The North America Embedded Die Packaging Technology Market would witness market growth of 17.9% CAGR during the forecast period (2022-2028).
The advantages of embedded die packaging technology include enhanced electrical and thermal performance, heterogeneous integration, simplified OEM logistics, and potential cost savings. In addition, laminate substrates often have embedded passive components. As a result, switching noise in high-speed digital packages has been reduced.
In the semiconductor business, embedded die packaging technology has improved technology, boosted yield, and raised the need for heterogeneous integration. As a result, the market need for embedded die packaging technology is anticipated to rise.
Additionally, customer desire for greater mobility, utility, and usability has fueled the rise of the electronics business for goods like portable handsets, tablets, and networking equipment. As a result, the need for functional convergence and integration of integrated circuit devices has increased, necessitating sophisticated packaging strategies. As a result, manufacturers can now apply integrated die packaging technology.
One of the key nations promoting market expansion in the region is the US, further followed by Canada. The significant demand for cutting-edge convertible & detachable dual-screen laptops for business applications is blamed for the development. The e-commerce industry is expected to continue generating large revenues in the future. In addition, the availability of product knowledge, choice, and generally lower prices offered by online shopping are anticipated to draw customers to purchase consumer electronics through online platforms. This expanding demand for consumer electronics is further anticipated to support the regional market growth for embedded die packaging die technology.
The US market dominated the North America Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $43,807.2 Thousands by 2028.The Canada market is poised to grow at a CAGR of 20.6% during (2022 - 2028). Additionally, The Mexico market would witness a CAGR of 19.5% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
The advantages of embedded die packaging technology include enhanced electrical and thermal performance, heterogeneous integration, simplified OEM logistics, and potential cost savings. In addition, laminate substrates often have embedded passive components. As a result, switching noise in high-speed digital packages has been reduced.
In the semiconductor business, embedded die packaging technology has improved technology, boosted yield, and raised the need for heterogeneous integration. As a result, the market need for embedded die packaging technology is anticipated to rise.
Additionally, customer desire for greater mobility, utility, and usability has fueled the rise of the electronics business for goods like portable handsets, tablets, and networking equipment. As a result, the need for functional convergence and integration of integrated circuit devices has increased, necessitating sophisticated packaging strategies. As a result, manufacturers can now apply integrated die packaging technology.
One of the key nations promoting market expansion in the region is the US, further followed by Canada. The significant demand for cutting-edge convertible & detachable dual-screen laptops for business applications is blamed for the development. The e-commerce industry is expected to continue generating large revenues in the future. In addition, the availability of product knowledge, choice, and generally lower prices offered by online shopping are anticipated to draw customers to purchase consumer electronics through online platforms. This expanding demand for consumer electronics is further anticipated to support the regional market growth for embedded die packaging die technology.
The US market dominated the North America Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $43,807.2 Thousands by 2028.The Canada market is poised to grow at a CAGR of 20.6% during (2022 - 2028). Additionally, The Mexico market would witness a CAGR of 19.5% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Scope of the Study
Market Segments Covered in the Report:
By Vertical
- Consumer Electronics
- IT & Telecommunication
- Automotive
- Healthcare
- Others
By Platform
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- General Electric (GE) Co
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd
- Amkor Technology, Inc
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Embedded Die Packaging Technology Market, by Vertical
1.4.2 North America Embedded Die Packaging Technology Market, by Platform
1.4.3 North America Embedded Die Packaging Technology Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Embedded Die Packaging Technology Market
Chapter 4. North America Embedded Die Packaging Technology Market by Vertical
4.1 North America Consumer Electronics Market by Country
4.2 North America IT & Telecommunication Market by Country
4.3 North America Automotive Market by Country
4.4 North America Healthcare Market by Country
4.5 North America Others Market by Country
Chapter 5. North America Embedded Die Packaging Technology Market by Platform
5.1 North America Embedded Die in IC Package Substrate Market by Country
5.2 North America Embedded Die in Rigid Board Market by Country
5.3 North America Embedded Die in Flexible Board Market by Country
Chapter 6. North America Embedded Die Packaging Technology Market by Country
6.1 US Embedded Die Packaging Technology Market
6.1.1 US Embedded Die Packaging Technology Market by Vertical
6.1.2 US Embedded Die Packaging Technology Market by Platform
6.2 Canada Embedded Die Packaging Technology Market
6.2.1 Canada Embedded Die Packaging Technology Market by Vertical
6.2.2 Canada Embedded Die Packaging Technology Market by Platform
6.3 Mexico Embedded Die Packaging Technology Market
6.3.1 Mexico Embedded Die Packaging Technology Market by Vertical
6.3.2 Mexico Embedded Die Packaging Technology Market by Platform
6.4 Rest of North America Embedded Die Packaging Technology Market
6.4.1 Rest of North America Embedded Die Packaging Technology Market by Vertical
6.4.2 Rest of North America Embedded Die Packaging Technology Market by Platform
Chapter 7. Company Profiles
7.1 General Electric (GE) Co.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expense
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Acquisition and Mergers:
7.2.5.2 Geographical Expansions:
7.2.6 SWOT Analysis
7.3 TDK Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional & Segmental Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.5.2 Acquisition and Mergers:
7.4 Fujikura Ltd.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments:
7.5.5.1 Geographical Expansions:
7.6 Taiwan Semiconductor Manufacturing Company Limited
7.6.1 Company overview
7.6.2 Financial Analysis
7.6.3 Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Partnerships, Collaborations, and Agreements:
7.7 ASE Group (ASE Technology Holding)
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expenses
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Product Launches and Product Expansions:
7.8 Microsemi Corporation (Microchip Technology)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Schweizer Electronic AG (Wus Printed Circuit)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expenses
7.10. AT&S Group
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
Companies Mentioned
- General Electric (GE) Co.
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd.
- Amkor Technology, Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
Methodology
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