The North America Board-to-Board Connectors Market should witness market growth of 5.7% CAGR during the forecast period (2023-2030). In the year 2019, the North America market's volume surged to 487.1 million units, showcasing a growth of 2.4% (2019-2022).
An electrical connector known as a board-to-board connector is utilized to connect printed circuit boards (PCBs) to one another. They are among the primary categories of electronic parts. All board-to-board connections have two fundamental components: male and female connectors that snap together to establish a connection. There are numerous kinds of board-to-board connectors, all of which have a unique set of features and advantages. The most popular kind is called a pin header, consisting of a straightforward row of metal pins that may be put into corresponding holes on another PCB. Typically, pin headers are employed for low-density connections between two PCBs, like those in computer motherboards.
The market is expanding due to the rising need for electronic gadgets. Effective interconnectivity solutions are required because of the increasing adoption of tablets, smartphones, wearables, Internet of Things devices, and other electronic systems. Modern board-to-board connectors are necessary for technological breakthroughs in industries including consumer electronics, healthcare, industrial automation, and telecommunications.
As more companies see the advantages of renting from a colocation facility rather than creating their data centre infrastructure, colocation data centres are growing in popularity in the area. Incorporating technologies such as networks and connectivity devices is rapidly raising the complexity of infrastructure facilities. There will likely be more data centres in the North American region due to all these factors. The regional market is projected to expand in tandem with the expanding number of data centres in the region.
The US market dominated the North America Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,505.8 million by 2030. The Canada market is experiencing a CAGR of 8.1% during (2023-2030). Additionally, The Mexico market would exhibit a CAGR of 7.2% during (2023-2030).
Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
An electrical connector known as a board-to-board connector is utilized to connect printed circuit boards (PCBs) to one another. They are among the primary categories of electronic parts. All board-to-board connections have two fundamental components: male and female connectors that snap together to establish a connection. There are numerous kinds of board-to-board connectors, all of which have a unique set of features and advantages. The most popular kind is called a pin header, consisting of a straightforward row of metal pins that may be put into corresponding holes on another PCB. Typically, pin headers are employed for low-density connections between two PCBs, like those in computer motherboards.
The market is expanding due to the rising need for electronic gadgets. Effective interconnectivity solutions are required because of the increasing adoption of tablets, smartphones, wearables, Internet of Things devices, and other electronic systems. Modern board-to-board connectors are necessary for technological breakthroughs in industries including consumer electronics, healthcare, industrial automation, and telecommunications.
As more companies see the advantages of renting from a colocation facility rather than creating their data centre infrastructure, colocation data centres are growing in popularity in the area. Incorporating technologies such as networks and connectivity devices is rapidly raising the complexity of infrastructure facilities. There will likely be more data centres in the North American region due to all these factors. The regional market is projected to expand in tandem with the expanding number of data centres in the region.
The US market dominated the North America Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,505.8 million by 2030. The Canada market is experiencing a CAGR of 8.1% during (2023-2030). Additionally, The Mexico market would exhibit a CAGR of 7.2% during (2023-2030).
Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).
Scope of the Study
By Type (Volume, Million Units, USD Million, 2019-2030)
- Pin Headers
- Stacked Header
- Shrouded Header
- Socket
By Pitch (Volume, Million Units, USD Million, 2019-2030)
- 1 mm to 2 mm
- Greater Than 2 mm
- Less Than 1 mm
By Application (Volume, Million Units, USD Million, 2019-2030)
- Consumer Electronics
- Automotive
- Industrial Automation
- Healthcare
- Telecommunication
- Others
By Country (Volume, Million Units, USD Million, 2019-2030)
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Amphenol Corporation
- TE Connectivity Ltd.
- Molex, LLC (Koch Industries, Inc.)
- Kyocera Corporation
- HARTING Technology Group
- Omron Corporation
- Japan Aviation Electronics Industry, Limited
- Hirose Electric Co., Ltd
- Samtec
- FIT Hon Teng Limited (Foxconn (Far East) Limited)
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- Exhaustive coverage
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. North America Board-to-Board Connectors Market by Type
Chapter 6. North America Board-to-Board Connectors Market by Pitch
Chapter 7. North America Board-to-Board Connectors Market by Application
Chapter 8. North America Board-to-Board Connectors Market by Country
Chapter 9. Company Profiles
Companies Mentioned
- Amphenol Corporation
- TE Connectivity Ltd.
- Molex, LLC (Koch Industries, Inc.)
- Kyocera Corporation
- HARTING Technology Group
- Omron Corporation
- Japan Aviation Electronics Industry, Limited
- Hirose Electric Co., Ltd
- Samtec
- FIT Hon Teng Limited (Foxconn (Far East) Limited)
Methodology
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