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LAMEA Gate Driver ICs Market Size, Share & Trends Analysis Report By Transistor Type (MOSFET, and IGBT), By Semiconductor Material (SiC, and GaN), By Mode of Attachment, By Application, By Country and Growth Forecast, 2023 - 2030

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    Report

  • 172 Pages
  • February 2024
  • Region: Africa, Middle East
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5945695
The Latin America, Middle East and Africa Gate Driver ICs Market would witness market growth of 7.8% CAGR during the forecast period (2023-2030). In the year 2026, the LAMEA market's volume is expected to surge to 77.7 million units, showcasing a growth of 15.8% (2023-2030).

The adoption of wide bandgap semiconductors such as SiC and GaN is gaining traction due to their superior performance characteristics, including higher efficiency, faster switching speeds, and reduced losses compared to traditional silicon-based devices. Gate driver ICs tailored for wide bandgap semiconductors are emerging to address the specific requirements of these advanced power electronics applications. Additionally, these incorporate advanced protection features to safeguard against over-voltage, over-current, short-circuit, and over-temperature conditions.

Robust fault detection mechanisms and comprehensive protection schemes ensure the reliability and longevity of power electronics systems, minimizing the risk of component damage and system downtime. Digital gate driver solutions are gaining popularity for their flexibility, configurability, and programmability. Moreover, digital gate driver ICs leverage digital signal processing (DSP) techniques to enable adaptive control algorithms, dynamic parameter adjustment, and real-time monitoring capabilities, offering greater flexibility and customization options for diverse application requirements.

Due to the adoption of electric vehicles in the UAE, there will be a corresponding increase in the demand for EV components, including these. These ICs are crucial for controlling the power electronics systems within EVs, including motor drives, battery management systems, and power inverters. The International Trade Administration (ITA) reports that the Dubai Roads and Transport Authority (RTA) effectively implemented a hybrid vehicle conversion program for 50% of the taxi fleet in Dubai. Therefore, the expansion of the EV sector, rising renewable energy generation, and growing smart devices sector are propelling factors of the market in the region.

The Brazil market dominated the LAMEA Gate Driver ICs Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $47 Million by 2030. The Argentina market is showcasing a CAGR of 8.4% during (2023 - 2030). Additionally, The UAE market would register a CAGR of 7.5% during (2023 - 2030).

Based on Transistor Type, the market is segmented into MOSFET, and IGBT. Based on Semiconductor Material, the market is segmented into SiC, and GaN. Based on Mode of Attachment, the market is segmented into On-chip, and Discrete. Based on Application, the market is segmented into Industrial, Commercial, and Residential. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

List of Key Companies Profiled

  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • NXP Semiconductors N.V.
  • Rohm Co., Ltd.
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Semtech Corporation
  • Microchip Technology Incorporated
  • ON Semiconductor Corporation
  • Renesas Electronics Corporation

