconductor Packaging Industry
12.3.3. Schott Enhances Reliability of Aerospace Electronics with Advanced Packaging Solution
12.4. Strategy Analysis & Recommendation
List of Figures
FIGURE 1. ELECTRONIC PACKAGING MARKET RESEARCH PROCESS
FIGURE 2. ELECTRONIC PACKAGING MARKET SIZE, 2023 VS 2030
FIGURE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
FIGURE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 6. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
FIGURE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
FIGURE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
FIGURE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 12. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 13. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 14. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
FIGURE 15. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 16. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 17. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 18. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
FIGURE 19. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
FIGURE 20. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
FIGURE 21. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023
List of Tables
TABLE 1. ELECTRONIC PACKAGING MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
TABLE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
TABLE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
TABLE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 6. ELECTRONIC PACKAGING MARKET DYNAMICS
TABLE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY GLASS, BY REGION, 2018-2030 (USD MILLION)
TABLE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METAL, BY REGION, 2018-2030 (USD MILLION)
TABLE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC, BY REGION, 2018-2030 (USD MILLION)
TABLE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 12. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP-ON-BOARD, BY REGION, 2018-2030 (USD MILLION)
TABLE 13. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
TABLE 14. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH-HOLE TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
TABLE 15. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 16. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
TABLE 17. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
TABLE 18. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
TABLE 19. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
TABLE 20. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
TABLE 21. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 22. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 23. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 24. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 25. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 26. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 27. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 28. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 29. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 30. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 31. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 32. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 33. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 34. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 35. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 36. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 37. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 38. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 39. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 40. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
TABLE 41. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 42. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 43. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 44. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 45. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 46. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 47. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 48. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 49. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 50. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 51. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 52. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 53. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 54. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 55. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 56. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 57. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 58. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 59. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 60. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 61. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 62. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 63. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 64. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 65. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 66. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 67. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 68. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 69. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 70. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 71. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 72. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 73. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 74. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 75. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 76. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 77. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 78. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 79. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 80. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 81. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 82. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 83. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 84. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
TABLE 85. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 86. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 87. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 88. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 89. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 90. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 91. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 92. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 93. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 94. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 95. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 96. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 97. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 98. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 99. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 100. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 101. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 102. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 103. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 104. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 105. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 106. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 107. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 108. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 109. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 110. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 111. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 112. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 113. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 114. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 115. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 116. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 117. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 118. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 119. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 120. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 121. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 122. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 123. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 124. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 125. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 126. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 127. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 128. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 129. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 130. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 131. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 132. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 133. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 134. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 135. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 136. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 137. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 138. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 139. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 140. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 141. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 142. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 143. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 144. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 145. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
TABLE 146. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
TABLE 147. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
TABLE 148. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
TABLE 149. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

Companies Mentioned

The leading players in the Electronic Packaging market, which are profiled in this report, include:
  • Advanced Micro Devices, Inc.
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding Co, Ltd
  • Avnet, Inc.
  • Broadcom Inc.
  • DuPont de Nemours, Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Jabil, Inc.
  • Microchip Technology Inc.
  • Micron Technology, Inc.
  • NXP B.V.
  • ON Semiconductor Corporation
  • Power Integrations, Inc.
  • Qualcomm Technologies, Inc
  • Renesas Electronics Corporation
  • ROHM Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • Schott AG
  • Skyworks Solutions, Inc.
  • Smart Global Holdings, Inc
  • Smurfit Kappa Group PLC
  • Sonoco Products Company
  • Specialized Packaging Group, Inc.
  • STMicroelectronics International N.V.
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • Vishay Intertechnology, Inc.

Methodology

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Table Information