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Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application: Global Opportunity Analysis and Industry Forecast, 2021-2031- Product Image
Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application: Global Opportunity Analysis and Industry Forecast, 2021-2031- Product Image
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Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application: Global Opportunity Analysis and Industry Forecast, 2021-2031

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    Report

  • 225 Pages
  • September 2022
  • Region: Global
  • Allied Market Research
  • ID: 5439770
UP TO OFF until Jan 30th 2025
Description Jump to:
The global outsourced semiconductor assembly and test market was valued at $34,553.5 million in 2021, and is projected to reach $60,334.5 million by 2031, registering a CAGR of 6.32% from 2022 to 2031. Outsourced semiconductor assembly and test (OSAT) are the number of companies that offers third-party IC-packaging as well as test services. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations. OSAT mainly emphasizes on providing advanced packaging as well as test solutions for semiconductor companies in various markets such as consumer goods, communications, and computing along with emerging markets such as Internet of Things (IoT), automotive electronics, and wearable devices.

The global outsourced semiconductor assembly and test market is mainly driven by increase in demand for consumer electronics and surge in degree of urbanization. In addition, increase in adoption of smartphones significantly fuels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the other hand, growth in the chip market is anticipated to provide a huge opportunity for OSAT companies.

The assembly segment was the largest revenue contributor in 2021, and is expected to grow at a CAGR of 6.46% from 2022 to 2031. This is attributed to rise in need for effective supply chain management in the semiconductor manufacturing industry. By packaging type, the ball grid array segment was the leading largest contributor of revenue in 2020 and is expected to grow at a CAGR of 5.63% from 2022 to 2031. Technological advancements in the semiconductor industry has led to surge in demand for thinner and lighter electronics products.

This factor primarily drives growth of the ball grid array type of packaging, owing to several miniaturization advantages that it offers. By region, the outsourced semiconductor assembly and test market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. The analysis identified that North America contributed for the maximum revenue in 2021. This is attributed to increase in industrialization as well as rapid development in automotive and telecommunication industries.

The key players profiled in the report include Advanced Silicon S.A., Alphacore Inc., Amkor Technology, Inc., Device Engineering Inc., HiDensity Group (HMT microelectronic AG), Luminar Technologies, Inc. (Black Forest Engineering), Presto Engineering Group, Sencio BV, ShortLink group, and SiFive, Inc. (OpenFive). Market players have adopted various strategies such as product launch, expansion, collaboration, partnership, and acquisition to strengthen their foothold in the outsourced semiconductor assembly and test industry.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the outsourced semiconductor assembly and testing market analysis from 2021 to 2031 to identify the prevailing outsourced semiconductor assembly and testing market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the outsourced semiconductor assembly and testing market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global outsourced semiconductor assembly and testing market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Process

  • Sawing
  • Sorting
  • Testing
  • Assembly

By Packaging Type

  • Ball grid array
  • Chip scale package
  • Multi-package
  • Stacked die
  • Quad and dual

By Application

  • Automotive
  • Consumer electronics
  • Industrial
  • Telecommunication
  • Aerospace and defense
  • Medical and healthcare
  • Logistics and transportation

By Region

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Russia
  • Sweden
  • Netherlands
  • Rest Of Europe
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest Of Europe
  • LAMEA
  • Latin America
  • Middle East
  • Africa

Key Market Players

  • ADVANCED SILICON S.A.
  • ALPHACORE INC.
  • AMKOR TECHNOLOGY, INC.
  • DEVICE ENGINEERING INC.
  • HIDENSITY GROUP (HMT MICROELECTRONIC AG)
  • PRESTO ENGINEERING GROUP
  • Sencio BV
  • SHORTLINK GROUP
  • SIFIVE, INC. (OPENFIVE)
  • LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)

 

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  • Online Access price format is valid for 60 days access. Printing is not enabled.
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Table of Contents

CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings
2.1.1. Top impacting factors
2.1.2. Top investment pockets
2.2. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key forces shaping outsourced semiconductor assembly and test (OSAT) market
3.3. Market dynamics
3.3.1. Drivers
3.3.1.1. Increase in demand for consumer electronics
3.3.1.2. Surge in degree of urbanization across the globe
3.3.1.3. Increase in adoption of smartphones
3.3.2. Restraint
3.3.2.1. High cost associated with OSAT services
3.3.3. Opportunities
3.3.3.1. Chip market to provide a huge opportunity for OSAT companies
3.3.3.2. Rise in transition toward OSAT in emerging economies
3.4. COVID-19 impact analysis on outsourced semiconductor assembly and test (OSAT)
3.4.1. Impact on market size
3.4.2. End user trends, preferences, and budget impact
3.4.3. Key player strategies to tackle the COVID-19 impact
CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PROCESS
4.1. Overview
4.2. Sawing
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Sorting
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
4.4. Testing
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis, by country
4.5. Assembly
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis, by country
CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PACKAGING TYPE
5.1. Overview
5.2. Ball grid array
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Chip scale package
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Multi-package
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Stacked die
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
5.6. Quad & dual
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis, by country
CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION
6.1. Overview
6.2. Automotive
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. Consumer electronics
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Industrial
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
6.5. Telecommunication
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis, by country
6.6. Aerospace and defense
6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis, by country
6.7. Medical and healthcare
6.7.1. Key market trends, growth factors, and opportunities
6.7.2. Market size and forecast, by region
6.7.3. Market analysis, by country
6.8. Logistics and transportation
6.8.1. Key market trends, growth factors, and opportunities
6.8.2. Market size and forecast, by region
6.8.3. Market analysis, by country
CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY REGION
7.1. Overview
7.2. North America
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by process
7.2.3. Market size and forecast, by packaging type
7.2.4. Market size and forecast, by application
7.2.5. Market analysis, by country
7.2.5.1. U.S.
7.2.5.1.1. Market size and forecast, by process
7.2.5.1.2. Market size and forecast, by packaging type
7.2.5.1.3. Market size and forecast, by application
7.2.5.2. Canada
7.2.5.2.1. Market size and forecast, by process
7.2.5.2.2. Market size and forecast, by packaging type
7.2.5.2.3. Market size and forecast, by application
7.2.5.3. Mexico
7.2.5.3.1. Market size and forecast, by process
7.2.5.3.2. Market size and forecast, by packaging type
7.2.5.3.3. Market size and forecast, by application
7.3. Europe
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by process
7.3.3. Market size and forecast, by packaging type
7.3.4. Market size and forecast, by application
7.3.5. Market analysis, by country
7.3.5.1. UK
7.3.5.1.1. Market size and forecast, by process
7.3.5.1.2. Market size and forecast, by packaging type
7.3.5.1.3. Market size and forecast, by application
7.3.5.2. Germany
7.3.5.2.1. Market size and forecast, by process
7.3.5.2.2. Market size and forecast, by packaging type
7.3.5.2.3. Market size and forecast, by application
7.3.5.3. France
7.3.5.3.1. Market size and forecast, by process
7.3.5.3.2. Market size and forecast, by packaging type
7.3.5.3.3. Market size and forecast, by application
7.3.5.4. Italy
7.3.5.4.1. Market size and forecast, by process
7.3.5.4.2. Market size and forecast, by packaging type
7.3.5.4.3. Market size and forecast, by application
7.3.5.5. Russia
7.3.5.5.1. Market size and forecast, by process
7.3.5.5.2. Market size and forecast, by packaging type
7.3.5.5.3. Market size and forecast, by application
7.3.5.6. Sweden
7.3.5.6.1. Market size and forecast, by process
7.3.5.6.2. Market size and forecast, by packaging type
7.3.5.6.3. Market size and forecast, by application
7.3.5.7. Netherlands
