2019 was a seminal year for 5G development, as the world's telecom heavyweights vyed to gain a foothold in the nascent technology. The Chinese telecoms giant Huawei, benefiting from strong government support, was the world's largest 5G equipment supplier last year and the No. 3 smartphone maker by shipments. Observing that China was poised to take the global lead in 5G deployment, the United States opened a new front in the U.S.-China trade war, focusing on ICT (Information and Communications Technology). In order to ensure the integrity of its supply chain, Huawei has to gradually shift its focus to reducing reliance on U.S. manufacturers. At the same time, the disruptions in Huawei's supply chain are having knock-on effects throughout the global ICT sector. With that in mind, this report looks in detail at the changes in Huawei's supply chain and explores the context and future impact on the industry.
List of Topics:
- Development of Huawei, touching on its global market presence and the latest development of Huawei ban as well as its countermeasures
- Changes in supply chains following US ban on Huawei, including smartphone application IC, network communication, and semiconductor industry, as well as the effects on the country involved
- Huawei's supply chain and its long-term countermeasures and its HiSilicon supply chain and its Chinese RF component suppliers in the areas of antenna, filter, switch, amplifier, and GaAS wafer fabrication are also included
- Future prospects of Huawei’s supply chain in the industry of semiconductor, RF components, and software system and includes the effects on the country involved
Table of Contents
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Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amphenol
- Apple
- ASE
- ASM Pacific Technology
- AWSC
- BE Semiconductor Industries
- Broadcom
- ChengDu Gastone Technology
- Deqing Huaying Electronics
- Ericsson
- HiSilicon
- Huawei
- Huizhou Speed Wireless Technology
- JCET Group
- Line
- Luxshare Precision
- Maxscend Microelectronics
- MediaTek
- Murata
- Nokia
- Qorvo
- Qualcomm
- RichWave
- Sanan Optoelectronic
- Shenzhen Fastprint Circuit Tech
- Shenzhen Sunway Communications
- Shoulder Electronics
- Skyworks
- SMIC
- Sony
- SPIL
- Sunway Communication
- Taiyo Yuden
- Tianshui Huatian Technology
- Tongfu Microelectronics
- TSMC
- Win Semiconductor
- Xiamen Sanan Integrated Circuit
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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