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Europe Next Generation Non-Volatile Memory Market Size, Share & Trends Analysis Report By Type (High-bandwidth Memory (HBM) and Hybrid Memory Cube (HMC)), By Wafer Size (300 mm and 200 mm), By Application, By Country and Growth Forecast, 2024 - 2031

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    Report

  • 130 Pages
  • August 2024
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6004172
The Europe Next Generation Non-Volatile Memory Market would witness market growth of 16.8% CAGR during the forecast period (2024-2031).

The Germany market dominated the Europe Next Generation Non-Volatile Memory Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $1.04 billion by 2031. The UK market is capturing a CAGR of 15.8% during 2024-2031. Additionally, the France market would experience a CAGR of 18% during 2024-2031.



ADAS relies on NVMs for storing critical data related to vehicle safety and navigation systems. The non-volatile nature ensures that data such as sensor calibration and mapping information is preserved during power cycles, enhancing vehicle safety and performance. In-car entertainment systems use NVMs to store multimedia content, application data, and system settings. The high-speed access and reliability of NVMs ensure seamless operation and quick access to entertainment features. Automotive telematics and control units benefit from the reliability and data retention capabilities of NVMs. They support remote diagnostics, fleet management, and real-time data processing.

Moreover, next generation NVMs, such as 3D NAND and ReRAM, are used in data centres to provide high-speed storage solutions. These technologies offer increased storage density and faster data access, which is critical for managing large volumes of data and supporting cloud services. In cloud computing environments, NVMs are employed for caching and buffering to speed up data retrieval and processing. Their ability to retain data during power interruptions enhances data integrity and reduces latency.

The rise of digital and mobile banking services in the UK drives the demand for high-performance memory solutions. Next generation NVM enhances the performance and reliability of digital banking platforms and applications. Additionally, the United Kingdom is the foremost fintech centre in Europe. The UK was home to over 3,200 fintechs in 2022, a significant increase from the 3,000 established in 2021. The UK’s investment in fintech and innovative financial technologies fosters the adoption of advanced memory solutions.

Next generation NVM supports fintech applications by providing high-speed, reliable memory for complex financial transactions and applications. Enhancing customer experience through personalized services and faster transaction processing requires advanced memory solutions. Next generation NVM enables faster data retrieval and improved service delivery in the BFSI sector. Therefore, rising BFSI sector and expansion of the IT industry in the region is driving the growth of the market.

List of Key Companies Profiled

  • Samsung Electronics Co. Ltd
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Intel Corporation
  • Kingston Technology Company, Inc.
  • Kioxia Holdings Corporation

Market Report Segmentation

By Type

  • High-bandwidth Memory (HBM)
  • Hybrid Memory Cube (HMC)

By Wafer Size

  • 300 mm
  • 200 mm

By Application

  • BFSI
  • Information Technology
  • Consumer Electronics
  • Telecommunications
  • Government
  • Others

By Country

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Next Generation Non-Volatile Memory Market, by Type
1.4.2 Europe Next Generation Non-Volatile Memory Market, by Wafer Size
1.4.3 Europe Next Generation Non-Volatile Memory Market, by Application
1.4.4 Europe Next Generation Non-Volatile Memory Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2023
4.2 Porter Five Forces Analysis
Chapter 5. Europe Next Generation Non-Volatile Memory Market by Type
5.1 Europe High-bandwidth Memory (HBM) Market by Country
5.2 Europe Hybrid Memory Cube (HMC) Market by Country
Chapter 6. Europe Next Generation Non-Volatile Memory Market by Wafer Size
6.1 Europe 300 mm Market by Country
6.2 Europe 200 mm Market by Country
Chapter 7. Europe Next Generation Non-Volatile Memory Market by Application
7.1 Europe BFSI Market by Country
7.2 Europe Information Technology Market by Country
7.3 Europe Consumer Electronics Market by Country
7.4 Europe Telecommunications Market by Country
7.5 Europe Government Market by Country
7.6 Europe Others Market by Country
Chapter 8. Europe Next Generation Non-Volatile Memory Market by Country
8.1 Germany Next Generation Non-Volatile Memory Market
8.1.1 Germany Next Generation Non-Volatile Memory Market by Type
8.1.2 Germany Next Generation Non-Volatile Memory Market by Wafer Size
8.1.3 Germany Next Generation Non-Volatile Memory Market by Application
8.2 UK Next Generation Non-Volatile Memory Market
8.2.1 UK Next Generation Non-Volatile Memory Market by Type
8.2.2 UK Next Generation Non-Volatile Memory Market by Wafer Size
8.2.3 UK Next Generation Non-Volatile Memory Market by Application
8.3 France Next Generation Non-Volatile Memory Market
8.3.1 France Next Generation Non-Volatile Memory Market by Type
8.3.2 France Next Generation Non-Volatile Memory Market by Wafer Size
8.3.3 France Next Generation Non-Volatile Memory Market by Application
8.4 Russia Next Generation Non-Volatile Memory Market
8.4.1 Russia Next Generation Non-Volatile Memory Market by Type
8.4.2 Russia Next Generation Non-Volatile Memory Market by Wafer Size
8.4.3 Russia Next Generation Non-Volatile Memory Market by Application
8.5 Spain Next Generation Non-Volatile Memory Market
8.5.1 Spain Next Generation Non-Volatile Memory Market by Type
8.5.2 Spain Next Generation Non-Volatile Memory Market by Wafer Size
8.5.3 Spain Next Generation Non-Volatile Memory Market by Application
8.6 Italy Next Generation Non-Volatile Memory Market
8.6.1 Italy Next Generation Non-Volatile Memory Market by Type
8.6.2 Italy Next Generation Non-Volatile Memory Market by Wafer Size
8.6.3 Italy Next Generation Non-Volatile Memory Market by Application
8.7 Rest of Europe Next Generation Non-Volatile Memory Market
8.7.1 Rest of Europe Next Generation Non-Volatile Memory Market by Type
8.7.2 Rest of Europe Next Generation Non-Volatile Memory Market by Wafer Size
8.7.3 Rest of Europe Next Generation Non-Volatile Memory Market by Application
Chapter 9. Company Profiles
9.1 Micron Technology, Inc.
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.1 Research & Development Expenses
9.1.2 Recent strategies and developments
9.1.2.1 Product Launches and Product Expansions
9.1.3 SWOT Analysis
9.2 Fujitsu Limited
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments
9.2.5.1 Product Launches and Product Expansions
9.2.6 SWOT Analysis
9.3 ROHM Co., Ltd.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expense
9.3.5 SWOT Analysis
9.4 Kingston Technology Company, Inc.
9.4.1 Company Overview
9.4.2 SWOT Analysis
9.5 Kioxia Holdings Corporation
9.5.1 Company Overview
9.5.2 Financial Analysis
9.6 Samsung Electronics Co., Ltd. (Samsung Group)
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 SWOT Analysis
9.7 Honeywell International, Inc.
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 SWOT Analysis
9.8 Infineon Technologies AG
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expense
9.8.5 Recent strategies and developments
9.8.5.1 Product Launches and Product Expansions
9.8.6 SWOT Analysis
9.9 Toshiba International Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Segmental and Regional Analysis
9.9.4 Research and Development Expense
9.9.5 SWOT Analysis
9.10. Intel Corporation
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis

Companies Mentioned

  • Samsung Electronics Co. Ltd
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Intel Corporation
  • Kingston Technology Company, Inc.
  • Kioxia Holdings Corporation

Methodology

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