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G.Fast Chipsets - Global Strategic Business Report

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    Report

  • 223 Pages
  • November 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 4845750
The global market for G.Fast Chipsets was estimated at US$3.5 Billion in 2023 and is projected to reach US$16.9 Billion by 2030, growing at a CAGR of 25.5% from 2023 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions.

Global G.Fast Chipsets Market - Key Trends and Drivers Summarized

How Are G.fast Chipsets Transforming Broadband Connectivity and Telecommunications?

G.fast chipsets are revolutionizing broadband connectivity by enabling ultra-fast internet speeds over existing copper telephone lines, helping telecommunications companies deliver gigabit-level speeds without the need for costly fiber optic installations to every home. G.fast technology, which stands for 'Gigabit fast,' is a digital subscriber line (DSL) technology designed to leverage the copper infrastructure that already exists in most urban areas. G.fast chipsets are the core components that make this possible, allowing internet service providers (ISPs) to offer high-speed broadband services, similar to fiber optic performance, by utilizing shorter copper loops.

The introduction of G.fast chipsets has been particularly significant in areas where upgrading to full fiber-to-the-home (FTTH) networks is cost-prohibitive or logistically challenging. By using G.fast, telecom operators can bring fiber to distribution points like street cabinets and use copper lines for the final connection, drastically reducing the need for new infrastructure. G.fast chipsets deliver speeds of up to 1 Gbps, supporting bandwidth-intensive applications like 4K video streaming, online gaming, cloud computing, and smart home technologies. As global demand for high-speed internet grows, G.fast chipsets are playing a crucial role in bridging the digital divide and accelerating the rollout of gigabit broadband services.

What Technological Advancements Are Improving the Performance of G.fast Chipsets?

Several technological advancements are significantly enhancing the performance and capabilities of G.fast chipsets, making them more efficient and adaptable to varying network environments. One of the key innovations is the development of vectoring technology, which helps reduce interference between neighboring copper lines - also known as crosstalk. In multi-dwelling units (MDUs) and dense urban areas, where multiple copper lines run close together, crosstalk can significantly degrade signal quality. G.fast chipsets equipped with vectoring technology actively cancel this interference, allowing for more stable and higher-speed connections. As a result, G.fast networks can achieve higher bandwidths with improved reliability, even in challenging environments.

Another major advancement is the introduction of dynamic time allocation (DTA) in G.fast chipsets, which enables more efficient use of bandwidth based on network demand. DTA allows the chipset to allocate upstream and downstream bandwidth dynamically, adjusting to the real-time needs of the user. For example, if a household is uploading large files to the cloud, the chipset can temporarily increase upstream capacity to accommodate the data transfer, and then shift back to prioritizing downstream bandwidth for tasks like video streaming. This flexibility improves the overall user experience, making G.fast a more versatile solution for high-speed broadband, especially in environments with asymmetric bandwidth demands.

Further innovations include the expansion of G.fast to support higher frequencies and longer distances. Early versions of G.fast worked best over very short copper loops, typically under 300 meters, limiting its application in certain settings. However, advancements in chipset design have extended the reach of G.fast to approximately 500 meters or more, allowing it to be deployed in a wider range of scenarios, such as in rural areas or larger buildings. In addition, newer G.fast chipsets can operate at frequencies up to 212 MHz, enabling even faster data transmission and higher bandwidth availability. These technological improvements are making G.fast chipsets more adaptable to a variety of network conditions, ensuring that ISPs can deliver reliable gigabit broadband across different deployment scenarios.

How Are G.fast Chipsets Supporting the Rollout of Gigabit Broadband in Urban and Rural Areas?

G.fast chipsets are playing a crucial role in supporting the rollout of gigabit broadband services in both urban and rural areas, providing a cost-effective and efficient way to deliver high-speed internet without the need for full fiber deployment. In urban areas, especially in multi-dwelling units (MDUs) like apartment buildings and condominiums, G.fast is an ideal solution for delivering fiber-like speeds without the need to replace existing copper infrastructure. Telecom operators can deploy fiber to the building and use G.fast chipsets to deliver ultra-fast internet over the short copper loops that connect individual apartments, significantly reducing installation time and costs.

This ability to leverage existing infrastructure makes G.fast an attractive option in densely populated areas, where digging up streets to lay new fiber cables is both expensive and disruptive. By deploying G.fast technology in urban environments, telecom companies can offer gigabit speeds comparable to FTTH, enabling residents to access high-bandwidth services such as 4K and 8K video streaming, online gaming, and cloud-based applications. This approach also speeds up the rollout of high-speed internet services, as G.fast networks can be deployed more quickly than full fiber installations, allowing ISPs to meet growing demand for faster broadband in a shorter time frame.

In rural areas, where upgrading to full fiber is often financially or logistically challenging, G.fast chipsets provide an effective solution for bringing faster internet speeds to underserved communities. By extending the reach of fiber to nearby distribution points or nodes and using G.fast over the existing copper lines for the final connection, telecom operators can offer significant speed improvements without the high costs associated with laying fiber across long distances. This makes G.fast a key technology in addressing the digital divide, bringing gigabit broadband to rural and remote areas where internet access has traditionally lagged behind urban centers. As more countries push for nationwide gigabit-capable networks, G.fast chipsets are increasingly being deployed to provide a scalable, affordable path to ultra-fast broadband in both urban and rural regions.

