Development of Packaging and Products for Use in Microwave Ovens. Edition No. 2. Woodhead Publishing in Materials

Authors

Ulrich Erle Expert for cooking technologies and food science, Nestl� Development Center in Solon/Ohio. Ulrich Erle is an expert for cooking technologies and food science at the Nestl� Development Center in Solon/Ohio. During his assignments as project manager and senior scientific advisor he gained experience in the industrial application of microwaves in vacuum drying and sterilization processes. More recently, he concentrated on the performance of food products for household microwave ovens, including innovative packaging solutions. Ulrich is a member of the Board of Governors of the International Microwave Power Institute (IMPI) and also chaired the 50th IMPI Symposium in Orlando. He represents Nestl� in the Center for Advanced Processing and Packaging Studies (CAPPS) and in the RF Energy Alliance. Peter Pesheck General Mills, USA. Peter Pesheck is currently Principal at Food Biophysics, LLC. In his 34-year R&D career at Pillsbury and General Mills he worked primarily in cross-business Strategic Technology groups, where he specialized in structure-function relationships, microscopy, modeling, microwave heating (food dielectric properties, simulation, product design and problem resolution), and wheat flour doughs and their structural transformations in proofing and baking. He has published 4 papers in reviewed journals and holds 19 U.S. patents. Matthew Lorence Packaging Technology Manager at Bellisio Foods, Inc. Matthew Lorence is currently a Packaging Technology Manager at Bellisio Foods, Inc. He is a leader in the field of packaging R&D for consumer and industrial products, and medical devices. He was previously Packaging Technology Manager at General Mills. He holds 13 U.S. patents and has extensive experience in identifying, developing, and commercializing convenient Total Product Offerings leveraging Open Innovation for new packaging and product technologies.