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Europe Chiplet Market Size, Share & Industry Trends Analysis Report By Processor, By End-use, By Packaging Technology, By Country and Growth Forecast, 2023 - 2030

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    Report

  • October 2023
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5935774
The Europe Chiplet Market would witness market growth of 74.8% CAGR during the forecast period (2023-2030).

Data centers have embraced chiplet technology to enhance performance and energy efficiency. Data centers can handle increasingly complex workloads by integrating specialized chiplets for data processing, encryption, and networking into server processors. In the world of HPC, where computational power is paramount, chiplets offer the flexibility to construct supercomputers with various specialized accelerators. These accelerators can be tailored for scientific simulations, weather forecasting, and artificial intelligence tasks. AI chiplets are specifically designed to accelerate machine learning and neural network processing. These chiplets are crucial in various AI applications, including autonomous vehicles, natural language processing, and computer vision.

Chiplets have found application in the 5G ecosystem, enabling the creation of more power-efficient and capable baseband processing units. These chiplets improve signal processing, enhance network capacity, and reduce latency in 5G networks. The automotive industry has seen chiplet technology applied to advanced driver-assistance systems (ADAS) and autonomous vehicles. Chiplets facilitate the integration of sensors, processors, and communication interfaces, enhancing vehicle safety and automation. The IoT industry benefits from chiplets by offering more energy-efficient and compact solutions for connected devices. These chiplets are instrumental in edge computing and sensor networks. The chiplet market's growth and diversification demonstrate its transformative potential across various industries. As technology matures, consumers can expect further innovations and applications that leverage the modularity, scalability, and efficiency that chiplets bring to semiconductor design and manufacturing.

According to the International Trade Administration, Germany has Europe's third-largest aerospace & defense sector, with 2020 revenues at USD 35.4 billion, following the UK at GBP 79 or USD 90.2 billion (including land defense systems) and France at EUR 50.9 billion or USD 58.1 billion. Some three-quarters or USD 26.2 billion of German production is exported. France received a fourth of these exports with USD 6.7 billion. Chiplet technology is increasingly integrated into aerospace & defense systems and equipment to enhance performance, safety, and efficiency.

According to the government of the UK, there will be approximately 600,000 medical devices available in the UK industry in 2021. The Medicines and Healthcare Products Regulatory Agency (MHRA) is responsible for assuring the quality and safety of medical devices by enforcing the relevant regulations. These advancements lead to improved diagnostics, better treatment options, and enhanced patient care, ultimately benefiting healthcare providers, patients, and the entire healthcare ecosystem. The abovementioned elements will boost market growth in this region.

The Germany market dominated the Europe Chiplet Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $17,802.2 million by 2030. The UK market is experiencing a CAGR of 73.2% during (2023 - 2030). Additionally, The France market would exhibit a CAGR of 76.1% during (2023 - 2030).

Based on Processor, the market is segmented into Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), AI-ASIC Coprocessor, and Application Processing Unit (APU). Based on End-use, the market is segmented into Enterprise Electronics, Consumer Electronics, Industrial Automation, Automotive, Healthcare, Military & Aerospace, and Others. Based on Packaging Technology, the market is segmented into2.5D/3D, System-in-Package (SiP), Wafer-Level Chip Scale Package (WLCSP), Flip Chip Chip Scale Package (FCCSP), Flip Chip Ball Grid Array (FCBGA), and Fan-Out (FO). Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Intel Corporation, Advanced Micro Devices, Inc., Apple Inc., IBM Corporation, Marvell Technology Group Ltd., MediaTek, Inc., NVIDIA Corporation, Achronix Semiconductor Corporation, ASE Technology Holding Co., Ltd. (ASE Group), and NXP Semiconductors N.V.

Scope of the Study

Market Segments Covered in the Report:

By Processor
  • Central Processing Unit (CPU)
  • Graphics Processing Unit (GPU)
  • Field-Programmable Gate Array (FPGA)
  • AI-ASIC Coprocessor
  • Application Processing Unit (APU)
By End-use
  • Enterprise Electronics
  • Consumer Electronics
  • Industrial Automation
  • Automotive
  • Healthcare
  • Military & Aerospace
  • Others
By Packaging Technology
  • 2.5D/3D
  • System-in-Package (SiP)
  • Wafer-Level Chip Scale Package (WLCSP)
  • Flip Chip Chip Scale Package (FCCSP)
  • Flip Chip Ball Grid Array (FCBGA)
  • Fan-Out (FO)
By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Key Market Players

List of Companies Profiled in the Report:

  • Intel Corporation
  • Advanced Micro Devices, Inc.
  • Apple Inc.
  • IBM Corporation
  • Marvell Technology Group Ltd.
  • MediaTek, Inc.
  • NVIDIA Corporation
  • Achronix Semiconductor Corporation
  • ASE Technology Holding Co., Ltd. (ASE Group)
  • NXP Semiconductors N.V.

