The through-hole passive components market size is expected to see strong growth in the next few years. It will grow to $50.89 billion in 2028 at a compound annual growth rate (CAGR) of 7.0%. In the anticipated forecast period, growth is expected to be driven by several key factors, including the expansion of renewable energy systems, advancements in smart grid technologies, the widespread expansion of the Internet of Things (IoT), the burgeoning growth of the electric vehicles (EVs) market, and the deployment of 5G networks.
The surge in demand for consumer electronic devices drives the anticipated growth of the through-hole passive component market. These devices encompass gadgets featuring electronic circuitry intended for daily individual use. The rising adoption of smart home devices, wearables, and connected gadgets fuels the demand for electrical components, elevating the popularity of through-hole passive components. For instance, data from the U.S. Census Bureau in January 2023 revealed a substantial $3.37 billion increase in monthly retail sales of electronics and appliances in May 2022 compared to previous years. This escalating demand for consumer electronics is poised to fuel the through-hole passive component market.
Anticipated growth in the automotive industry is set to propel the through-hole passive component market. This sector comprises vehicle design, development, manufacturing, and sales. Through-hole passive components play a pivotal role in the automotive industry, ensuring robust and durable electronic circuitry for various vehicle applications. For example, in May 2023, the European Automobile Manufacturers Association reported a 5.7% global vehicle production increase to 85.4 million units in 2022 compared to the previous year. Thus, the burgeoning automotive industry demand fuels the through-hole passive component market.
Product innovation drives momentum within the through-hole passive component market. Key industry players are committed to pioneering inventive solutions, fortifying their market foothold. For example, in January 2023, Diodes Incorporated, a semiconductor manufacturer and supplier, introduced its inaugural line of silicon carbide (SiC) Schottky barrier diodes (SBD). Featuring a portfolio of eight 1200V products (2A, 5A, and 10A) and eleven 650V products, these diodes from the DSCxx120 and DSCxxA065 series promise higher efficiency and temperature resilience. Their wide bandgap addresses market demands for reduced system operational costs and maintenance.
Strategic partnerships take precedence among major players in the through-hole passive component market, allowing companies to harness collective strengths and resources for mutual growth. For instance, in August 2022, VPG Foil Resistors, a US-based provider of stable resistors, collaborated with Supreme Components International (SCI), a Singapore-based high-tech electronic and LED components firm. This partnership aims to furnish customers with a diverse selection of highly precise bulk metal foil resistors, bolstering VPG Foil Resistors' standing as a distributor of top-notch electronic components.
In July 2022 saw Littelfuse Inc., a US-based electronic manufacturing firm, finalizing the acquisition of C&K Switches Inc. The undisclosed acquisition enhances both companies' technological capacities, enabling them to offer comprehensive solutions across diverse industry verticals. C&K Switches Inc., based in the US, is known for developing, producing, and distributing electromechanical equipment.
Major companies operating in the through-hole passive components market report are Panasonic Holdings Corporation, Fujitsu Ltd., Texas Instruments Inc., TE Connectivity Ltd., TDK Corporation, Infineon Technologies AG, Murata Manufacturing Co. Ltd., NXP Semiconductors NV, Microchip Technology Inc., Rohm Co. Ltd., YAGEO Corp., Vishay Intertechnology Inc., Bourns Inc., Taiyo Yuden Co. Ltd., Würth Elektronik Group, AVX Corporation, Nichicon Corporation, KEMET Corporation, Nippon Chemi-Con Corporation, KYOCERA AVX Components Corporation, Rubycon Corporation, Holy Stone Enterprise Co. Ltd., EPCOS AG, Lelon Electronics Corp., Elna Co. Ltd., Sagami Elec Co. Ltd., Cornell Dubilier Electronics Inc., KOA Speer Electronics Inc., NIC Components Corporation, WIMA GmbH & Co. KG.
Asia-Pacific was the largest region in the through-hole passive component market in 2023, is expected to be the fastest-growing region in the global through-hole passive component market report during the forecast period. The regions covered in the through-hole passive components market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the through-hole passive components market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Through-hole passive components consist of various essential elements including resistors, capacitors, inductors, diodes, transducers, sensors, and additional components. A resistor, specifically, functions as an electrical component that controls or regulates the flow of electrical current within an electronic circuit. It is accessible in lead models such as axial and radial configurations, catering to a wide array of applications spanning consumer electronics, automotive, industrial machinery, IT and telecommunications, aerospace and defense, healthcare, life sciences, and other diverse industries.
The through-hole passive component market research report is one of a series of new reports that provides through-hole passive component market statistics, including through-hole passive component industry global market size, regional shares, competitors with a through-hole passive component market share, detailed through-hole passive component market segments, market trends and opportunities, and any further data you may need to thrive in the through-hole passive component industry. This through-hole passive component market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The through-hole passive component market consists of sales of electronics components such as axial lead and radial lead. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
Table of Contents
Executive Summary
Through-Hole Passive Components Global Market Report 2024 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on through-hole passive components market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
Reasons to Purchase
- Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
- Understand how the market has been affected by the coronavirus and how it is responding as the impact of the virus abates.
- Assess the Russia-Ukraine war’s impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
- Measure the impact of high global inflation on market growth.
- Create regional and country strategies on the basis of local data and analysis.
- Identify growth segments for investment.
- Outperform competitors using forecast data and the drivers and trends shaping the market.
- Understand customers based on the latest market shares.
- Benchmark performance against key competitors.
- Suitable for supporting your internal and external presentations with reliable high quality data and analysis.
- Report will be updated with the latest data and delivered to you with an Excel data sheet for easy data extraction and analysis.
- All data from the report will also be delivered in an excel dashboard format.
Where is the largest and fastest growing market for through-hole passive components? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? This report answers all these questions and many more.
The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include:
- The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.
- The impact of higher inflation in many countries and the resulting spike in interest rates.
- The continued but declining impact of COVID-19 on supply chains and consumption patterns.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Report Scope
Markets Covered:1) By Component: Resistors; Capacitors; Inductors; Diodes; Transducers; Sensors; Other Components
2) By Leads Model: Axial; Radial
3) By Application: Consumer Electronics; Automotive; Industrial; IT and Telecom; Aerospace and Defense; Healthcare and Life Sciences; Other Applications
Key Companies Mentioned: Panasonic Holdings Corporation; Fujitsu Ltd.; Texas Instruments Inc.; TE Connectivity Ltd.; TDK Corporation
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes
Delivery Format: PDF, Word and Excel Data Dashboard
Companies Mentioned
- Panasonic Holdings Corporation
- Fujitsu Ltd.
- Texas Instruments Inc.
- TE Connectivity Ltd.
- TDK Corporation
- Infineon Technologies AG
- Murata Manufacturing Co. Ltd.
- NXP Semiconductors NV
- Microchip Technology Inc.
- Rohm Co. Ltd.
- YAGEO Corp.
- Vishay Intertechnology Inc.
- Bourns Inc.
- Taiyo Yuden Co. Ltd.
- Würth Elektronik Group
- AVX Corporation
- Nichicon Corporation
- KEMET Corporation
- Nippon Chemi-Con Corporation
- KYOCERA AVX Components Corporation
- Rubycon Corporation
- Holy Stone Enterprise Co. Ltd.
- EPCOS AG
- Lelon Electronics Corp.
- Elna Co. Ltd.
- Sagami Elec Co. Ltd.
- Cornell Dubilier Electronics Inc.
- KOA Speer Electronics Inc.
- NIC Components Corporation
- WIMA GmbH & Co. KG
Methodology
LOADING...