+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

A Review: Ultrahigh-Vacuum Technology for Electron Microscopes

  • Book

  • February 2020
  • Elsevier Science and Technology
  • ID: 4829322

A Review: Ultrahigh-Vacuum Technology for Electron Microscopes provides information on the fundamentals of ultra-high vacuum systems. It covers the very subtle process that can help increase pressure inside the microscope (or inside any other ultra-high vacuum system) and the different behavior of the molecules contributing to this kind of process. Prof Yoshimura's book offers detailed information on electron microscope components, as well as UHV technology. This book is an ideal resource for industrial microscopists, engineers and scientists responsible for the design, operation and maintenance of electron microscopes. In addition, engineering students or engineers working with electron microscopes will find it useful.

Please Note: This is an On Demand product, delivery may take up to 11 working days after payment has been received.

Table of Contents

1. Phenomena Induced by Fine Electron-Probe Irradiation2. Electron Induced Gas Desorption3. Microdischarges in High Vacuum4. Sputter-Ion Pump (SIP) for Extreme-High-Vacuum Use5. Development of Diffusion Pump (DP) System for Electron Microscopes

Authors

Nagamitsu Yoshimura Formerly, Japan Electron Optics Laboratory (JEOL). In 1965 he graduated from Osaka Prefecture University, Engineering Division and immediately began working for JEOL LTD. In 1985 he received a Doctor of Engineering degree from Osaka Prefecture University. His Ph.D. Thesis was on "Research and Development of High-Vacuum System of Electron Microscopes� (in Japanese). In 1995 he qualified as a consultant engineer in the field. From 1965 to 2002 he engaged in research and development of vacuum-related technology in electron microscopes for more than 35 years at JEOL-group companies. He retired in 2002. He has authored 2 books for Springer.