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LAMEA Semiconductor Etch Equipment Market Size, Share & Industry Trends Analysis Report By Type (Dry and Wet), By Process, By End User (Integrated Device Manufacturers, Foundry and Memory Manufacturers), By Country and Growth Forecast, 2023 - 2030

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    Report

  • 133 Pages
  • December 2023
  • Region: Africa, Middle East
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5742170
The Latin America, Middle East and Africa Semiconductor Etch Equipment Market would witness market growth of 10.5% CAGR during the forecast period (2023-2030).

Chemical etching is not similar to physical etching as it employs a chemical reaction between reactive neutral species created within the plasma and the substrate material. Generally, chemical etching contains halide chemistries in which fluorine or chlorine atoms are the active agents in the etching process. Representative chemistry for etching processes is the utilization of NF3 for silicon etching.

Many of the etching technologies utilized in the fabrication of modern device incorporate aspects of both chemical and physical etching. In a procedure similar to reactive ion etching (RIE), directional etching is attained by biasing the substrate so that ionic species from the plasma are accelerated towards the substrate surface. There they interact with the surface and the reactive neutrals to create volatile products that can be pumped away.

The Emirates of Abu Dhabi introduced a governance framework with a specific tariff for electric vehicle charging within Emirate. In addition, the Department of Energy has submitted a regulatory policy for electric vehicle charging infrastructure in the Emirates of Abu Dhabi. This sets out principles for ownership, management, and installation of electric vehicle supply equipment (EVSE), the electricity supply to EVSE, and pricing mechanism to end-customers. The government's support for eco-friendly vehicles and the increasing number of charging stations will propel the usage of EVs, thereby increasing automobile semiconductors and boosting the use of the semiconductor etch equipment market in the region.

The Brazil market dominated the LAMEA Semiconductor Etch Equipment Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $675.7 million by 2030. The Argentina market is experiencing a CAGR of 11.1% during (2023 - 2030). Additionally, The UAE market would exhibit a CAGR of 9.9% during (2023 - 2030).

Based on Type, the market is segmented into Dry and Wet. Based on Process, the market is segmented into Conductor and Dielectric. Based on End User, the market is segmented into Integrated Device Manufacturers, Foundry and Memory Manufacturers. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation), ULVAC, Inc., Hitachi High-Tech Corporation (Hitachi, Ltd.), Tokyo Electron Ltd., Applied Materials, Inc., SPTS Technologies Ltd. (KLA Corporation), ASML Holding N.V., Samco, Inc., EV Group, Suzhou Delphi Laser Co., Ltd and Lam Research Corporation.

Scope of the Study

Market Segments Covered in the Report:

By Type
  • Dry
  • Wet
By Process
  • Conductor
  • Dielectric
By End User
  • Integrated Device Manufacturers
  • Foundry
  • Memory Manufacturers
By Country
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
  • ULVAC, Inc.
  • Hitachi High-Tech Corporation (Hitachi, Ltd.)
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • SPTS Technologies Ltd. (KLA Corporation)
  • ASML Holding N.V.
  • Samco, Inc.
  • EV Group
  • Suzhou Delphi Laser Co., Ltd.
  • Lam Research Corporation