7.3.5.7.1. Market size and forecast, by process
7.3.5.7.2. Market size and forecast, by packaging type
7.3.5.7.3. Market size and forecast, by application
7.3.5.8. Rest of Europe
7.3.5.8.1. Market size and forecast, by process
7.3.5.8.2. Market size and forecast, by packaging type
7.3.5.8.3. Market size and forecast, by application
7.4. Asia-Pacific
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, process
7.4.3. Market size and forecast, by packaging type
7.4.4. Market size and forecast, by application
7.4.5. Market analysis, by country
7.5. LAMEA
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by process
7.5.3. Market size and forecast, by packaging type
7.5.4. Market size and forecast, by application
7.5.5. Market analysis, by country
CHAPTER 8: COMPETITIVE LANDSCAPE
8.1. Introduction
8.2. Key players positioning, 2020
8.3. Top winning strategies
8.3.1. Top winning strategies, by year
8.3.2. Top winning strategies, by development
8.3.3. Top winning strategies, by company
8.4. Competitive dashboard
8.5. Competitive heatmap
CHAPTER 9: COMPANY PROFILES
9.1. ADVANCED SILICON S.A.
9.1.1. Company overview
9.1.2. Key executives
9.1.3. Company snapshot
9.1.4. Product portfolio
9.2. ALPHACORE INC.
9.2.1. Company overview
9.2.2. Key executives
9.2.3. Company snapshot
9.2.4. Product portfolio
9.2.5. Key strategic moves and developments
9.3. AMKOR TECHNOLOGY, INC.
9.3.1. Company overview
9.3.2. Key executives
9.3.3. Company snapshot
9.3.4. Operating business segments
9.3.5. Product portfolio
9.3.6. R&D expenditure
9.3.7. Business performance
9.3.8. Key strategic moves and developments
9.4. DEVICE ENGINEERING INC.
9.4.1. Company overview
9.4.2. Key executives
9.4.3. Company snapshot
9.4.4. Product portfolio
9.4.5. Key strategic moves and developments
9.5. HIDENSITY GROUP (HMT MICROELECTRONIC AG)
9.5.1. Company overview
9.5.2. Key executives
9.5.3. Company snapshot
9.5.4. Product portfolio
9.5.5. Key strategic moves and developments
9.6. LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)
9.6.1. Company overview
9.6.2. Key executives
9.6.3. Company snapshot
9.6.4. Operating business segments
9.6.5. Product portfolio
9.7. PRESTO ENGINEERING GROUP
9.7.1. Company overview
9.7.2. Key executives
9.7.3. Company snapshot
9.7.4. Product portfolio
9.7.5. Key strategic moves and developments
9.8. SENCIO BV
9.8.1. Company overview
9.8.2. Key executives
9.8.3. Company snapshot
9.8.4. Product portfolio
9.9. SHORTLINK GROUP
9.9.1. Company overview
9.9.2. Key executives
9.9.3. Company snapshot
9.9.4. Product portfolio
9.9.5. Key strategic moves and developments
9.10. SIFIVE, INC. (OPENFIVE)
9.10.1. Company overview
9.10.2. Key executives
9.10.3. Company snapshot
9.10.4. Product portfolio
List of Tables
TABLE 01. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PROCESS, 2020-2030 ($MILLION)
TABLE 02. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR SAWING, BY REGION 2020-2030 ($MILLION)
TABLE 03. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR SORTING, BY REGION 2020-2030 ($MILLION)
TABLE 04. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR TESTING, BY REGION 2020-2030 ($MILLION)
TABLE 05. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR ASSEMBLY, BY REGION 2020-2030 ($MILLION)
TABLE 06. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 07. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR BALL GRID ARRAY, BY REGION, 2020-2030 ($MILLION)
TABLE 08. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR CHIP SCALE PACKAGE, BY REGION 2020-2030 ($MILLION)
TABLE 09. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR MULTI-PACKAGE, BY REGION, 2020-2030 ($MILLION)
TABLE 10. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR STACKED DIE, BY REGION 2020-2030 ($MILLION)
TABLE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR QUAD & DUAL, BY REGION, 2020-2030 ($MILLION)
TABLE 12. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 13. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR AUTOMOTIVE, BY REGION 2020-2030 ($MILLION)
TABLE 14. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR CONSUMER ELECTRONICS, BY REGION 2020-2030 ($MILLION)
TABLE 15. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR INDUSTRIAL, BY REGION 2020-2030 ($MILLION)
TABLE 16. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR TELECOMMUNICATION, BY REGION 2020-2030 ($MILLION)
TABLE 17. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR AEROSPACE AND DEFENSE, BY REGION 2020-2030 ($MILLION)
TABLE 18. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR MEDICAL AND HEALTHCARE , BY REGION 2020-2030 ($MILLION)