Market Report Segmentation

By Transistor Type (Volume, Million Units, USD Billion, 2019-2030)
  • MOSFET
  • IGBT
By Semiconductor Material (Volume, Million Units, USD Billion, 2019-2030)
  • SiC
  • GaN
By Mode of Attachment (Volume, Million Units, USD Billion, 2019-2030)
  • On-chip
  • Discrete
By Application (Volume, Million Units, USD Billion, 2019-2030)
  • Industrial
  • Commercial
  • Residential
By Country (Volume, Million Units, USD Billion, 2019-2030)
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Gate Driver ICs Market, by Transistor Type
1.4.2 LAMEA Gate Driver ICs Market, by Semiconductor Material
1.4.3 LAMEA Gate Driver ICs Market, by Mode of Attachment
1.4.4 LAMEA Gate Driver ICs Market, by Application
1.4.5 LAMEA Gate Driver ICs Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Opportunities
3.2.3 Market Restraints
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Partnerships, Collaborations & Agreements : 2022, Jul - 2023, Nov) Leading Players
4.5 Porter’s Five Forces Analysis
Chapter 5. LAMEA Gate Driver ICs Market, By Transistor Type
5.1 LAMEA MOSFET Market, By Country
5.2 LAMEA IGBT Market, By Country
Chapter 6. LAMEA Gate Driver ICs Market, By Semiconductor Material
6.1 LAMEA SiC Market, By Country
6.2 LAMEA GaN Market, By Country
Chapter 7. LAMEA Gate Driver ICs Market, By Mode of Attachment
7.1 LAMEA On-chip Market, By Country
7.2 LAMEA Discrete Market, By Country
Chapter 8. LAMEA Gate Driver ICs Market, By Application
8.1 LAMEA Industrial Market, By Country
8.2 LAMEA Commercial Market, By Country
8.3 LAMEA Residential Market, By Country
Chapter 9. LAMEA Gate Driver ICs Market, By Country
9.1 Brazil Gate Driver ICs Market
9.1.1 Brazil Gate Driver ICs Market, By Transistor Type
9.1.2 Brazil Gate Driver ICs Market, By Semiconductor Material
9.1.3 Brazil Gate Driver ICs Market, By Mode of Attachment
9.1.4 Brazil Gate Driver ICs Market, By Application
9.2 Argentina Gate Driver ICs Market
9.2.1 Argentina Gate Driver ICs Market, By Transistor Type
9.2.2 Argentina Gate Driver ICs Market, By Semiconductor Material
9.2.3 Argentina Gate Driver ICs Market, By Mode of Attachment
9.2.4 Argentina Gate Driver ICs Market, By Application
9.3 UAE Gate Driver ICs Market
9.3.1 UAE Gate Driver ICs Market, By Transistor Type
9.3.2 UAE Gate Driver ICs Market, By Semiconductor Material
9.3.3 UAE Gate Driver ICs Market, By Mode of Attachment
9.3.4 UAE Gate Driver ICs Market, By Application
9.4 Saudi Arabia Gate Driver ICs Market
9.4.1 Saudi Arabia Gate Driver ICs Market, By Transistor Type
9.4.2 Saudi Arabia Gate Driver ICs Market, By Semiconductor Material
9.4.3 Saudi Arabia Gate Driver ICs Market, By Mode of Attachment
9.4.4 Saudi Arabia Gate Driver ICs Market, By Application
9.5 South Africa Gate Driver ICs Market
9.5.1 South Africa Gate Driver ICs Market, By Transistor Type
9.5.2 South Africa Gate Driver ICs Market, By Semiconductor Material
9.5.3 South Africa Gate Driver ICs Market, By Mode of Attachment
9.5.4 South Africa Gate Driver ICs Market, By Application
9.6 Nigeria Gate Driver ICs Market
9.6.1 Nigeria Gate Driver ICs Market, By Transistor Type
9.6.2 Nigeria Gate Driver ICs Market, By Semiconductor Material
9.6.3 Nigeria Gate Driver ICs Market, By Mode of Attachment
9.6.4 Nigeria Gate Driver ICs Market, By Application
9.7 Rest of LAMEA Gate Driver ICs Market
9.7.1 Rest of LAMEA Gate Driver ICs Market, By Transistor Type
9.7.2 Rest of LAMEA Gate Driver ICs Market, By Semiconductor Material
9.7.3 Rest of LAMEA Gate Driver ICs Market, By Mode of Attachment
9.7.4 Rest of LAMEA Gate Driver ICs Market, By Application
Chapter 10. Company Profiles
10.1 Infineon Technologies AG
10.1.1 Company Overview
10.1.2 Financial Analysis
10.1.3 Segmental and Regional Analysis
10.1.4 Research & Development Expense
10.1.5 Recent strategies and developments:
10.1.5.1 Partnerships, Collaborations, and Agreements:
10.1.5.2 Acquisition and Mergers:
10.1.6 SWOT Analysis
10.2 Mitsubishi Electric Corporation
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Research & Development Expense
10.2.5 Recent strategies and developments:
10.2.5.1 Partnerships, Collaborations, and Agreements:
10.2.5.2 Acquisition and Mergers:
10.2.6 SWOT Analysis
10.3 NXP Semiconductors N.V.
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Regional Analysis
10.3.4 Research & Development Expense
10.3.5 Recent strategies and developments:
10.3.5.1 Partnerships, Collaborations, and Agreements:
10.3.5.2 Product Launches and Product Expansions:
10.3.6 SWOT Analysis
10.4 Rohm Co., Ltd.
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Segmental and Regional Analysis
10.4.4 Research & Development Expense
10.4.5 Recent strategies and developments:
10.4.5.1 Partnerships, Collaborations, and Agreements:
10.4.6 SWOT Analysis
10.5 STMicroelectronics N.V.
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Segmental and Regional Analysis
10.5.4 Research & Development Expense
10.5.5 Recent strategies and developments:
10.5.5.1 Partnerships, Collaborations, and Agreements:
10.5.5.2 Product Launches and Product Expansions:
10.5.5.3 Acquisition and Mergers:
10.5.6 SWOT Analysis
10.6 Toshiba Corporation
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Segmental and Regional Analysis
10.6.4 Research and Development Expense
10.6.5 Recent strategies and developments:
10.6.5.1 Product Launches and Product Expansions:
10.6.6 SWOT Analysis
10.7 Semtech Corporation
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Regional & Segmental Analysis
10.7.4 Product Development and Engineering expenses
10.7.5 Recent strategies and developments:
10.7.5.1 Acquisition and Mergers:
10.7.6 SWOT Analysis
10.8 Microchip Technology Incorporated
10.8.1 Company Overview
10.8.2 Financial Analysis
10.8.3 Segmental and Regional Analysis
10.8.4 Research & Development Expenses
10.8.5 Recent strategies and developments:
10.8.5.1 Acquisition and Mergers:
10.8.6 SWOT Analysis
10.9 ON Semiconductor Corporation
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 Segmental and Regional Analysis
10.9.4 Research & Development Expense
10.9.5 Recent strategies and developments:
10.9.5.1 Acquisition and Mergers:
10.9.6 SWOT Analysis
10.10. Renesas Electronics Corporation
10.10.1 Company Overview
10.10.2 Financial Analysis
10.10.3 Segmental and Regional Analysis
10.10.4 Research & Development Expense
10.10.5 Recent strategies and developments:
10.10.5.1 Acquisition and Mergers:
10.10.6 SWOT Analysis

Companies Mentioned

  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • NXP Semiconductors N.V.
  • Rohm Co., Ltd.
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Semtech Corporation
  • Microchip Technology Incorporated
  • ON Semiconductor Corporation
  • Renesas Electronics Corporation

Methodology

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