Unique Offerings

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Semiconductor Etch Equipment Market, by Type
1.4.2 LAMEA Semiconductor Etch Equipment Market, by Process
1.4.3 LAMEA Semiconductor Etch Equipment Market, by End User
1.4.4 LAMEA Semiconductor Etch Equipment Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition & Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.3 Porter Five Forces Analysis
Chapter 4. Strategies Deployed in Semiconductor Etch Equipment Market
Chapter 5. LAMEA Semiconductor Etch Equipment Market, By Type
5.1 LAMEA Dry Market, By Country
5.2 LAMEA Wet Market, By Country
Chapter 6. LAMEA Semiconductor Etch Equipment Market, By Process
6.1 LAMEA Conductor Market, By Country
6.2 LAMEA Dielectric Market, By Country
Chapter 7. LAMEA Semiconductor Etch Equipment Market, By End User
7.1 LAMEA Integrated Device Manufacturers Market, By Country
7.2 LAMEA Foundry Market, By Country
7.3 LAMEA Memory Manufacturers Market, By Country
Chapter 8. LAMEA Semiconductor Etch Equipment Market, By Country
8.1 Brazil Semiconductor Etch Equipment Market
8.1.1 Brazil Semiconductor Etch Equipment Market, By Type
8.1.2 Brazil Semiconductor Etch Equipment Market, By Process
8.1.3 Brazil Semiconductor Etch Equipment Market, By End User
8.2 Argentina Semiconductor Etch Equipment Market
8.2.1 Argentina Semiconductor Etch Equipment Market, By Type
8.2.2 Argentina Semiconductor Etch Equipment Market, By Process
8.2.3 Argentina Semiconductor Etch Equipment Market, By End User
8.3 UAE Semiconductor Etch Equipment Market
8.3.1 UAE Semiconductor Etch Equipment Market, By Type
8.3.2 UAE Semiconductor Etch Equipment Market, By Process
8.3.3 UAE Semiconductor Etch Equipment Market, By End User
8.4 Saudi Arabia Semiconductor Etch Equipment Market
8.4.1 Saudi Arabia Semiconductor Etch Equipment Market, By Type
8.4.2 Saudi Arabia Semiconductor Etch Equipment Market, By Process
8.4.3 Saudi Arabia Semiconductor Etch Equipment Market, By End User
8.5 South Africa Semiconductor Etch Equipment Market
8.5.1 South Africa Semiconductor Etch Equipment Market, By Type
8.5.2 South Africa Semiconductor Etch Equipment Market, By Process
8.5.3 South Africa Semiconductor Etch Equipment Market, By End User
8.6 Nigeria Semiconductor Etch Equipment Market
8.6.1 Nigeria Semiconductor Etch Equipment Market, By Type
8.6.2 Nigeria Semiconductor Etch Equipment Market, By Process
8.6.3 Nigeria Semiconductor Etch Equipment Market, By End User
8.7 Rest of LAMEA Semiconductor Etch Equipment Market
8.7.1 Rest of LAMEA Semiconductor Etch Equipment Market, By Type
8.7.2 Rest of LAMEA Semiconductor Etch Equipment Market, By Process
8.7.3 Rest of LAMEA Semiconductor Etch Equipment Market, By End User
Chapter 9. Company Profiles
9.1 Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Partnerships, Collaborations, and Agreements:
9.1.6 SWOT Analysis
9.2 ULVAC, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments:
9.2.5.1 Partnerships, Collaborations, and Agreements:
9.2.5.2 Product Launches and Product Expansions:
9.2.6 SWOT Analysis
9.3 Hitachi High-Tech Corporation (Hitachi, Ltd.)
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expenses
9.3.5 Recent strategies and developments:
9.3.5.1 Product Launches and Product Expansions:
9.3.6 SWOT Analysis
9.4 Tokyo Electron Ltd.
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Product Launches and Product Expansions:
9.4.5.2 Partnerships, Collaborations and Agreements:
9.4.6 SWOT Analysis
9.5 Applied Materials, Inc.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expenses
9.5.5 Recent strategies and developments:
9.5.5.1 Product Launches and Product Expansions:
9.5.6 SWOT Analysis
9.6 SPTS Technologies Ltd. (KLA Corporation)
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 SWOT Analysis
9.7 ASML Holding N.V.
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 SWOT Analysis
9.8 Samco, Inc.
9.8.1 Company Overview
9.8.2 Recent strategies and developments:
9.8.2.1 Product Launches and Product Expansions:
9.8.3 SWOT Analysis
9.9 EV Group
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. Suzhou Delphi Laser Co., Ltd.
9.10.1 Company Overview
9.10.2 SWOT Analysis
9.11 Lam Research Corporation
9.11.1 Company Overview
9.11.2 Financial Analysis
9.11.3 Primary markets and Regional Analysis
9.11.4 Research & Development Expenses
9.11.5 Recent strategies and developments:
9.11.5.1 Product Launches and Product Expansions:
9.11.5.2 Acquisition and Mergers:
9.11.5.3 Geographical Expansions:
9.11.6 SWOT Analysis

Companies Mentioned

  • Oracle Corporation
  • Trilliant Holdings, Inc.
  • Itron, Inc.
  • Arad Group
  • Siemens AG
  • ABB Group
  • Honeywell International, Inc.
  • Eaton Corporation PLC
  • Hubbell Incorporated
  • Hansen Technologies, Ltd.

Methodology

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