TABLE 19. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR LOGISTICS AND TRANSPORTATION, BY REGION 2020-2030 ($MILLION)
TABLE 20. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 21. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2020-2030 ($MILLION)
TABLE 22. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 23. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 24. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 25. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 26. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 27. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 28. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 29. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 30. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2020-2030 ($MILLION)
TABLE 31. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 32. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 33. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 34. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 35. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 36. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 37. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 38. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 39. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 40. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 41. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 42. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 43. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 44. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS 2020-2030 ($MILLION)
TABLE 45. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 46. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 47. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 48. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 49. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 50. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-20230 ($MILLION)
TABLE 51. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 52. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 53. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 54. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 55. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 56. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 57. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 58. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 59. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 60. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 61. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 62. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PROCESS, 2020-2030 ($MILLION)
TABLE 63. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2020-2030 ($MILLION)
TABLE 64. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2020-2030 ($MILLION)
TABLE 65. ADVANCED SILICON S.A.:KEY EXECUTIVES
TABLE 66. ADVANCED SILICON S.A.: COMPANY SNAPSHOT
TABLE 67. ADVANCED SILICON S.A.: PRODUCT PORTFOLIO
TABLE 68. ALPHACORE INC.:KEY EXECUTIVES
TABLE 69. ALPHACORE INC.: COMPANY SNAPSHOT
TABLE 70. ALPHACORE INC.: PRODUCT PORTFOLIO
TABLE 71. ALPHACORE INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 72. AMKOR TECHNOLOGY, INC.:KEY EXECUTIVES
TABLE 73. AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 74. AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 75. AMKOR TECHNOLOGY, INC.: PRODUCT PORTFOLIO
TABLE 76. AMKOR TECHNOLOGY, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 77. DEVICE ENGINEERING INC.:KEY EXECUTIVES
TABLE 78. DEVICE ENGINEERING INC.: COMPANY SNAPSHOT
TABLE 79. DEVICE ENGINEERING INC.: PRODUCT PORTFOLIO
TABLE 80. DEVICE ENGINEERING INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 81. HIDENSITY GROUP:KEY EXECUTIVES
TABLE 82. HIDENSITY GROUP: COMPANY SNAPSHOT
TABLE 83. HMT MICROELECTRONIC AG: PRODUCT PORTFOLIO
TABLE 84. HMT MICROELECTRONIC AG: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 85. LUMINAR TECHNOLOGIES, INC.:KEY EXECUTIVES
TABLE 86. LUMINAR TECHNOLOGIES, INC.: COMPANY SNAPSHOT
TABLE 87. LUMINAR TECHNOLOGIES, INC.: OPERATING SEGMENTS
TABLE 88. BLACK FOREST ENGINEERING: PRODUCT PORTFOLIO
TABLE 89. PRESTO ENGINEERING GROUP:KEY EXECUTIVES
TABLE 90. PRESTO ENGINEERING GROUP: COMPANY SNAPSHOT
TABLE 91. PRESTO ENGINEERING GROUP: PRODUCT PORTFOLIO
TABLE 92. PRESTO ENGINEERING GROUP: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 93. SENCIO BV:KEY EXECUTIVES
TABLE 94. SENCIO BV: COMPANY SNAPSHOT
TABLE 95. SENCIO BV: PRODUCT PORTFOLIO
