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Europe Next Generation Memory Market Size, Share & Industry Trends Analysis Report By Technology, By Wafer Size (300 mm, and 200 mm), By Vertical, By Country and Growth Forecast, 2023 - 2030

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    Report

  • October 2023
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5935272
The Europe Next Generation Memory Market would witness market growth of 16.6% CAGR during the forecast period (2023-2030).

The demand for data-intensive applications significantly drives the rapid development of the market. The advent of ML, big data, and AI has placed unprecedented demands on memory systems. These applications need vast amounts of data to be processed quickly, efficiently, and reliably, which necessitates memory technologies capable of meeting these requirements.

In addition, the emergence of IoT and the increasing number of connected devices have increased the demand for memory solutions. IoT devices produce large volumes of data; these must be handled and stored in a dependable and energy-efficient way. Next-generation memory technologies hold the promise of enabling these devices to operate seamlessly, with rapid data access and low energy consumption.

The automotive industry is another sector that stands to benefit from next-generation memory technologies. For data processing and storage, advanced driver assistance systems (ADAS) and autonomous car development depend on quick and dependable memory solutions. Technologies like MRAM, with their non-volatility, endurance, and speed, offer promising options for automotive applications. The latest developments in the market also focus on memory that can endure harsh conditions and environments. This is critical for applications in aerospace, defense, and industrial sectors, where memory needs to withstand extreme temperatures, radiation, and vibrations.

For Europe to grow, the automotive industry is essential. The European Union produces some of the most cars in the world, and the automotive industry is the greatest private investor in R & D. The European Commission backs worldwide technology harmonization and funds R & D to increase the competitiveness of the EU automobile industry and maintain its technological leadership. Over 7% of the EU's GDP is revenue from the automotive industry. In the coming years, outside of the EU, the sector is anticipated to increase by 80%.

Furthermore, one of Italy's key sectors is the automobile sector. According to the International Trade Administration, the Italian automotive industry generated €106.1 billion in revenue in 2020, accounting for 6.2% of Italy's GDP and 11% of the country's manufacturing revenue, according to the most recent figures. Hence, the growing automotive industry is an essential factor in expanding the regional market.

The Germany market dominated the Europe Next Generation Memory Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,098.6 million by 2030. The UK market is experiencing a CAGR of 15.5% during (2023 - 2030). Additionally, The France market would exhibit a CAGR of 17.5% during (2023 - 2030).

Based on Technology, the market is segmented into Non-volatile (Magneto-resistive Random-access Memory (MRAM), Ferroelectric RAM (FRAM), SRAM, Resistive Random-access Memory (ReRAM), Nano RAM, and Others), and Volatile. Based on Wafer Size, the market is segmented into 300 mm, and 200 mm. Based on Vertical, the market is segmented into Enterprise Storage, Consumer Electronics, BFSI, Telecommunications, Information Technology, Government, Automotive & Transportation, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co. Ltd., Micron Technology, Inc., Fujitsu Limited, Toshiba Corporation, Honeywell International, Inc., Microchip Technology, Inc., Everspin Technologies, Inc., Infineon Technologies AG, Kingston Technology Company, Inc., and Intel Corporation.

Scope of the Study

Market Segments Covered in the Report:

By Technology
  • Non-volatile
  • Magneto-resistive Random-access Memory (MRAM)
  • Ferroelectric RAM (FRAM)
  • SRAM
  • Resistive Random-access Memory (ReRAM)
  • Nano RAM
  • Others
  • Volatile
By Wafer Size
  • 300 mm
  • 200 mm
By Vertical
  • Enterprise Storage
  • Consumer Electronics
  • BFSI
  • Telecommunications
  • Information Technology
  • Government
  • Automotive & Transportation
  • Others
By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Key Market Players

List of Companies Profiled in the Report:

  • Samsung Electronics Co. Ltd.
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Toshiba Corporation
  • Honeywell International, Inc.
  • Microchip Technology, Inc.
  • Everspin Technologies, Inc.
  • Infineon Technologies AG
  • Kingston Technology Company, Inc.
  • Intel Corporation

