Various technologies, including wet chemical cleaning, dry cleaning, aqueous cleaning, cryogenic aerosol, and supercritical fluid cleaning, ensure the successful elimination and neutralization of these objectionable elements from the wafer's surface. Single wafer cleaning refers to treating a single wafer at a time, whereas bulk wafer cleaning refers to the simultaneous treatment of multiple wafers.
The increased adoption of micro-electro-mechanical systems (MEMS) technology in both conventional and contemporary applications is fuelling this market. This growth is also a result of the expansion of crucial wafer cleaning steps. In addition, the rising demand for wafers with 3D structures and the increasing use of silicon-based sensors, processors, and diodes in Internet of Things (IoT) applications present market participants with enticing possibilities. With these wafers' help, manufacturers can produce many devices in a single production batch. The evolution of semiconductor devices made using 300 mm wafers was influenced by this factor, which is one of its driving forces.
North America hosts numerous semiconductor fabrication facilities (fabs) producing a wide range of semiconductor devices, including microprocessors, memory chips, and sensors. Wafer cleaning equipment is critical in these fabs to ensure the cleanliness and quality of silicon wafers at various stages of the manufacturing process, such as after chemical mechanical planarization (CMP) and before photolithography. Moreover, the region is a hub for emerging technologies such as quantum computing, photonics, and advanced materials. It is used to develop and prototype components for these technologies. Therefore, with the growth of semiconductor usage in multiple sectors, the market is anticipated to grow.
The US market dominated the North America Wafer Cleaning Equipment Market, by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $3.3 billion by 2030. The Canada market is poised to grow at a CAGR of 11.1% during (2023 - 2030). Additionally, The Mexico market would witness a CAGR of 10.1% during (2023 - 2030).
Based on Equipment Type, the market is segmented into Batch Spray Cleaning System, Batch Immersion Cleaning System, Single Wafer Cryogenic System, Single Wafer Spray System, and Scrubbers. Based on Application, the market is segmented into Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others. Based on Wafer Size, the market is segmented into 300 mm, 200 mm and Less than Equals 150 mm. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Tokyo Electron Ltd., SCREEN Holdings Co., Ltd., Applied Materials, Inc., Lam Research Corporation, Veeco Instruments, Inc., Axus Technology, Entegris, Inc. (Sumitomo Mitsui Financial Group), SEMES Co., Ltd. (Samsung Electronics Co., Ltd), Ultron Systems, Inc., and Toho Technology Co., Ltd.
Scope of the Study
Market Segments Covered in the Report:
By Equipment Type (Volume, Thousand units, USD Million, 2019-2030)- Batch Spray Cleaning System
- Batch Immersion Cleaning System
- Single Wafer Cryogenic System
- Single Wafer Spray System
- Scrubbers
- Memory
- Interposer
- MEMS
- Logic
- CIS
- LED
- RF Device
- Others
- 300 mm
- 200 mm
- Less than Equals 150 mm
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Tokyo Electron Ltd.
- SCREEN Holdings Co., Ltd
- Applied Materials, Inc.
- Lam Research Corporation
- Veeco Instruments, Inc.
- Axus Technology
- Entegris, Inc. (Sumitomo Mitsui Financial Group)
- SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
- Ultron Systems, Inc.
- Toho Technology Co., Ltd.
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Table of Contents
Companies Mentioned
- Tokyo Electron Ltd.
- SCREEN Holdings Co., Ltd
- Applied Materials, Inc.
- Lam Research Corporation
- Veeco Instruments, Inc.
- Axus Technology
- Entegris, Inc. (Sumitomo Mitsui Financial Group)
- SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
- Ultron Systems, Inc.
- Toho Technology Co., Ltd.
Methodology
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