System Level Block Diagrams, High Level Mechanical & PCB Analysis, and Component Diagrams
This report provides a comprehensive analysis for the Ericsson StreetMacro 6701 B261 system. This product is a 5G NR mmWave 28GHz small cell.
The report is a design “teardown” analysis of an Ericsson mmWave phased array antenna unit (mpAAU) 5G NR small cell system. The mpAAU supports 5G NR technology in the FR2 frequency band. The analysis covers the entire system. A simplified mechanical analysis of the unit along with detailed bill of materials analysis is presented in this report. The Ericsson product name is Ericsson StreetMacro 6701 (SM 6701) B261. The Ericsson part number is vRK 101 01/1. This particular unit was manufactured in Estonia and is meant for use in the United States.
Features
- System Functional Description
- System Level Block Diagrams
- High Level Mechanical Analysis
- Heat Sink
- Heat Fins
- High Level PCB Analysis
- Component Diagrams
- Semiconductor/component locations on PCB
- High Level Bill of Materials
- Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
- Passive/other components (Transformers, Power inductors, Power capacitors, Power/Datacom/Optical connectors)
- Complete Part Number/Marking
- Component Manufacturer Identification
- Function Component Description
- Package Type
- Excludes analysis of passive chip resistors, capacitors, and inductors
Table of Contents
Executive Summary
- Active/Passive Component Summary
- Important Note
Chapter 1: Ericsson mpAAU
- Overview of mmWave Phased Array Antenna Unit
- Product Specifications
Chapter 2: Mechanical Analysis
- Front Cover Chassis
- Rear Cover Chassis
- Power Supply/Fan Tray Cover
- Phased Array Antenna Module (PAAM) Secondary Thermal Heatsink
- Modem/Switch Transport RF Shield
Chapter 3: L1 Modem Subsystem
Chapter 4: L2/L3 Switch/Transport Subsystem
- Frequency Synthesizer Modules
Chapter 5: Radio Transceiver Subsystem
- Top PCB Component Analysis
- Bottom PCB Component Analysis
Chapter 6: mmWave Phased Array Antenna Module (PAAM) Subsystem
- PAAM Heatsink Assembly
Chapter 7: Power Supply Subsystem
Chapter 8: Fan Tray Subsystem
Appendix A: Component Analysis
Appendix B: Component Type by System Unit
Appendix C: Active Components by Supplier
Appendix D: Passive Components by Supplier
List of Tables
- StreetMacro 6701 Electrical Specifications
- StreetMacro Heat Dissipation and Power Consumption Specifications
- L1 Modem PCB Top, Active Bill of Materials
- L1 Modem PCB Top, Passive Bill of Materials
- L1 Modem PCB Bottom, Active Bill of Materials
- L1 Modem PCB Bottom, Passive Bill of Materials
- L2/L3 Switch/Transport PCB Top, Active Bill of Materials
- L2/L3 Switch/Transport PCB Top, Passive Bill of Materials
- L2/L3 Switch/Transport PCB Bottom, Active Bill of Materials
- L2/L3 Switch/Transport PCB Bottom, Passive Bill of Materials
- ROR 101 0018/AB R1B Bill of Materials
- ROR 101 0019/AC R1A Bill of Materials
- PCB Top, Non RF Shield Area, Active Bill of Materials
- PCB Top, Area A1A/A1B Active Bill of Materials
- PCB Top, Area A2A/A2B Active Bill of Materials
- PCB Top, Area B1 Active Bill of Materials
- PCB Top, Area B2, Active Bill of Materials
- PCB Top, Area C1, Active Bill of Materials
- PCB Top, Area D1, Active Bill of Materials
- PCB Top, Non RF Shield Area, Passive Bill of Materials
- PCB Bottom, Non RF Shield Area, Active Bill of Materials
- PCB Bottom, Area A3A/A3B Active Bill of Materials
- PCB Bottom, Area A4A/A4B Active Bill of Materials
- PCB Bottom, Area B3 Active Bill of Materials
- PCB Bottom, Area B4, Active Bill of Materials
- PCB Top, Non RF Shield Area, Passive Bill of Materials
- PAAM PCB, Bottom, Bill of Materials
- StreetMacro 6701 Unit PCBs by Component Type
- StreetMacro 6701 Unit PCBs by Active Component Vendor
- StreetMacro 6701Unit PCBs by Passive/Connector/Other Component Vendor
List of Exhibits
- StreetMacro 6701
- Ericsson Street Macro Product Portfolio
- Ericsson mmW Product Generations
- StreetMacro 6701 Single Cell Vs. Cascaded Backhaul
- StreetMacro 6701 Front (Left) and Rear (Right) Views
- StreetMacro 6701 Left Side (Left) and Right Side (Right) Views
- StreetMacro 6701 Top (Left) and Bottom (Right) Views
- StreetMacro 6701 Product Label
- StreetMacro 6701 FCC ID Label
- Front Cover Chassis, External View
- Front Cover Chassis, Internal View
- StreetMacro mmWave Antenna Radome
- L2/L3 Switch/Transport Heatsink
- StreetMacro Access Cover
- Rear Cover Chassis, Internal View
- Rear Cover Chassis, External View
- Heat Transfer Fin Dimensions
- Power Supply/Fan Tray Cover, Internal View
- Power Supply/Fan Tray Cover W/O Units, Internal View
- Power Supply/Fan Tray Cover, External View
- PAAM Secondary Thermal Heatsink, Top View
- PAAM Secondary Thermal Heatsink, Bottom View
- Modem/Switch Transport RF Shield, Top View
