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The thermal interface materials market is forecasted to grow by USD 3.16 billion during 2023-2028, accelerating at a CAGR of 18.57% during the forecast period. The report on the thermal interface materials market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing demand from computers hardware manufacturing, rising demand for automobile electronics, and growing adoption of industrial automation.
The thermal interface materials market is segmented as below:
By Application
- Computers
- Telecom
- Automotive electronics
- Medical devices
- Others
By Type
- Grease and adhesive
- Taps and films
- Phase change materials
- Others
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the thermal interface materials market covers the following areas:
- Thermal interface materials market sizing
- Thermal interface materials market forecast
- Thermal interface materials market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the thermal interface materials market: 3M Co., AIM Metals and Alloys LP, AOS Thermal Compounds LLC, Bergquist, DALEBA ELECTRONICS LTD, Dow Chemical Co., DuPont de Nemours Inc., Fuji Polymer Industries Co. Ltd., GrafTech International Ltd., Henkel AG and Co. KGaA, Honeywell International Inc., Indium Corp., KITAGAWA INDUSTRIES America Inc., Laird Performance Materials, Momentive Performance Materials Inc., Parker Hannifin Corp., SEMIKRON Elektronik GmbH and Co. KG, Shin Etsu Chemical Co. Ltd., Wakefield Thermal Inc., and ZALMAN.Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is advances in technology."
According to the report, one of the major drivers for this market is the increasing demand from computers hardware manufacturing.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- 3M Co.
- AIM Metals and Alloys LP
- AOS Thermal Compounds LLC
- Bergquist
- DALEBA ELECTRONICS LTD
- Dow Chemical Co.
- DuPont de Nemours Inc.
- Fuji Polymer Industries Co. Ltd.
- GrafTech International Ltd.
- Henkel AG and Co. KGaA
- Honeywell International Inc.
- Indium Corp.
- KITAGAWA INDUSTRIES America Inc.
- Laird Performance Materials
- Momentive Performance Materials Inc.
- Parker Hannifin Corp.
- SEMIKRON Elektronik GmbH and Co. KG
- Shin Etsu Chemical Co. Ltd.
- Wakefield Thermal Inc.
- ZALMAN
