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LAMEA Audio DSP Market By Type (Integrated and Discrete), By End User (Phones, IoT, Home Entertainment, Computer, True Wireless Earphones, Smart Homes, Wearables and Others), By Country, Industry Analysis and Forecast, 2020 - 2026

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    Report

  • 107 Pages
  • March 2021
  • Region: Africa, Middle East
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5314890
The Latin America, Middle East and Africa Audio DSP Market is expected to witness market growth of 10.1% CAGR during the forecast period (2020-2026).

DSP is a specialized microprocessor chip that is made on MOS integrated circuit chips. It is majorly utilized in telecommunications, audio signal processing, radar, digital image processing, sonar & speech recognition systems, and consumer electronic gadgets like disk drives, mobile phones, and high-definition television (HDTV) products.

Increasing implementation of DSP chips in consumer electronics & rising adoption of wireless connectivity & infrastructure is expected to fuel the growth of the market around the globe. Although, the utilization of audio DSP in gadgets costs extra value & adds to the cost of the product that is anticipated to restrict the growth of the audio DSP market. Moreover, the increasing usage of an audio digital signal processor in the automobile industry, growing demand for audio DSP in printers, & rising installations of IP cameras in video surveillance are anticipated to open growth prospects for the audio DSP market growth around the globe.

The audio DSP market is very competitive because of the presence of high number of market vendors. Audio DSP technology vendors with access to widespread technical & financial resources are expected to gain a competition advantage over their rivals, because of the capacity to fulfil the market needs. The highly competitive nature of this market is anticipated to further grow with rising technological advancements, product extensions, & various strategies adopted by main vendors.

The Brazil market dominated the LAMEA Wearables Audio DSP Market by Country 2019, thereby, achieving a market value of $50.8 million by 2026. The Argentina market is expected to witness a CAGR of 12.7% during (2020 - 2026). Additionally, The UAE market is experiencing a CAGR of 11.7% during (2020 - 2026).

Based on Type, the market is segmented into Integrated and Discrete. Based on End User, the market is segmented into Phones, IoT, Home Entertainment, Computer, True Wireless Earphones, Smart Homes, Wearables and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Intel Corporation, NXP Semiconductors N.V., Qualcomm, Inc., Renesas Electronics Corporation, Texas Instruments, Inc., Toshiba Corporation, Advanced Micro Devices, Inc. (Xilinx, Inc.), and CEVA, Inc.

Scope of the Study

Market Segmentation:

By Type
  • Integrated
  • Discrete

By End User
  • Phones
  • IoT
  • Home Entertainment
  • Computer
  • True Wireless Earphones
  • Smart Homes
  • Wearables
  • Others

By Country
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Companies Profiled
  • Analog Devices, Inc.
  • Broadcom, Inc.
  • Intel Corporation
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Renesas Electronics Corporation
  • Texas Instruments, Inc.
  • Toshiba Corporation
  • Advanced Micro Devices, Inc. (Xilinx, Inc.)
  • CEVA, Inc.