Unique Offerings

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Chiplet Market, by Processor
1.4.2 Europe Chiplet Market, by End-use
1.4.3 Europe Chiplet Market, by Packaging Technology
1.4.4 Europe Chiplet Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2022
4.2 Porter Five Forces Analysis
Chapter 5. Europe Chiplet Market by Processor
5.1 Europe Central Processing Unit (CPU) Market by Country
5.2 Europe Graphics Processing Unit (GPU) Market by Country
5.3 Europe Field-Programmable Gate Array (FPGA) Market by Country
5.4 Europe AI-ASIC Coprocessor Market by Country
5.5 Europe Application Processing Unit (APU) Market by Country
Chapter 6. Europe Chiplet Market by End-use
6.1 Europe Enterprise Electronics Market by Country
6.2 Europe Consumer Electronics Market by Country
6.3 Europe Industrial Automation Market by Country
6.4 Europe Automotive Market by Country
6.5 Europe Healthcare Market by Country
6.6 Europe Military & Aerospace Market by Country
6.7 Europe Others Market by Country
Chapter 7. Europe Chiplet Market by Packaging Technology
7.1 Europe 2.5D/3D Market by Country
7.2 Europe System-in-Package (SiP) Market by Country
7.3 Europe Wafer-Level Chip Scale Package (WLCSP) Market by Country
7.4 Europe Flip Chip Chip Scale Package (FCCSP) Market by Country
7.5 Europe Flip Chip Ball Grid Array (FCBGA) Market by Country
7.6 Europe Fan-Out (FO) Market by Country
Chapter 8. Europe Chiplet Market by Country
8.1 Germany Chiplet Market
8.1.1 Germany Chiplet Market by Processor
8.1.2 Germany Chiplet Market by End-use
8.1.3 Germany Chiplet Market by Packaging Technology
8.2 UK Chiplet Market
8.2.1 UK Chiplet Market by Processor
8.2.2 UK Chiplet Market by End-use
8.2.3 UK Chiplet Market by Packaging Technology
8.3 France Chiplet Market
8.3.1 France Chiplet Market by Processor
8.3.2 France Chiplet Market by End-use
8.3.3 France Chiplet Market by Packaging Technology
8.4 Russia Chiplet Market
8.4.1 Russia Chiplet Market by Processor
8.4.2 Russia Chiplet Market by End-use
8.4.3 Russia Chiplet Market by Packaging Technology
8.5 Spain Chiplet Market
8.5.1 Spain Chiplet Market by Processor
8.5.2 Spain Chiplet Market by End-use
8.5.3 Spain Chiplet Market by Packaging Technology
8.6 Italy Chiplet Market
8.6.1 Italy Chiplet Market by Processor
8.6.2 Italy Chiplet Market by End-use
8.6.3 Italy Chiplet Market by Packaging Technology
8.7 Rest of Europe Chiplet Market
8.7.1 Rest of Europe Chiplet Market by Processor
8.7.2 Rest of Europe Chiplet Market by End-use
8.7.3 Rest of Europe Chiplet Market by Packaging Technology
Chapter 9. Company Profiles
9.1 Intel Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Partnerships, Collaborations, and Agreements:
9.1.6 SWOT Analysis
9.2 Advanced Micro Devices, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments:
9.2.5.1 Product Launches and Product Expansions:
9.2.5.2 Acquisition and Mergers:
9.2.6 SWOT Analysis
9.3 Apple, Inc.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Regional Analysis
9.3.4 Research & Development Expense
9.3.5 SWOT Analysis
9.4 IBM Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Regional & Segmental Analysis
9.4.4 Research & Development Expenses
9.4.5 SWOT Analysis
9.5 Marvell Technology Group Ltd.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Regional Analysis
9.5.4 Research & Development Expense
9.5.5 SWOT Analysis
9.6 MediaTek, Inc.
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 SWOT Analysis
9.7 NVIDIA Corporation
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 Recent strategies and developments:
9.7.5.1 Partnerships, Collaborations, and Agreements:
9.7.6 SWOT Analysis
9.8 Achronix Semiconductor Corporation
9.8.1 Company Overview
9.8.2 SWOT Analysis
9.9 ASE Group (ASE Technology Holding Co., Ltd.)
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Segmental and Regional Analysis
9.9.4 Research & Development Expenses
9.9.5 SWOT Analysis
9.10. NXP Semiconductors N.V.
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Regional Analysis
9.10.4 Research & Development Expense
9.10.5 SWOT Analysis

Companies Mentioned

  • Intel Corporation
  • Advanced Micro Devices, Inc.
  • Apple Inc.
  • IBM Corporation
  • Marvell Technology Group Ltd.
  • MediaTek, Inc.
  • NVIDIA Corporation
  • Achronix Semiconductor Corporation
  • ASE Technology Holding Co., Ltd. (ASE Group)
  • NXP Semiconductors N.V.

Methodology

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