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The fan-out wafer level packaging market is forecast to grow by USD 5.52 billion during 2023-2028, accelerating at a CAGR of 23.77% during the forecast period. The report on the fan-out wafer level packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increased demand for compactly designed electronics, growing use of semiconductor ICs in IoT, and rapid adoption of finfet technology.
The fan-out wafer level packaging market is segmented as below:
By Technology
- High density
- Standard density
By Type
- 200 mm
- 300 mm
- Panel
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
The report on the fan-out wafer level packaging market covers the following areas:
- Fan-out wafer level packaging market sizing
- Fan-out wafer level packaging market forecast
- Fan-out wafer level packaging market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Technology
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global fan-out wafer level packaging market: Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA.Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is increasing adoption of semiconductor ICs in automobiles."
According to the report, one of the major drivers for this market is the increased demand for compactly designed electronics.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- Deca Technologies Inc.
- Infineon Technologies AG
- Jiangsu Changdian Technology Co. Ltd.
- nepes Corp.
- Nordson Corp.
- NXP Semiconductors NV
- Onto Innovation Inc.
- Panasonic Holdings Corp.
- Powertech Technology Inc.
- Renesas Electronics Corp.
- Singapore Semiconductor Industry Association
- SUSS MICROTEC SE
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Unisem M Berhad
- UTAC Holdings Ltd.
- Winbond Electronics Corp.
- Yield Engineering Systems
- Yole Developpement SA
