LAMEA Wafer Cleaning Equipment Market Size, Share & Industry Trends Analysis Report By Equipment Type, By Application (Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others), By Wafer Size, By Country and Growth Forecast, 2023 - 2030

The Latin America, Middle East and Africa Wafer Cleaning Equipment Market would witness market growth of 12.1% CAGR during the forecast period (2023-2030). In the year 2026, the LAMEA market's volume is expected to surge to 44.8 thousand units, showcasing a growth of 14.6% (2023-2030).

Compound semiconductor technologies have recently seen several technological developments. For instance, significant technical developments have increased the demand for GaN semiconductor devices in various applications. Advanced GaN crystal growth techniques such as metal organic chemical vapor deposition (MOCVD) and molecular epitaxy (MBE) are implemented in their manufacturing procedures. These techniques produce GaN materials with lower defect densities and higher quality. GaN-on-silicon technology, for example, is being investigated by researchers because it lowers the cost of GaN devices and enhances thermal performance, while GaN-on-GaN technology is emerging because it enables GaN semiconductor devices to have high breakdown tolerance and scalability.

This market has expanded as a result of the rise in the usage of consumer electronics like smartphones and tablets. The pace of the industry's growth has been dramatically accelerated by the emergence of new technologies and the rise in customer demand for increasingly sophisticated smartphones and tablets. The need for semiconductor wafers has increased due to the explosive growth of the tablet and smartphone industries, increasing the demand.

According to the International Trade Administration, several Latin American countries have acknowledged the strategic value of semiconductor manufacturing and have launched programs to encourage domestic semiconductor manufacturing. These initiatives may include incentives, funding, and assistance for research and development in semiconductor disciplines. Increasing demand for these devices has spurred interest in semiconductor manufacturing capabilities within the region. As LAMEA region has been developing a technology start-up ecosystem that may explore semiconductor-related innovations and applications in upcoming years, it will also propel the development of the market.

The Brazil market dominated the LAMEA Wafer Cleaning Equipment Market, by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $360.7 million by 2030. The Argentina market is estimated to grow at a CAGR of 12.7% during (2023 - 2030). Additionally, The UAE market would exhibit a CAGR of 11.8% during (2023 - 2030).

Based on Equipment Type, the market is segmented into Batch Spray Cleaning System, Batch Immersion Cleaning System, Single Wafer Cryogenic System, Single Wafer Spray System, and Scrubbers. Based on Application, the market is segmented into Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others. Based on Wafer Size, the market is segmented into 300 mm, 200 mm and Less than Equals 150 mm. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Tokyo Electron Ltd., SCREEN Holdings Co., Ltd., Applied Materials, Inc., Lam Research Corporation, Veeco Instruments, Inc., Axus Technology, Entegris, Inc. (Sumitomo Mitsui Financial Group), SEMES Co., Ltd. (Samsung Electronics Co., Ltd), Ultron Systems, Inc., and Toho Technology Co., Ltd.

Scope of the Study

Market Segments Covered in the Report:

By Equipment Type (Volume, Thousand units, USD Million, 2019-2030)

• Batch Spray Cleaning System
• Batch Immersion Cleaning System
• Single Wafer Cryogenic System
• Single Wafer Spray System
• Scrubbers

By Application (Volume, Thousand units, USD Million, 2019-2030)

• Memory
• Interposer
• MEMS
• Logic
• CIS
• LED
• RF Device
• Others

By Wafer Size (Volume, Thousand units, USD Million, 2019-2030)

• 300 mm
• 200 mm
• Less than Equals 150 mm

By Country (Volume, Thousand Units, USD Million, 2019-2030)

• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

• Tokyo Electron Ltd.
• SCREEN Holdings Co., Ltd
• Applied Materials, Inc.
• Lam Research Corporation
• Veeco Instruments, Inc.
• Axus Technology
• Entegris, Inc. (Sumitomo Mitsui Financial Group)
• SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
• Ultron Systems, Inc.
• Toho Technology Co., Ltd.

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