Unique Offerings

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Next Generation Memory Market, by Technology
1.4.2 Europe Next Generation Memory Market, by Wafer Size
1.4.3 Europe Next Generation Memory Market, by Vertical
1.4.4 Europe Next Generation Memory Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.2.4 Expansion
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions: 2022, Aug - 2023, Oct) Leading Players
4.5 Porter’s Five Forces Analysis
Chapter 5. Europe Next Generation Memory Market, By Technology
5.1 Europe Non-volatile Market, By Country
5.2 Europe Next Generation Memory Market, By Non-volatile Type
5.2.1 Europe Magneto-resistive Random-access Memory (MRAM) Market, By Country
5.2.2 Europe Ferroelectric RAM (FRAM) Market, By Country
5.2.3 Europe SRAM Market, By Country
5.2.4 Europe Resistive Random-access Memory (ReRAM) Market, By Country
5.2.5 Europe Nano RAM Market, By Country
5.2.6 Europe Others Market, By Country
5.3 Europe Volatile Market, By Country
Chapter 6. Europe Next Generation Memory Market, By Wafer Size
6.1 Europe 300 mm Market, By Country
6.2 Europe 200 mm Market, By Country
Chapter 7. Europe Next Generation Memory Market, By Vertical
7.1 Europe Enterprise Storage Market, By Country
7.2 Europe Consumer Electronics Market, By Country
7.3 Europe BFSI Market, By Country
7.4 Europe Telecommunications Market, By Country
7.5 Europe Information Technology Market, By Country
7.6 Europe Government Market, By Country
7.7 Europe Automotive & Transportation Market, By Country
7.8 Europe Others Market, By Country
Chapter 8. Europe Next Generation Memory Market, By Country
8.1 Germany Next Generation Memory Market
8.1.1 Germany Next Generation Memory Market, By Technology
8.1.1.1 Germany Next Generation Memory Market, By Non-volatile Type
8.1.2 Germany Next Generation Memory Market, By Wafer Size
8.1.3 Germany Next Generation Memory Market, By Vertical
8.2 UK Next Generation Memory Market
8.2.1 UK Next Generation Memory Market, By Technology
8.2.1.1 UK Next Generation Memory Market, By Non-volatile Type
8.2.2 UK Next Generation Memory Market, By Wafer Size
8.2.3 UK Next Generation Memory Market, By Vertical
8.3 France Next Generation Memory Market
8.3.1 France Next Generation Memory Market, By Technology
8.3.1.1 France Next Generation Memory Market, By Non-volatile Type
8.3.2 France Next Generation Memory Market, By Wafer Size
8.3.3 France Next Generation Memory Market, By Vertical
8.4 Russia Next Generation Memory Market
8.4.1 Russia Next Generation Memory Market, By Technology
8.4.1.1 Russia Next Generation Memory Market, By Non-volatile Type
8.4.2 Russia Next Generation Memory Market, By Wafer Size
8.4.3 Russia Next Generation Memory Market, By Vertical
8.5 Spain Next Generation Memory Market
8.5.1 Spain Next Generation Memory Market, By Technology
8.5.1.1 Spain Next Generation Memory Market, By Non-volatile Type
8.5.2 Spain Next Generation Memory Market, By Wafer Size
8.5.3 Spain Next Generation Memory Market, By Vertical
8.6 Italy Next Generation Memory Market
8.6.1 Italy Next Generation Memory Market, By Technology
8.6.1.1 Italy Next Generation Memory Market, By Non-volatile Type
8.6.2 Italy Next Generation Memory Market, By Wafer Size
8.6.3 Italy Next Generation Memory Market, By Vertical
8.7 Rest of Europe Next Generation Memory Market
8.7.1 Rest of Europe Next Generation Memory Market, By Technology
8.7.1.1 Rest of Europe Next Generation Memory Market, By Non-volatile Type
8.7.2 Rest of Europe Next Generation Memory Market, By Wafer Size
8.7.3 Rest of Europe Next Generation Memory Market, By Vertical
Chapter 9. Company Profiles
9.1 Samsung Electronics Co., Ltd. (Samsung Group)
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Recent strategies and developments:
9.1.4.1 Partnerships, Collaborations, and Agreements:
9.1.4.2 Product Launches and Product Expansions:
9.1.5 SWOT Analysis
9.2 Micron Technology, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Recent strategies and developments:
9.2.4.1 Partnerships, Collaborations, and Agreements:
9.2.4.2 Product Launches and Product Expansions:
9.2.4.3 Geographical Expansions:
9.2.5 SWOT Analysis
9.3 Fujitsu Limited
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expenses
9.3.5 Recent strategies and developments:
9.3.5.1 Partnerships, Collaborations, and Agreements:
9.3.5.2 Product Launches and Product Expansions:
9.3.6 SWOT Analysis
9.4 Toshiba Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research and Development Expense
9.4.5 Recent strategies and developments:
9.4.5.1 Product Launches and Product Expansions:
9.4.6 SWOT Analysis
9.5 Honeywell International, Inc.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expenses
9.5.5 Recent strategies and developments:
9.5.5.1 Acquisition and Mergers:
9.5.6 SWOT Analysis
9.6 Microchip Technology Incorporated
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Partnerships, Collaborations, and Agreements:
9.6.5.2 Product Launches and Product Expansions:
9.6.5.3 Acquisition and Mergers:
9.6.6 SWOT Analysis
9.7 Everspin Technologies, Inc.
9.7.1 Company overview
9.7.2 Financial Analysis
9.7.3 Regional Analysis
9.7.4 Research & Development Expense
9.7.5 Recent strategies and developments:
9.7.5.1 Product Launches and Product Expansions:
9.7.6 SWOT Analysis
9.8 Infineon Technologies AG
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expense
9.8.5 Recent strategies and developments:
9.8.5.1 Partnerships, Collaborations, and Agreements:
9.8.5.2 Product Launches and Product Expansions:
9.8.6 SWOT Analysis
9.9 Kingston Technology Company, Inc.
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. Intel Corporation
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis

Companies Mentioned

  • Samsung Electronics Co. Ltd.
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Toshiba Corporation
  • Honeywell International, Inc.
  • Microchip Technology, Inc.
  • Everspin Technologies, Inc.
  • Infineon Technologies AG
  • Kingston Technology Company, Inc.
  • Intel Corporation

Methodology

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