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LAMEA Embedded Non-volatile Memory Market Size, Share & Trends Analysis Report By Wafer Size (>100 mm and <100 mm), By Product, By Application, By Country and Growth Forecast, 2024 - 2031

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    Report

  • 141 Pages
  • September 2024
  • Region: Africa, Middle East
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6007443
The Latin America, Middle East and Africa Embedded Non-volatile Memory Market would witness market growth of 13.2% CAGR during the forecast period (2024-2031).

The Brazil market dominated the LAMEA Embedded Non-volatile Memory Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $145.1 million by 2031. The Argentina market is showcasing a CAGR of 13.9% during (2024 - 2031). Additionally, the UAE market would register a CAGR of 12.2% during (2024 - 2031).



Connected public services, from waste management to emergency response systems, are integral to smart cities. These services rely on real-time data collection and analysis to function effectively. For instance, smart waste management systems use sensors to monitor bin levels and optimize collection routes, while emergency services use connected systems to coordinate rapid responses to incidents. In these scenarios, eNVM is essential for storing sensor data, configuration settings, and operational parameters, ensuring these systems operate smoothly and efficiently.

Nevertheless, the market is not without its share of obstacles. The steep cost of eNVM technologies, particularly those that employ advanced processes such as FinFET and FD-SOI, is one of the primary obstacles. These manufacturing techniques require specialized equipment and materials, increasing production costs that can be prohibitive for smaller manufacturers or those in emerging markets. Additionally, the complexity of integrating eNVM into semiconductor chips can result in longer development cycles and a higher risk of production errors, further adding to the overall cost and time to market. As a result, some manufacturers may be hesitant to adopt eNVM, particularly when simpler and more established memory technologies are available at a lower cost.

The Brazilian government’s focus on digital transformation, including smart city initiatives and adopting Industry 4.0 practices, further propels the demand for eNVM. These initiatives emphasize automation, real-time data analysis, and connected systems, all of which require high-performance, non-volatile memory to ensure the efficiency and security of data handling processes. The country’s growing emphasis on smart manufacturing and industrial automation is a notable example of how eNVM technologies such as MRAM and FRAM provide fast, reliable memory solutions for industrial machinery and sensors in manufacturing environments. Thus, these elements are key drivers of the regional embedded non-volatile memory market's growth.

Based on Wafer Size, the market is segmented into >100 mm and < 100 mm. Based on Product, the market is segmented into eFlash, eE2PROM, FRAM, and Other Product. Based on Application, the market is segmented into BFSI, Information Technology, Consumer Electronics, Telecommunications, Government, and Others Application. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

List of Key Companies Profiled

  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Micron Technology, Inc.
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Honeywell International Inc.
  • Fujitsu Limited
  • Infineon Technologies AG
  • Intel Corporation
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.

Market Report Segmentation

By Wafer Size

  • >100 mm
  • < 100 mm

By Product

  • eFlash
  • eE2PROM
  • FRAM
  • Other Product

By Application

  • BFSI
  • Information Technology
  • Consumer Electronics
  • Telecommunications
  • Government
  • Others Application

