3D IC and 2.5D IC Packaging - Global Strategic Business Report

The global market for 3D IC and 2.5D IC Packaging is estimated at US$3.6 Billion in 2023 and is projected to reach US$6.4 Billion by 2030, growing at a CAGR of 8.6% from 2023 to 2030. This comprehensive report provides an in-depth analysis of market trends, drivers, and forecasts, helping you make informed business decisions.

Key Insights:

Market Growth: Understand the significant growth trajectory of the 3D Wafer-level Chip-Scale Packaging segment, which is expected to reach US$2.8 Billion by 2030 with a CAGR of a 8.5%. The 3D TSV segment is also set to grow at 9.3% CAGR over the next 7 years.
Regional Analysis: Gain insights into the U.S. market, estimated at $1.1 Billion in 2023, and China, forecasted to grow at an impressive 8.1% CAGR to reach $1.1 Billion by 2030. Discover growth trends in other key regions, including Japan, Canada, Germany, and the Asia-Pacific.

Why You Should Buy This Report:

Detailed Market Analysis: Access a thorough analysis of the Global 3D IC and 2.5D IC Packaging Market, covering all major geographic regions and market segments.
Competitive Insights: Get an overview of the competitive landscape, including the market presence of major players across different geographies.
Future Trends and Drivers: Understand the key trends and drivers shaping the future of the Global 3D IC and 2.5D IC Packaging Market.
Actionable Insights: Benefit from actionable insights that can help you identify new revenue opportunities and make strategic business decisions.

Key Questions Answered:

How is the Global 3D IC and 2.5D IC Packaging Market expected to evolve by 2030?
What are the main drivers and restraints affecting the market?
Which market segments will grow the most over the forecast period?
How will market shares for different regions and segments change by 2030?
Who are the leading players in the market, and what are their prospects?

Report Features:

Comprehensive Market Data: Independent analysis of annual sales and market forecasts in US$ Million from 2023 to 2030.
In-Depth Regional Analysis: Detailed insights into key markets, including the U.S., China, Japan, Canada, Europe, Asia-Pacific, Latin America, Middle East, and Africa.
Company Profiles: Coverage of major players such as Amkor Technology: ASE Group, Broadcom Ltd., Intel Corporation, and more.
Complimentary Updates: Receive free report updates for one year to keep you informed of the latest market developments.

Select Competitors (Total 13 Featured):

Amkor Technology: ASE Group
Broadcom Ltd.
Intel Corporation
Jiangsu Changjiang Electronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.
Stmicroelectronics Nv
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corp.
United Microelectronics Corp.

MarketGlass Platform

Our reports are enhanced by the MarketGlass platform, which brings together industry experts and influencers to provide high-quality, accurate insights. This unique platform allows us to gather comprehensive data and market perspectives, ensuring you receive the most reliable and detailed analysis available.

I. METHODOLOGYII. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Global Economic Update
Influencer Market Insights
World Market Trajectories
3D IC and 2.5D IC Packaging - Global Key Competitors Percentage Market Share in 2024 (E)
3D IC and 2.5D IC Packaging Competitor Market Share Scenario Worldwide (in %): 2018E
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)

2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

Table 1: World 3D IC and 2.5D IC Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
Table 2: World Recent Past, Current & Future Analysis for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 3: World Historic Review for 3D IC and 2.5D IC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 4: World 16-Year Perspective for 3D IC and 2.5D IC Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
Table 5: World Recent Past, Current & Future Analysis for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 6: World Historic Review for 3D Wafer-level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 7: World 16-Year Perspective for 3D Wafer-level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 8: World Recent Past, Current & Future Analysis for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 9: World Historic Review for 3D TSV by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 10: World 16-Year Perspective for 3D TSV by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 11: World Recent Past, Current & Future Analysis for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 12: World Historic Review for 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 13: World 16-Year Perspective for 2.5D by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 14: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 15: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 16: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 17: World Recent Past, Current & Future Analysis for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 18: World Historic Review for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 19: World 16-Year Perspective for Telecommunication by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 20: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 21: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 22: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 23: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 24: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 25: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 26: World Recent Past, Current & Future Analysis for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 27: World Historic Review for Smart Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 28: World 16-Year Perspective for Smart Technologies by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 29: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 30: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 31: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 32: World Recent Past, Current & Future Analysis for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 33: World Historic Review for Logic by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 34: World 16-Year Perspective for Logic by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 35: World Recent Past, Current & Future Analysis for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 36: World Historic Review for Imaging & Optoelectronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 37: World 16-Year Perspective for Imaging & Optoelectronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 38: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 39: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 40: World 16-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 41: World Recent Past, Current & Future Analysis for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 42: World Historic Review for MEMS / Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 43: World 16-Year Perspective for MEMS / Sensors by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 44: World Recent Past, Current & Future Analysis for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 45: World Historic Review for LED by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 46: World 16-Year Perspective for LED by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
Table 47: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
Table 48: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
Table 49: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030

III. MARKET ANALYSIS

UNITED STATES

Market Facts & Figures
US 3D IC and 2.5D IC Packaging Market Share (in %) by Company: 2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share Analysis (in %) of Leading Players in the US for 2018 & 2027
3D TSV (Packaging Technology) Competitor Revenue Share (in %) in the US: 2018 & 2027
2.5D (Packaging Technology) Market Share Breakdown (in %) of Major Players in the US: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
Market Analytics

CANADA

JAPAN

3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)

CHINA

3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)

EUROPE

Market Facts & Figures
European 3D IC and 2.5D IC Packaging Market: Competitor Market Share Scenario (in %) for 2018 & 2027
3D Wafer-level Chip-Scale Packaging (Packaging Technology) Market Share (in %) by Company in Europe: 2018 & 2027
3D TSV (Packaging Technology) Market Share (in %) of Major Players in Europe: 2018 & 2027
2.5D (Packaging Technology) Competitor Market Share Analysis (in %) in Europe: 2018 & 2027
3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
Market Analytics

FRANCE

3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)

GERMANY

3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)

ITALY

UNITED KINGDOM

3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)

REST OF EUROPE

ASIA-PACIFIC

3D IC and 2.5D IC Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)

REST OF WORLDIV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

Amkor Technology: ASE Group
Broadcom Ltd.
Intel Corporation
Jiangsu Changjiang Electronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.
Stmicroelectronics Nv
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corp.
United Microelectronics Corp.

Table Information

Report Attribute	Details
No. of Pages	79
Published	November 2024
Forecast Period	2023 - 2030
Estimated Market Value ( USD ) in 2023	$ 3.6 Billion
Forecasted Market Value ( USD ) by 2030	$ 6.4 Billion
Compound Annual Growth Rate	8.6%
Regions Covered	Global

License	Format	Properties	Price
SINGLE USER LICENSE PDF	The product is a PDF.	This is a single user license, allowing one user access to the product.	€5319EUR$5,600USD£4,462GBP
1 - 10 USER LICENSE PDF	The product is a PDF.	This is a 1-10 user license, allowing up to ten users have access to the product.	€10105EUR$10,640USD£8,478GBP
ENTERPRISE LICENSE PDF	The product is a PDF.	This is an enterprise license, allowing all employees within your organization access to the product.	€15956EUR$16,800USD£13,386GBP

Key Insights:

Why You Should Buy This Report:

Key Questions Answered:

Report Features:

Select Competitors (Total 13 Featured):

MarketGlass Platform

Table of Contents

Companies Mentioned (Partial List)

Table Information

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