TABLE 96. SHORTLINK GROUP:KEY EXECUTIVES
TABLE 97. SHORTLINK GROUP: COMPANY SNAPSHOT
TABLE 98. SHORTLINK GROUP: PRODUCT PORTFOLIO
TABLE 99. SHORTLINK GROUP: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 100. SIFIVE, INC.:KEY EXECUTIVES
TABLE 101. SIFIVE, INC.: COMPANY SNAPSHOT
TABLE 102. OPENFIVE: PRODUCT PORTFOLIO
List of Figures
FIGURE 01. KEY MARKET SEGMENTS
FIGURE 02. EXECUTIVE SUMMARY
FIGURE 03. EXECUTIVE SUMMARY
FIGURE 04. TOP IMPACTING FACTORS
FIGURE 05. TOP INVESTMENT POCKETS
FIGURE 06. MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 07. MODERATE TO HIGH THREAT OF NEW ENTRANTS
FIGURE 08. MODERATE THREAT OF SUBSTITUTES
FIGURE 09. MODERATE-TO-HIGH INTENSITY OF RIVALRY
FIGURE 10. MODERATE TO HIGH BARGAINING POWER OF BUYERS
FIGURE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PROCESS, 2020-2030
FIGURE 12. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR SAWING, BY COUNTRY, 2020-2030 (%)
FIGURE 13. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR SORTING, BY COUNTRY, 2020-2030 (%)
FIGURE 14. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR TESTING, BY COUNTRY, 2020 & 2030 (%)
FIGURE 15. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTFOR ASSEMBLY AND TEST (OSAT) MARKET FOR ASSEMBLY, BY COUNTRY, 2020 & 2030 (%)
FIGURE 16. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PACKAGING TYPE, 2020-2030
FIGURE 17. COMPARATIVE SHARE ANALYSIS OF BALL GRID ARRAY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2020-2030 (%)
FIGURE 18. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR CHIP SCALE PACKAGE, BY COUNTRY, 2020-2030 (%)
FIGURE 19. COMPARATIVE SHARE ANALYSIS OF MULTI-PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR MULTI-PACKAGE, BY COUNTRY, 2020-2030 (%)
FIGURE 20. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR STACKED DIE, BY COUNTRY, 2020-2030 (%)
FIGURE 21. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR QUAD & DUAL, BY COUNTRY, 2020-2030 (%)
FIGURE 22. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION, 2020-2030
FIGURE 23. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR AUTOMOTIVE, BY COUNTRY, 2020-2030 (%)
FIGURE 24. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2020-2030 (%)
FIGURE 25. COMPARATIVE SHARE ANALYSIS OF MULTI-PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR INDUSTRIAL, BY COUNTRY, 2020-2030 (%)
FIGURE 26. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2020 & 2030 (%)
FIGURE 27. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR AEROSPACE AND DEFENSE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 28. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR MEDICAL AND HEALTHCARE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 29. COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR LOGISTICS AND TRANSPORTATION, BY COUNTRY, 2020 & 2030 (%)
FIGURE 30. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY REGION, 2020-2030
FIGURE 31. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2020 & 2030
FIGURE 32. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 33. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 34. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 35. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2020-2030
FIGURE 36. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 37. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 38. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 39. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 40. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 41. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 42. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 43. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 44. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2020 & 2030
FIGURE 45. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2020-2030
FIGURE 46. KEY PLAYER POSITIONG: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, 2020
FIGURE 47. TOP WINNING STRATEGIES, BY YEAR, 2018-2021
FIGURE 48. TOP WINNING STRATEGIES, BY DEVELOPMENT, 2018-2021 (%)
FIGURE 49. TOP WINNING STRATEGIES, BY COMPANY, 2018-2021
FIGURE 50. COMPETITIVE DASHBOARD
FIGURE 51. COMPETITIVE HEATMAP OF KEY PLAYERS
FIGURE 52. AMKOR TECHNOLOGY, INC.: R&D EXPENDITURE, 2018-2020 ($MILLION)
FIGURE 53. AMKOR TECHNOLOGY, INC.: REVENUE, 2018-2020 ($MILLION)
FIGURE 54. AMKOR TECHNOLOGY, INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 55. LUMINAR TECHNOLOGIES, INC.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 56. LUMINAR TECHNOLOGIES, INC.: REVENUE SHARE, BY REGION, 2020 (%)

