The Europe Embedded Die Packaging Technology Market would witness market growth of 18.4% CAGR during the forecast period (2022-2028).
Embedded die packaging facilitates the trend toward modularization with a less expensive setup. Additionally, the integrated die packaging technology's concealed components to guard against the possibility of electronic device counterfeiting and reverse engineering.
In the following years, embedded die packaging technology is projected to become more popular and used in various industries, including mobile phones, wearable technology, medical devices, and automobiles.
Signal integrity may be maintained in RF and high-power industrial applications using integrated die packaging while minimizing parasitics and device-to-device reproducibility. Additionally, special process capacity enables the adaptation of various material sets and substrates, including enormous temperature extremes, with hundreds of hours of cycling in accelerated life tests, to the application requirements.
Small- to medium-sized businesses are a well-established part of the medical technology sector in Europe. The United Kingdom is home to several head offices and subsidiaries of different multinational corporations, including those of the top US producers of medical technology. In addition, there is a growing need for wearable skin adhesives, comprising health analytical devices, monitoring devices, and clinical efficiency tools. The need to downsize electronic devices will increase due to the increased demand for wearable technology and the healthcare industry's willingness to adopt cutting-edge technologies.
The Germany market dominated the Europe Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $11,917.6 Thousands by 2028.The UK market is anticipated to grow at a CAGR of 17.4% during (2022 - 2028). Additionally, The France market would exhibit a CAGR of 19.2% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Embedded die packaging facilitates the trend toward modularization with a less expensive setup. Additionally, the integrated die packaging technology's concealed components to guard against the possibility of electronic device counterfeiting and reverse engineering.
In the following years, embedded die packaging technology is projected to become more popular and used in various industries, including mobile phones, wearable technology, medical devices, and automobiles.
Signal integrity may be maintained in RF and high-power industrial applications using integrated die packaging while minimizing parasitics and device-to-device reproducibility. Additionally, special process capacity enables the adaptation of various material sets and substrates, including enormous temperature extremes, with hundreds of hours of cycling in accelerated life tests, to the application requirements.
Small- to medium-sized businesses are a well-established part of the medical technology sector in Europe. The United Kingdom is home to several head offices and subsidiaries of different multinational corporations, including those of the top US producers of medical technology. In addition, there is a growing need for wearable skin adhesives, comprising health analytical devices, monitoring devices, and clinical efficiency tools. The need to downsize electronic devices will increase due to the increased demand for wearable technology and the healthcare industry's willingness to adopt cutting-edge technologies.
The Germany market dominated the Europe Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $11,917.6 Thousands by 2028.The UK market is anticipated to grow at a CAGR of 17.4% during (2022 - 2028). Additionally, The France market would exhibit a CAGR of 19.2% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Scope of the Study
Market Segments Covered in the Report:
By Vertical
- Consumer Electronics
- IT & Telecommunication
- Automotive
- Healthcare
- Others
By Platform
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- General Electric (GE) Co
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd
- Amkor Technology, Inc
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
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- The highest number of Market tables and figures
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- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Embedded Die Packaging Technology Market, by Vertical
1.4.2 Europe Embedded Die Packaging Technology Market, by Platform
1.4.3 Europe Embedded Die Packaging Technology Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Embedded Die Packaging Technology Market
Chapter 4. Europe Embedded Die Packaging Technology Market by Vertical
4.1 Europe Consumer Electronics Market by Country
4.2 Europe IT & Telecommunication Market by Country
4.3 Europe Automotive Market by Country
4.4 Europe Healthcare Market by Country
4.5 Europe Others Market by Country
Chapter 5. Europe Embedded Die Packaging Technology Market by Platform
5.1 Europe Embedded Die in IC Package Substrate Market by Country
5.2 Europe Embedded Die in Rigid Board Market by Country
5.3 Europe Embedded Die in Flexible Board Market by Country
Chapter 6. Europe Embedded Die Packaging Technology Market by Country
6.1 Germany Embedded Die Packaging Technology Market
6.1.1 Germany Embedded Die Packaging Technology Market by Vertical
6.1.2 Germany Embedded Die Packaging Technology Market by Platform
6.2 UK Embedded Die Packaging Technology Market
6.2.1 UK Embedded Die Packaging Technology Market by Vertical
6.2.2 UK Embedded Die Packaging Technology Market by Platform
6.3 France Embedded Die Packaging Technology Market
6.3.1 France Embedded Die Packaging Technology Market by Vertical
6.3.2 France Embedded Die Packaging Technology Market by Platform
6.4 Russia Embedded Die Packaging Technology Market
6.4.1 Russia Embedded Die Packaging Technology Market by Vertical
6.4.2 Russia Embedded Die Packaging Technology Market by Platform
6.5 Spain Embedded Die Packaging Technology Market
6.5.1 Spain Embedded Die Packaging Technology Market by Vertical
6.5.2 Spain Embedded Die Packaging Technology Market by Platform
6.6 Italy Embedded Die Packaging Technology Market
6.6.1 Italy Embedded Die Packaging Technology Market by Vertical
6.6.2 Italy Embedded Die Packaging Technology Market by Platform
6.7 Rest of Europe Embedded Die Packaging Technology Market
6.7.1 Rest of Europe Embedded Die Packaging Technology Market by Vertical
6.7.2 Rest of Europe Embedded Die Packaging Technology Market by Platform
Chapter 7. Company Profiles
7.1 General Electric (GE) Co.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Acquisition and Mergers:
7.2.5.2 Geographical Expansions:
7.2.6 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.5.2 Acquisition and Mergers:
7.4 Fujikura Ltd.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments:
7.5.5.1 Geographical Expansions:
7.6 Taiwan Semiconductor Manufacturing Company Limited
7.6.1 Company overview
7.6.2 Financial Analysis
7.6.3 Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Partnerships, Collaborations, and Agreements:
7.7 ASE Group (ASE Technology Holding)
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expenses
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Product Launches and Product Expansions:
7.8 Microsemi Corporation (Microchip Technology)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Schweizer Electronic AG (Wus Printed Circuit)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expenses
7.10. AT&S Group
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
Companies Mentioned
- General Electric (GE) Co.
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd.
- Amkor Technology, Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
Methodology
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