Innovations in AI chips, wireless charging, smart lighting, Heads-up Displays, VCSELs, and Advanced Data Storage

This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in AI-chipsets, wearables, wireless charging VCSELs, advanced data storage, and HUDs. Innovations include bio-impedance analysis tracker to measure body composition, quantum dot-based smart diffuser, heads-up display for flight data, non-volatile memory using silicon oxide, digitally controlled RF GaN amplifier, 3D chip packaging, and automated reactor technology for VCSEL production.

The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.