What's Driving the Growth of the G.fast Chipset Market?

Several factors are driving the growth of the G.fast chipset market, including the rising global demand for high-speed internet, the increasing cost-effectiveness of upgrading copper networks, and government initiatives aimed at expanding broadband access. One of the primary drivers is the growing need for faster and more reliable broadband services as consumers adopt bandwidth-intensive applications such as streaming services, cloud computing, online gaming, and video conferencing. With the rise of 4K and 8K video, virtual reality, and smart home devices, traditional DSL and older copper-based technologies are no longer sufficient to meet the demand for high-speed internet. G.fast technology provides telecom operators with a practical solution to upgrade their networks to gigabit speeds without the massive investments required for full fiber deployment.

The cost-effectiveness of G.fast is another key factor contributing to market growth. Unlike fiber-to-the-home (FTTH) installations, which require significant infrastructure investment, G.fast leverages the existing copper infrastructure for the last-mile connection, reducing both deployment time and costs. This makes G.fast an attractive option for telecom companies looking to enhance broadband services while keeping costs manageable. As the demand for gigabit speeds increases, G.fast provides a bridge between legacy copper networks and full fiber infrastructure, allowing operators to deliver high-speed internet in areas where laying new fiber is either impractical or cost-prohibitive.

Government initiatives to expand broadband access and close the digital divide are also driving the adoption of G.fast chipsets. Many countries have set ambitious goals to provide gigabit-capable internet to all citizens, especially in underserved and rural areas. G.fast technology allows telecom operators to quickly and affordably upgrade their networks to meet these goals without having to replace entire copper networks with fiber. As governments continue to push for universal broadband access, G.fast chipsets will play a critical role in helping telecom providers achieve these objectives, particularly in areas where fiber installation is too expensive or difficult.

What Future Trends Are Shaping the Development of G.fast Chipsets?

Several emerging trends are shaping the future development of G.fast chipsets, including the integration of 5G technology, advancements in multi-gigabit G.fast solutions, and the convergence of hybrid fiber-copper networks. One of the most significant trends is the intersection of G.fast and 5G networks. As telecom operators roll out 5G infrastructure, they are increasingly relying on fiber for backhaul to support the high data rates and low latency required by 5G. G.fast technology is being used as a complementary solution, enabling operators to extend fiber to the premises or buildings without the need for full fiber deployment. By using G.fast to enhance the final connection over copper lines, operators can deliver gigabit speeds for 5G services in areas where it is not feasible to deploy fiber, creating a seamless, high-speed broadband experience for both fixed and mobile users.

Advancements in multi-gigabit G.fast technology are also shaping the future of this market. While current G.fast solutions typically offer speeds of up to 1 Gbps, newer versions of G.fast are being developed to support even higher speeds, approaching 2 Gbps and beyond. This multi-gigabit capability is critical for meeting the growing demands of data-intensive applications such as cloud gaming, virtual reality, and 8K video streaming. As consumer demand for ultra-fast internet continues to rise, the development of multi-gigabit G.fast chipsets will enable telecom operators to deliver cutting-edge broadband services without the need for full fiber installations, ensuring that G.fast remains a competitive technology in the evolving broadband landscape.

Another key trend is the convergence of hybrid fiber-copper networks, where G.fast plays an essential role in bridging the gap between fiber and copper infrastructure. Telecom operators are increasingly adopting hybrid network models that combine the strengths of fiber optics with the flexibility of copper to deliver gigabit speeds more efficiently. G.fast allows operators to extend fiber to neighborhood nodes or street cabinets and use existing copper wiring for the final connection to homes and businesses. This hybrid approach reduces the cost and complexity of full fiber deployment while still providing the high-speed internet required for modern applications. As the hybrid network model becomes more widespread, G.fast chipsets will continue to evolve to support higher speeds, longer distances, and more flexible network architectures.

As these trends unfold, the future of G.fast chipsets will be defined by advancements in multi-gigabit capabilities, integration with 5G networks, and the continued convergence of fiber and copper networks. These innovations will ensure that G.fast remains a vital technology for delivering high-speed broadband in a variety of deployment scenarios, from urban high-rises to rural communities. With ongoing developments in chipset design, G.fast technology is poised to play an even more prominent role in the global push for gigabit broadband connectivity.

Key Insights:

  • Market Growth: Understand the significant growth trajectory of the CPE Deployment segment, which is expected to reach US$9.5 Billion by 2030 with a CAGR of a 22.9%. The DPU Deployment segment is also set to grow at 29.4% CAGR over the analysis period.
  • Regional Analysis: Gain insights into the U.S. market, which was estimated at $1.0 Billion in 2023, and China, forecasted to grow at an impressive 24.5% CAGR to reach $2.9 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.