Unique Offerings from the Publisher
  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Audio DSP Market, by Type
1.4.2 LAMEA Audio DSP Market, by End User
1.4.3 LAMEA Audio DSP Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Geographical Expansions
3.2.4 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2016, Jun - 2021, Feb) Leading Players
Chapter 4. LAMEA Audio DSP Market by Type
4.1 LAMEA Audio DSP Market Integrated Market by Country
4.2 LAMEA Audio DSP Market Discrete Market by Country
Chapter 5. LAMEA Audio DSP Market by End Use
5.1 LAMEA Phones Audio DSP Market by Country
5.2 LAMEA IoT Audio DSP Market by Country
5.3 LAMEA Home Entertainment Audio DSP Market by Country
5.4 LAMEA Computer Audio DSP Market by Country
5.5 LAMEA True Wireless Earphones Audio DSP Market by Country
5.6 LAMEA Smart Homes Audio DSP Market by Country
5.7 LAMEA Wearables Audio DSP Market by Country
5.8 LAMEA Other End Use Audio DSP Market by Country
Chapter 6. LAMEA Audio DSP Market by Country
6.1 Brazil Audio DSP Market
6.1.1 Brazil Audio DSP Market by Type
6.1.2 Brazil Audio DSP Market by End Use
6.2 Argentina Audio DSP Market
6.2.1 Argentina Audio DSP Market by Type
6.2.2 Argentina Audio DSP Market by End Use
6.3 UAE Audio DSP Market
6.3.1 UAE Audio DSP Market by Type
6.3.2 UAE Audio DSP Market by End Use
6.4 Saudi Arabia Audio DSP Market
6.4.1 Saudi Arabia Audio DSP Market by Type
6.4.2 Saudi Arabia Audio DSP Market by End Use
6.5 South Africa Audio DSP Market
6.5.1 South Africa Audio DSP Market by Type
6.5.2 South Africa Audio DSP Market by End Use
6.6 Nigeria Audio DSP Market
6.6.1 Nigeria Audio DSP Market by Type
6.6.2 Nigeria Audio DSP Market by End Use
6.7 Rest of LAMEA Audio DSP Market
6.7.1 Rest of LAMEA Audio DSP Market by Type
6.7.2 Rest of LAMEA Audio DSP Market by End Use
Chapter 7. Company Profiles
7.1 Analog Devices, Inc.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Regional Analysis
7.1.4 Research & Development Expenses
7.1.5 Recent strategies and developments
7.1.5.1 Acquisition and Mergers
7.1.5.2 Product Launches and Product Expansions
7.1.5.3 Geographical Expansions
7.1.6 SWOT Analysis
7.2 Broadcom, Inc.
7.2.1 Company Overview
7.2.1 Financial Analysis
7.2.2 Segmental and Regional Analysis
7.2.3 Research & Development Expense
7.2.4 Recent strategies and developments
7.2.4.1 Partnerships, Collaborations, and Agreements
7.2.5 SWOT Analysis
7.3 Intel Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments
7.3.5.1 Product Launches and Product Expansions
7.3.6 SWOT Analysis
7.4 NXP Semiconductors N.V.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments
7.4.5.1 Product Launches and Product Expansions
7.4.5.2 Partnerships, Collaborations, and Agreements
7.4.6 SWOT Analysis
7.5 Qualcomm, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments
7.5.5.1 Acquisition and Mergers
7.5.5.2 Product Launches and Product Expansions
7.5.5.3 Partnerships, Collaborations, and Agreements
7.5.6 SWOT Analysis
7.6 Renesas Electronics Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.6.5 Recent strategies and developments
7.6.5.1 Acquisition and Mergers
7.6.5.2 Partnerships, Collaborations, and Agreements
7.7 Texas Instruments, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments
7.7.5.1 Product Launches and Product Expansions
7.7.6 SWOT Analysis
7.8 Toshiba Corporation
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research and Development Expense
7.8.5 Recent strategies and developments
7.8.5.1 Partnerships, Collaborations, and Agreements
7.8.6 SWOT Analysis
7.9 Advanced Micro Devices, Inc. (Xilinx, Inc.)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.9.5 Recent strategies and developments
7.9.5.1 Product Launches and Product Expansions
7.10. CEVA, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
7.10.5 Recent strategies and developments
7.10.5.1 Product Launches and Product Expansions
7.10.5.2 Partnerships, Collaborations, and Agreements

Companies Mentioned

  • Analog Devices, Inc.
  • Broadcom, Inc.
  • Intel Corporation
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Renesas Electronics Corporation
  • Texas Instruments, Inc.
  • Toshiba Corporation
  • Advanced Micro Devices, Inc. (Xilinx, Inc.)
  • CEVA, Inc.

Methodology

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