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The semiconductor chip packaging market is forecasted to grow by USD 993.4 billion during 2023-2028, accelerating at a CAGR of 37.32% during the forecast period. The report on the semiconductor chip packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing investment in fabrication facilities, rising integration of ics in automobiles, and increase in number of fabless semiconductor companies.
The semiconductor chip packaging market is segmented as below:
By Packaging
- 3DIC TSV stacks
- 2.5D interposers
- Flip-chip wafer bumping
- FO WLP/SiP
- Others
By End-user
- OSATs
- IDMs
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the semiconductor chip packaging market covers the following areas:
- Semiconductor chip packaging market sizing
- Semiconductor chip packaging market forecast
- Semiconductor chip packaging market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Packaging
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global semiconductor chip packaging market: 3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASMPT Ltd., ChipMOS TECHNOLOGIES INC., GlobalFoundaries Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., Skywater Technology, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is growing investments in lower technology node."
According to the report, one of the major drivers for this market is the growing investment in fabrication facilities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- 3M Co.
- Amkor Technology Inc.
- Applied Materials Inc.
- ASE Technology Holding Co. Ltd.
- ASMPT Ltd.
- ChipMOS TECHNOLOGIES INC.
- GlobalFoundaries Inc.
- Jiangsu Changdian Technology Co. Ltd.
- Kulicke and Soffa Industries Inc.
- Microchip Technology Inc.
- nepes Corp.
- Powertech Technology Inc.
- Skywater Technology
- SUSS MICROTEC SE
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Tokyo Electron Ltd.
- Unisem M Berhad
- UTAC Holdings Ltd.
- Veeco Instruments Inc.
