The worldwide electronics assembly market is substantial in size, approximately $1.4 trillion dollars in terms of cost of goods sold (COGS) as of 2022. The market has been expanding rapidly but changing in composition both in terms of outsourcing partnerships with in-house manufacturing. Also, moves are being made annually with regard to the manufacturing country of origin based on total cost.
This report is a peerless database that analyzes the 2022 electronics assembly market on a worldwide basis. It is developed by studying 381 leading OEM electronics companies in 46 different product categories and their manufacturing activities in 3 different geographic regions. Moreover, the report examines the electronics assembly market by outsourced subcontractor versus in-house assembly by the OEM company.
The report segments the worldwide electronics assembly value into seven unique markets.
- Automotive
- Communications
- Computers/Peripherals
- Consumer Electronics
- Industrial
- Medical
- Aerospace/Military/Other Transportation
The following production data is given for the leading OEMs within each product/market segment.
- COGS Assembly Revenue
- Electronics COGS Assembly Revenue
- Outsourced/In-Housed Assembly
- Revenue
- Assembly Revenue by 3 Regions
- Assembly Revenue by 46 Products
The leading OEMs for each segment are chosen not only for their size, but also for their leadership within their industry segment, growth potential, profitability, and inclination to outsource electronics assembly.
Datebase Highlights
- Product Segment Analysis, 2022
- Automotive
- Communications
- Computers/Peripherals
- Consumer Electronics
- Industrial
- Medical
- Aerospace/Military/Other Transportation
- Company-Level Analysis, 2022
- COGS Assembly Revenue
- Electronics COGS Assembly Revenue
- Outsourced/In-House Assembly Revenue
- Assembly Revenue by 3 Regions
- Assembly Revenue by 46 Products
Table of Contents
Companies Mentioned
- Aisin Seiki
- Alps Electric
- Audi AG
- AutoLiv
- BAIC Motor
- Beijing Auto
- BMW
- Changan Motor
- Continental
- Daimler
- Delphi Technology
- Denso Corporation
- Dongfeng
- Eaton Corp.
- FAW Group
- Geely Motor
- Guangzhou Auto
- Hella
- Hitachi
- Honda Motor Corp.
- Hyundai Motor
- Johnson Controls
- JVC Kenwood
- Kia Corp.
- Magna International
- Mahindra & Mahindra
- Maruti Suzuki
- Mazda Motors
- Mitsubishi Motors
- Navistar International
- Nissan
- Panasonic
- Renault
- Robert Bosch
- SAIC Motor
- Sony
- Stellantis
- Tata Motors
- Tesla, Inc.
- Valeo SE
- Visteon Corp.
- Volkswagen AG
- Volvo
- Accton
- ADTRAN
- China Tower
- Apple
- Arista Networks
- AsusTek
- Avaya
- BBK Electronics
- NTT DoCoMo
- China SpaceSat
- Ciena
- Cisco Systems
- CommScope
- Datang Telecom
- Dell Technologies
- D-Link
- Ericsson
- Extreme Networks
- F5, Inc.
- FiberHome
- Fortinet
- Fujitsu
- Harmonic
- Hewlett Packard Enterprise
- Huawei
- Infinera
- Juniper Networks
- Keysight Technologies
- Kyocera
- Harris Technology Group
- Lenovo
- LG Mobile Com
- Blackberry
- Motorola Solutions
- NEC
- Netgear
- Nokia Oyj
- Oki Electric
- Palo Alto Networks
- Panasonic Mobile Comm
- Panda Electronics
- Plantronics
- Qorvo
- Quanta Computer
- Orange SA
- Ribbon Communcations
- Samsung Electronics
- Spirent
- TCL Electronics
- Telia
- Cobham SATCOM
- Toshiba
- Ubiquiti Networks
- UTStarcom
- Viavi Solutions
- Vtech
- Xiaomi
- ZTE
- Acer
- Agfa-Gevaert
- Amazon
- Apple, Inc.
- AsusTek
- Brother Industries
- Canon
- Cisco
- Compal Electronics
- Dell Technologies
- Delta Electronics
- Diebold Nixdorf
- ECS
- Epson
- Founder
- Fujitsu
- GigaByte
- Great Wall
- Hasee Computer
- Hitachi Vantara
- HP, Inc.
- HPE
- Huawei
- IBM
- Seagate
- Intel
- Inventec
- Konica Minolta
- Lenovo
- Logitech
- Micro-Star
- MiTac
- NEC
- NetApp, Inc.
- Oracle
- Pitney Bowes
- Positivo Informatica
- Qisda
- Quanta Computer
- Ricoh
- Samsung Electronics
- Sony
- Supermicro
- Teradata
- Tongfang
- Toshiba
- TPV
- Unisys
- Western Digital
- Xerox
- Zebra Technologies
- Acer
- Alibaba
- Amazon
- Amtran
- Apple
- Arcelik
- AU Optronics
- BOE Technology
- Robert Bosch
- BOSE Corporation
- Casio Computer
- Changhong
- Cisco Systems
- Commscope
- Compal Electronics
- Dolby Laboratories
- EchoStar
- Electrolux
- Fitbit, Inc.
