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The wire bonder equipment market is forecasted to grow by USD 227.5 million during 2023-2028, accelerating at a CAGR of 3.32% during the forecast period. The report on the wire bonder equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising electronics production across world, rising electronic content in automobiles, and increase in number of osat vendors.
The wire bonder equipment market is segmented as below:
By Product
- Ball bonders
- Stud-bump bonders
- Wedge bonders
By End-user
- OSAT
- IDM
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the wire bonder equipment market covers the following areas:
- Wire bonder equipment market sizing
- Wire bonder equipment market forecast
- Wire bonder equipment market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Product
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
360 degree market analysis
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global wire bonder equipment market: Accelonix Ltd., ASMPT Ltd., BE Semiconductor Industries NV, Bergen Group, Cirexx International, Corintech Ltd., DIAS Automation HK Ltd., F and K DELVOTEC Bondtechnik GmbH, F and S BONDTEC Semiconductor GmbH, Hesse GmbH, HYBOND Inc., Kulicke and Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., Powertech Technology Inc., Toray Industries Inc., TPT Wirebonder GmbH and Co. KG, Ultrasonic Engineering Co. Ltd, WestBond Inc., and Yamaha Motor Co. Ltd..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is technological advancements in wire bonding."
According to the report, one of the major drivers for this market is the rising electronics production across world.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Accelonix Ltd.
- ASMPT Ltd.
- BE Semiconductor Industries NV
- Bergen Group
- Cirexx International
- Corintech Ltd.
- DIAS Automation HK Ltd.
- F and K DELVOTEC Bondtechnik GmbH
- F and S BONDTEC Semiconductor GmbH
- Hesse GmbH
- HYBOND Inc.
- Kulicke and Soffa Industries Inc.
- Micro Point Pro Ltd.
- Palomar Technologies Inc.
- Powertech Technology Inc.
- Toray Industries Inc.
- TPT Wirebonder GmbH and Co. KG
- Ultrasonic Engineering Co. Ltd
- WestBond Inc.
- Yamaha Motor Co. Ltd.