Why You Should Buy This Report:

  • Detailed Market Analysis: Access a thorough analysis of the Global G.Fast Chipsets Market, covering all major geographic regions and market segments.
  • Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
  • Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global G.Fast Chipsets Market.
  • Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.

Key Questions Answered:

  • How is the Global G.Fast Chipsets Market expected to evolve by 2030?
  • What are the main drivers and restraints affecting the market?
  • Which market segments will grow the most over the forecast period?
  • How will market shares for different regions and segments change by 2030?
  • Who are the leading players in the market, and what are their prospects?

Report Features:

  • Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2023 to 2030.
  • In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
  • Company Profiles: Coverage of major players in the G.Fast Chipsets market such as Broadcom Ltd., BT Group PLC, CenturyLink, Inc., Chongqing Polycomp International Corporation, Marvell Technology Group Ltd. and more.
  • Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.

Some of the 46 companies featured in this G.Fast Chipsets market report include:

  • Broadcom Ltd.
  • BT Group PLC
  • CenturyLink, Inc.
  • Chongqing Polycomp International Corporation
  • Marvell Technology Group Ltd.
  • Mediatek, Inc.
  • Metanoia Communications, Inc.
  • Qualcomm, Inc.
  • Sckipio Technologies
  • Swisscom AG

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Influencer Market Insights
  • Global Economic Update
  • G.Fast Chipsets - Global Key Competitors Percentage Market Share in 2024 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
  • Rising Demand for High-Speed Internet Services Drives Growth in G.Fast Chipset Market
  • Consumer Trends Toward Streaming Services and High-Bandwidth Applications
  • Role of G.Fast in Reducing Digital Divide in Urban and Rural Areas
  • Economic Analysis of G.Fast Deployment Compared to Full Fiber Solutions
  • Global Expansion of G.Fast Technology in Developing Telecom Markets
  • Role of G.Fast in Smart Home and IoT Connectivity
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World G.Fast Chipsets Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
  • Table 2: World Recent Past, Current & Future Analysis for G.Fast Chipsets by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 3: World 7-Year Perspective for G.Fast Chipsets by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2024 & 2030
  • Table 4: World Recent Past, Current & Future Analysis for CPE Deployment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 5: World 7-Year Perspective for CPE Deployment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • Table 6: World Recent Past, Current & Future Analysis for DPU Deployment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 7: World 7-Year Perspective for DPU Deployment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • Table 8: World Recent Past, Current & Future Analysis for Residential End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 9: World 7-Year Perspective for Residential End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
  • Table 10: World Recent Past, Current & Future Analysis for Commercial End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 11: World 7-Year Perspective for Commercial End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2024 & 2030
III. MARKET ANALYSIS
UNITED STATES
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
  • Table 12: USA Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 13: USA 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 14: USA Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 15: USA 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
CANADA
  • Table 16: Canada Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 17: Canada 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 18: Canada Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 19: Canada 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
JAPAN
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
  • Table 20: Japan Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 21: Japan 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 22: Japan Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 23: Japan 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
CHINA
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
  • Table 24: China Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 25: China 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 26: China Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 27: China 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
EUROPE
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
  • Table 28: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
  • Table 29: Europe 7-Year Perspective for G.Fast Chipsets by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2024 & 2030
  • Table 30: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 31: Europe 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 32: Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 33: Europe 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
FRANCE
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
  • Table 34: France Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 35: France 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 36: France Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 37: France 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
GERMANY
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
  • Table 38: Germany Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 39: Germany 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 40: Germany Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 41: Germany 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
ITALY
  • Table 42: Italy Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 43: Italy 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 44: Italy Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 45: Italy 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
UNITED KINGDOM
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
  • Table 46: UK Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 47: UK 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 48: UK Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 49: UK 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
REST OF EUROPE
  • Table 50: Rest of Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 51: Rest of Europe 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 52: Rest of Europe Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 53: Rest of Europe 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
ASIA-PACIFIC
  • G.Fast Chipsets Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
  • Table 54: Asia-Pacific Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 55: Asia-Pacific 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 56: Asia-Pacific Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 57: Asia-Pacific 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
REST OF WORLD
  • Table 58: Rest of World Recent Past, Current & Future Analysis for G.Fast Chipsets by Deployment Type - CPE Deployment and DPU Deployment - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 59: Rest of World 7-Year Perspective for G.Fast Chipsets by Deployment Type - Percentage Breakdown of Value Sales for CPE Deployment and DPU Deployment for the Years 2024 & 2030
  • Table 60: Rest of World Recent Past, Current & Future Analysis for G.Fast Chipsets by End-user - Residential End-User and Commercial End-User - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
  • Table 61: Rest of World 7-Year Perspective for G.Fast Chipsets by End-user - Percentage Breakdown of Value Sales for Residential End-User and Commercial End-User for the Years 2024 & 2030
IV. COMPETITION

Companies Mentioned

  • Broadcom Ltd.
  • BT Group PLC
  • CenturyLink, Inc.
  • Chongqing Polycomp International Corporation
  • Marvell Technology Group Ltd.
  • Mediatek, Inc.
  • Metanoia Communications, Inc.
  • Qualcomm, Inc.
  • Sckipio Technologies
  • Swisscom AG

Table Information