Executive Summary

According to the report, “Outsourced Semiconductor Assembly and Testing Market," the outsourced semiconductor assembly and testing market size was valued at $34.6 billion in 2021, and is estimated to reach $60.3 billion by 2031, growing at a CAGR of 6.3% from 2022 to 2031.

Outsourced semiconductor assembly and test (OSAT) are the number of companies that offers third-party IC-packaging as well as test services. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations. OSAT mainly emphasizes on providing advanced packaging as well as test solutions for semiconductor companies in various markets such as consumer goods, communications, and computing along with emerging markets such as Internet of Things (IoT), automotive electronics, and wearable devices.

The global outsourced semiconductor assembly and testing industry is mainly driven by increase in demand for consumer electronics and surge in degree of urbanization. In addition, increase in adoption of smartphones significantly fuels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the other hand, outsourced semiconductor assembly and testing market trends inlcude growth in the chip market is anticipated to provide a huge opportunity for OSAT companies.

The assembly segment was the largest revenue contributor in 2021, and is expected to grow at a CAGR of 6.46% from 2022 to 2031. This is attributed to rise in need for effective supply chain management in the semiconductor manufacturing industry. By packaging type, the ball grid array segment was the leading largest contributor of revenue in 2021 and is expected to grow at a CAGR of 5.63% from 2022 to 2031. Technological advancements in the semiconductor industry has led to surge in demand for thinner and lighter electronics products.

This factor primarily drives growth of the ball grid array type of packaging, owing to several miniaturization advantages that it offers. By region, the outsourced semiconductor assembly and test market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. The analysis identified that North America contributed for the maximum revenue in 2021 in outsourced semiconductor assembly and testing market growth. This is attributed to increase in industrialization as well as rapid development in automotive and telecommunication industries.

The key players profiled in the outsourced semiconductor assembly and testing market analysis include Advanced Silicon S.A., Alphacore Inc., Amkor Technology, Inc., Device Engineering Inc., HiDensity Group (HMT microelectronic AG), Luminar Technologies, Inc. (Black Forest Engineering), Presto Engineering Group, Sencio BV, ShortLink group, and SiFive, Inc. (OpenFive). Market players have adopted various strategies such as product launch, expansion, collaboration, partnership, and acquisition to strengthen their foothold in the outsourced semiconductor assembly and testing market share.

Companies Mentioned

  • ADVANCED SILICON S.A.
  • ALPHACORE INC.
  • AMKOR TECHNOLOGY, INC.
  • DEVICE ENGINEERING INC.
  • HIDENSITY GROUP (HMT MICROELECTRONIC AG)
  • PRESTO ENGINEERING GROUP
  • Sencio BV
  • SHORTLINK GROUP
  • SIFIVE, INC. (OPENFIVE)
  • LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)

Methodology

The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.

They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.

They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:

  • Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
  • Scientific and technical writings for product information and related preemptions
  • Regional government and statistical databases for macro analysis
  • Authentic news articles and other related releases for market evaluation
  • Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast

Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.

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Table Information

Report AttributeDetails
No. of Pages225
PublishedSeptember 2022
Forecast Period2021 - 2031
Estimated Market Value ( USD ) in 2021 $ 34553.5 million
Forecasted Market Value ( USD ) by 2031 $ 60334.5 million
Compound Annual Growth Rate5.7%
Regions CoveredGlobal
No. of Companies Mentioned10

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