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The automotive central gateway module market is forecasted to grow by USD 1.28 billion during 2023-2028, accelerating at a CAGR of 7.37% during the forecast period. The report on the automotive central gateway module market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing government support to promote evs, growing importance of crash tests and NCAP ratings, and importance of automotive network security driving CGM adoption.
The automotive central gateway module market is segmented as below:
By Application
- Passenger cars
- Commercial vehicles
By Type
- LIN central gateway module
- CAN central gateway module
- Ethernet central gateway module
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the automotive central gateway module market covers the following areas:
- Automotive central gateway module market sizing
- Automotive central gateway module market forecast
- Automotive central gateway module market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global automotive central gateway module market: Aptiv Plc, Beijing Jingwei Hirain Technologies Co. Inc., Continental AG, DENSO Corp., FEV Group GmbH, Flex Ltd., Hitachi Ltd., Infineon Technologies AG, Lear Corp., MarkLines Co Ltd., MRS Electronic GmbH and Co. KG, NXP Semiconductors NV, OMRON Corp., Panasonic Holdings Corp., Renesas Electronics Corp., Robert Bosch GmbH, STMicroelectronics International N.V., Tata Elxsi Ltd., TDK Corp., and Texas Instruments Inc..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is development of integrated cybersecurity solutions."
According to the report, one of the major drivers for this market is the increasing government support to promote EVs.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Aptiv Plc
- Beijing Jingwei Hirain Technologies Co. Inc.
- Continental AG
- DENSO Corp.
- FEV Group GmbH
- Flex Ltd.
- Hitachi Ltd.
- Infineon Technologies AG
- Lear Corp.
- MarkLines Co Ltd.
- MRS Electronic GmbH and Co. KG
- NXP Semiconductors NV
- OMRON Corp.
- Panasonic Holdings Corp.
- Renesas Electronics Corp.
- Robert Bosch GmbH
- STMicroelectronics International N.V.
- Tata Elxsi Ltd.
- TDK Corp.
- Texas Instruments Inc.