- StreetMacro 6701 Modem System Shield, Bottom View
- L1 Modem PCB, Top View
- L1 Modem PCB, Bottom View
- L1 Modem Subsystem Block Diagram
- L1 Modem PCB Top, Active Component Diagram
- L1 Modem PCB Top, Passive Component Diagram
- L1 Modem PCB Bottom, Active Component Diagram
- L1 Modem PCB Bottom, Passive Component Diagram
- Board to Board Connector, 400-Position, Socket
- Board to Board Connector, 400-Position, Terminal
- L2/L3 Switch Transport Subsystem Location
- L2/L3 Switch/Transport PCB, Top View
- L2/L3 Switch/Transport PCB, Bottom View
- L2/L3 Switch/Transport Subsystem Block Diagram
- Switch/Transport Subsystem Faceplate, External View
- Switch/Transport Subsystem Faceplate, Internal View
- Switch/Transport Subsystem Faceplate, Top and Bottom Views
- L2/L3 Switch/Transport PCB Top, Active Component Diagram
- StreetMacro eUSB Access Panel
- L2/L3 Switch/Transport PCB Top, Passive Component Diagram
- L2/L3 Switch/Transport PCB Bottom, Active Component Diagram
- L2/L3 Switch/Transport PCB Bottom, Passive Component Diagram
- ROR 101 0018/AB R1B (Left) and ROR 101 0019/AC R1A (Right)
- ROR 101 0018/AB R1B Component Diagram
- ROR 101 0018/AB R1B Land Pattern
- ROR 101 0019/AC R1A Component Diagram
- ROR 101 0019/AC R1A Land Pattern
- StreetMacro Radio Transceiver PCB, Top View
- StreetMacro Radio Transceiver PCB, Bottom View
- Radio Transceiver PCB RF Shielded Areas, Top
- Radio Transceiver PCB RF Shielded Areas, Bottom
- Radio Transceiver Block Diagram
- High Speed Digital Signal Cable Assembly
- Radio Transceiver PCB, Top, Active Component Diagram
- Area A1A Component Diagram
- Area A1A Block Diagram
- Area A1B Component Diagram
- Area A1B Block Diagram
- Area A2A Component Diagram
- Area A2A Block Diagram
- Area A2B Component Diagram
- Area A2B Block Diagram
- Area B1 Component Diagram
- Area B2 Component Diagram
- Area C1 Component Diagram
- Area D1 Component Diagram
- Radio Transceiver PCB, Top, Passive Component Diagram
- Radio Transceiver PCB, Bottom, Active Component Diagram
- Area A3A Component Diagram
- Area A3A Block Diagram
- Area A3B Component Diagram
- Area A3B Block Diagram
- Area A4A Component Diagram
- Area A4A Block Diagram
- Area A4B Component Diagram
- Area A4B Block Diagram
- Area B3 Component Diagram
- Area B4 Component Diagram
- Area C2 Component Diagram
- Area D2 Component Diagram
- Radio Transceiver PCB, Bottom, Passive Component Diagram
- RF Ground Connectors [Component Id 4]
- Phased Array Antenna Module Subsystem Location
- Phased Array Antenna Module Frame, External View
- Phased Array Antenna Module Frame, Internal View
- Phased Array Antenna Module Unit, Top View
- Phased Array Antenna Module, Bottom View
- Phased Array Antenna Module Unit, Heatsink Top View (Left) and Phased Array Antenna Module PCB Bottom View (Right)
- Phased Array Antenna Module PCB, Top View
- Phased Array Antenna Element Matrix
- Phased Array Antenna Dimensions
- Phased Array Antenna Ground Via Locations
- Active Vs. Non Active Phased Array Antenna Elements
- PAAM Beam Configuration Mode 1
- PAAM Beam Configuration Mode 2
- PAAM Antenna Element Dimensions
- PAAM PCB, Bottom View
- RF Transceiver/Antenna Array Block Diagram
- PAAM PCB, Bottom, Component Diagram
- PAAM RF Switch Matrix Circuits
- RF Passive Circuits for RF Asics
- Type A RF Passive Circuit
- Type B RF Passive Circuit
- PAAM Heatsink Assembly, Top View
- RF Heatsink Assembly, Bottom View
- PAAM Heatsink Frame, Top View
- PAAM Heatsink Frame, Bottom View
- RF Heatsink, Top View
- RF Heatsink, Bottom View
- Ericsson AC/DC Power Supply Label
- Supplier AC/DC Power Supply Label
- StreetMacro 6701 Power Supply Subsystem, Top View
- StreetMacro 6701 Power Supply Subsystem, Bottom View
- DC 12V_A and 12V_B Connectors
- DC 24V Connector and 2-Pin Connector
- 12V_A Power Distribution PCB Location
- 12V_A Power PCB, Component Diagram, Top (Left) and Bottom (Right)
- Ericsson Fan Tray Label
- Supplier Fan Tray Label
- Fan Tray Location (Internal View)
- Fan Tray Location (Enlarged Internal View)
- Fan Tray Location (External View)
- Fan Tray, Front View
- Fan Tray, Back View
- Fan Tray, Top View
- Fan Tray, Bottom View
- Fan Tray Cover, External View
- Fan Tray Cover, Internal View
- Fan Tray Power Connector
- Fan Unit Wiring Harness
- QR Code for Fan Unit
- Fan Tray Individual Fan Unit
- Fan Unit Grommets
- Component Market Share by Type
- Active Semiconductor Market Share by Vendor
- Active Semiconductor Market Share by Vendor, 64+ Pin
- Passive/Connector/Other Component Market Share by Vendor
- Passive/Connector/Other Component Market Share by Function
- Passive/Connector/Other Component Market Share by Country of Origin
Samples
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Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Ericsson