- Founder
- Funai Electric
- Garmin
- General Electric
- Haier Electronics
- Hisense
- Hitachi
- Humax
- JVC Kenwood
- Koninklijke Philips
- Konka Group
- LG Electronics
- Microsoft
- Midea Holding
- Mitsubishi Electric
- Nikon
- Nintendo
- Olympus
- Panasonic
- Qisda
- Quanta Computer
- Roku
- Samsung
- Skyworth
- SmarDTV (Nagra)
- Sony
- Tatung
- TCL Electronics
- Technicolor
- TomTom
- Tongfang
- Toshiba
- TPV
- Trimble, Inc.
- Whirlpool
- Yamaha
- ABB
- Advantest
- Agilent
- ALSTOM
- Anritsu
- Applied Materials
- ASML
- Bharat Heavy Electricals
- Bozhong Precision
- Caterpillar
- Cisco Systems
- CNH Industrial
- Coherent
- Danaher
- Deere & Co.
- Diebold
- Eaton
- Ebara Corp.
- Electrolux
- Emerson
- Everi Holdings
- Fanuc
- Federal Signal
- First_Solar
- Fuji Electric
- Fujitsu
- GE Industrial
- General Dynamics
- Haier Smart Home
- Halliburton
- Hitachi
- Honeywell
- IGT
- Illumina
- Ingersoll Rand
- Itron
- ITT, Inc.
- JA Solar Technology
- JEOL
- JinkoSolar
- Johnson Controls
- Keysight
- Technologies
- KLA Corporation
- Komatsu
- KONE Oyj
- Lam Research
- Lennox Intl.
- LG Electronics
- LONGi
- Mettler Toledo
- Mitsubishi Electric
- MKS Instruments
- MTS Systems
- National Instruments
- NCR
- NEC
- Nichia
- Omron
- OSRAM Licht
- Panasonic Industrial
- Parker-Hannifin
- PerkinElmer
- Q-Cells (Hanwha)
- Raytheon
- Robert Bosch
- Rockwell Automation
- Rohde & Schwarz
- Samsung
- Schlumberger
- Schneider Electric
- Shimadzu
- Siemens AG
- Siemens Gamesa
- SMIC
- Smiths Group
- SPX Corporation
- Sumitomo Heavy Industries
- SunPower
- Teradyne, Inc.
- Texas Instruments Textron, Inc.
- Thermo Fisher Scientific
- ThyssenKrupp AG
- Tokyo Electron
- Toshiba
- Trina Solar
- Vestas Wind
- Waters Corporation
- Whirlpool Corporation
- Yingli
- Yokogawa Electric
- 3M Healthcare
- Abbott Labs
- Agilent
- Amgen
- AstraZeneca
- B. Braun Melsungen
- Baxter International
- Becton Dickinson
- Bio-Rad Laboratories
- Boston Scientific
- Carl Zeiss Meditec
- CONMED
- Danaher Corporation
- DaVita Inc.
- Dentsply Sirona
- Dragerwerk AG
- Edwards Lifesciences
- Fresenius SE
- Fujitsu
- GE Healthcare
- Hitachi
- Hologic, Inc.
- Johnson & Johnson
- Konica Minolta
- Masimo
- Medtronic Plc
- Mindray Medical
- Novartis AG
- Omron Corp.
- Koninklijke Philips
- Qiagen N.V.
- ResMed
- Roche
- Siemens Healthcare
- Smith & Nephew
- Smiths Group
- Stryker Corp.
- Sun Pharmaceuticals
- Terumo Corp.
- Thermo Fisher
- Toshiba
- Cardinal Health
- Zimmer Biomet
- Airbus SE
- AVIC International
- BAE Systems
- Boeing
- Boeing Defense
- Bombardier
- Chemring
- China Aerospace
- China Electronics Corp.
- Dassault Aviation
- Embraer
- General Dynamics
- General Electric
- Gogo LLC
- Gulfstream Aerospace
- Hindustan Aerospace
- Honda Motor
- Honeywell
- Israel Aerospace
- Kawasaki
- L3Harris
- Leonardo
- Lockheed Martin
- Lufthansa Systems
- Mitsubishi
- Mitsui Engineering
- Northrop Grumman
- Orbital UAV
- Raytheon
- Saab
- SAFRAN
- SpaceX
- Suzuki Motor
- Teledyne
- Textron
- Thales
- Yamaha
Methodology
The publisher's forecasts are developed using a four-step approach. First, expectations of world economic growth are set based upon historical data and forecasts obtained from published International Monetary Fund (IMF) reports.
Next, a top-down forecast of electronics industry growth is built. This analysis is based primarily on historical data obtained from the Semiconductor Industry Association (SIA) and World Semiconductor Trade Statistics (WSTS). Because semiconductor content is at the core of electronics products, semiconductor data is a good triangulation point for total assembly value. This data is augmented with information on passive content and estimates of labor and overhead.
Then, a bottom-up forecast is developed for each of the products in each segment. This is accomplished by first creating a unit forecast for each product based on historical data and various industry-leader opinions regarding future growth prospects for each product. A model of the assembly value of each product is then built using teardown analyses and price-based models. The unit volume times the assembly value per unit equals the total assembly value for each product - often referred to as the cost of goods sold (COGS).
Finally, the first three steps are reiterated to achieve a coherent forecast. The forecasts developed by this process are presented in all their industry reports.
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