By Country

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Embedded Non-volatile Memory Market, by Wafer Size
1.4.2 LAMEA Embedded Non-volatile Memory Market, by Product
1.4.3 LAMEA Embedded Non-volatile Memory Market, by Application
1.4.4 LAMEA Embedded Non-volatile Memory Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.3 Market Share Analysis, 2023
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2020-2024)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions : 2022, Aug - 2024, Mar) Leading Players
4.5 Porter Five Forces Analysis
Chapter 5. LAMEA Embedded Non-volatile Memory Market by Wafer Size
5.1 LAMEA >100 mm Market by Country
5.2 LAMEA < 100 mm Market by Country
Chapter 6. LAMEA Embedded Non-volatile Memory Market by Product
6.1 LAMEA eFlash Market by Country
6.2 LAMEA eE2PROM Market by Country
6.3 LAMEA FRAM Market by Country
6.4 LAMEA Other Product Market by Country
Chapter 7. LAMEA Embedded Non-volatile Memory Market by Application
7.1 LAMEA BFSI Market by Country
7.2 LAMEA Information Technology Market by Country
7.3 LAMEA Consumer Electronics Market by Country
7.4 LAMEA Telecommunications Market by Country
7.5 LAMEA Government Market by Country
7.6 LAMEA Others Application Market by Country
Chapter 8. LAMEA Embedded Non-volatile Memory Market by Country
8.1 Brazil Embedded Non-volatile Memory Market
8.1.1 Brazil Embedded Non-volatile Memory Market by Wafer Size
8.1.2 Brazil Embedded Non-volatile Memory Market by Product
8.1.3 Brazil Embedded Non-volatile Memory Market by Application
8.2 Argentina Embedded Non-volatile Memory Market
8.2.1 Argentina Embedded Non-volatile Memory Market by Wafer Size
8.2.2 Argentina Embedded Non-volatile Memory Market by Product
8.2.3 Argentina Embedded Non-volatile Memory Market by Application
8.3 UAE Embedded Non-volatile Memory Market
8.3.1 UAE Embedded Non-volatile Memory Market by Wafer Size
8.3.2 UAE Embedded Non-volatile Memory Market by Product
8.3.3 UAE Embedded Non-volatile Memory Market by Application
8.4 Saudi Arabia Embedded Non-volatile Memory Market
8.4.1 Saudi Arabia Embedded Non-volatile Memory Market by Wafer Size
8.4.2 Saudi Arabia Embedded Non-volatile Memory Market by Product
8.4.3 Saudi Arabia Embedded Non-volatile Memory Market by Application
8.5 South Africa Embedded Non-volatile Memory Market
8.5.1 South Africa Embedded Non-volatile Memory Market by Wafer Size
8.5.2 South Africa Embedded Non-volatile Memory Market by Product
8.5.3 South Africa Embedded Non-volatile Memory Market by Application
8.6 Nigeria Embedded Non-volatile Memory Market
8.6.1 Nigeria Embedded Non-volatile Memory Market by Wafer Size
8.6.2 Nigeria Embedded Non-volatile Memory Market by Product
8.6.3 Nigeria Embedded Non-volatile Memory Market by Application
8.7 Rest of LAMEA Embedded Non-volatile Memory Market
8.7.1 Rest of LAMEA Embedded Non-volatile Memory Market by Wafer Size
8.7.2 Rest of LAMEA Embedded Non-volatile Memory Market by Product
8.7.3 Rest of LAMEA Embedded Non-volatile Memory Market by Application
Chapter 9. Company Profiles
9.1 Samsung Electronics Co., Ltd. (Samsung Group)
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments
9.1.5.1 Product Launches and Product Expansions
9.1.6 SWOT Analysis
9.2 Micron Technology, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments
9.2.5.1 Partnerships, Collaborations, and Agreements
9.2.5.2 Product Launches and Product Expansions
9.2.6 SWOT Analysis
9.3 ROHM Co., Ltd.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expense
9.3.5 SWOT Analysis
9.4 Toshiba International Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research and Development Expense
9.4.5 Recent strategies and developments
9.4.5.1 Product Launches and Product Expansions
9.4.6 SWOT Analysis
9.5 Honeywell International, Inc.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expenses
9.5.5 SWOT Analysis
9.6 Fujitsu Limited
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments
9.6.5.1 Product Launches and Product Expansions
9.6.6 SWOT Analysis
9.7 Infineon Technologies AG
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expense
9.7.5 Recent strategies and developments
9.7.5.1 Product Launches and Product Expansions
9.7.6 SWOT Analysis
9.8 Intel Corporation
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expenses
9.8.5 Recent strategies and developments
9.8.5.1 Partnerships, Collaborations, and Agreements
9.8.6 SWOT Analysis
9.9 NXP Semiconductors N.V.
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses
9.9.5 Recent strategies and developments
9.9.5.1 Product Launches and Product Expansions
9.9.6 SWOT Analysis
9.10. STMicroelectronics N.V.
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 Recent strategies and developments
9.10.5.1 Product Launches and Product Expansions
9.10.6 SWOT Analysis

Companies Mentioned

  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Micron Technology, Inc.
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Honeywell International Inc.
  • Fujitsu Limited
  • Infineon Technologies AG
  • Intel Corporation
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.

Methodology

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