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The die bonder equipment market is forecasted to grow by USD 189.1 million during 2023-2028, accelerating at a CAGR of 4.07% during the forecast period. The report on the die bonder equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by rising electronics production across the world, rising demand for high-quality semiconductor ICs for wireless devices and IoT applications, and increasing complexity of semiconductor IC designs.
The die bonder equipment market is segmented as below:
By End-user
- OSATs
- IDMs
By Type
- Fully automatic die bonder equipment
- Semi-automatic die bonder equipment
By Geography
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the die bonder equipment market covers the following areas:
- Die bonder equipment market sizing
- Die bonder equipment market forecast
- Die bonder equipment market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by End-user
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global die bonder equipment market: ASMPT Ltd., BE Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies Inc., Panasonic Holdings Corp., Paroteq GmbH, SHIBAURA MECHATRONICS CORP., SHIBUYA Corp., UniTemp GmbH, WestBond Inc., and Yamaha Motor Co. Ltd..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is increase in number of OSAT vendors."
According to the report, one of the major drivers for this market is the rising electronics production across the world.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ASMPT Ltd.
- BE Semiconductor Industries NV
- DIAS Automation HK Ltd.
- Dr. Tresky AG
- ficonTEC Service GmbH
- Finetech GmbH and Co. KG
- Four Technos Co. Ltd.
- HYBOND Inc.
- Indubond
- Kulicke and Soffa Industries Inc.
- MicroAssembly Technologies Ltd.
- Mycronic AB
- Palomar Technologies Inc.
- Panasonic Holdings Corp.
- Paroteq GmbH
- SHIBAURA MECHATRONICS CORP.
- SHIBUYA Corp.
- UniTemp GmbH
- WestBond Inc.
- Yamaha Motor Co. Ltd.
