Three-Dimensional Integrated Circuit Market - Forecasts from 2021 to 2026

The three-dimensional integrated circuit market is expected to grow at a compound annual growth rate of 21.24% over the forecast period to reach a market size of US$26.413 billion in 2026 from US$6.860 billion in 2019. 3D integrated circuits (IC) are semiconductor MOS (metal oxide semiconductor) electronic devices constructed by stacking silicon dies or wafers vertically and connecting them through-silicon vias (TSVs) or copper connections (Cu-Cu), achieving performance improvements at lower power consumption with a smaller footprint compared to two-dimensional methods. Microelectronics and nanoelectronics are increasingly developing 3D integrated circuit technology, utilizing the z-direction to deliver electrical performance improvements. Integral circuits are classified into global (package) level, intermediate (bond pad) level, or local (transistor) level of interconnection hierarchy. 3D integration is generally considered to encompass a broad range of technologies, such as wafer-level packaging (3DWLP); interposer-based integration (2.5D and 3-D); 3-D stacked integrated circuits (3DSIC); monolithic 3-D ICs; heterogeneous integrated circuits; and three-dimensional systems integration.

There are numerous international organizations working to classify 3D integration technologies to establish standards and roadmaps of 3D integration, such as the Jisso Technology Roadmap Committee (JIC) and the International Technology Roadmap for Semiconductors (ITRS). In the 2010s, 3D integrated circuits were widely used in mobile devices and NAND flash memory. In 3D packaging, wire bonding and flip-chips are used to achieve vertical stacks while relying on traditional methods of interconnection. It is possible to distribute 3D packages throughout the 3D system by means of packages (3D SiP) and wafer-level packages (3D WLP), wire-bonded memory dies, as well as package-on-package configurations or flip chips; such systems are well established with well-proven infrastructure. Interconnects are formed using PoP devices that integrate disparate technologies such as 3D WLP. Redistribution layers (RDLs) and wafer bumping services are used to form interconnects using PoP devices. 2.5D interposers also use TSVs and RDLs to interconnect die side-by-side in silicon, glass, or organic interposers. 3D packaging uses off-chip signaling to allow chips within the package to communicate as though they were held in separate packages on a conventional circuit board.

ICs in 3D can be divided into two categories: 3D Stacked ICs (3D SICs), which use TSV interconnects to stack ICs together, and monolithic 3D ICs, in which fab processes are employed to deliver 3D interconnects at the local logic levels, which are specified by the ITRS, resulting in vertical connections between layers. One of the first monolithic approaches is exhibited by Samsung's 3D V-NAND devices.

Growth Factors

It is 3D ICs that are pushing the ICT industry forward. A high-performance network and devices that have large storage capacity are very bandwidth-intensive. Due to its high bandwidth benefits and chip density, 3D integration technology is expected to be used in the ICT sector to manage memory and bandwidth challenges. A major factor driving consideration of 3D-ICs is the increasing demand for devices to be miniaturized with efficient thermal management components

COVID-19 insights

The growth of the three-dimensional integrated circuit market is expected to be adversely affected by the COVID-19 pandemic as a result of disruptions brought by the disease to supply chains and manufacturing activities around the world. Due to this, the supply of three-dimensional integrated circuits, as well as the manufacturing output, are expected to decline, which will hamper this market's growth.

Competitive Insights

There has been an increase in demand for three-dimensional integrated circuits which has led several new market participants to enter the market, including Aveni. As a result of the entry of these new competitors into a market dominated by old behemoths like IBM and Amkor, further innovation is expected to ensue in the market for 3-D integrated circuits. In addition, numerous players in this market have taken numerous strategic actions to further increase their clientele as well as their market shares in the coming years, such as partnerships and the development of new solutions aimed at improving patient comfort, which will keep the industry competitive and always evolving.

Segmentation:

By Technology

• Monolithic
• Wafer on wafer
• Die on wafer
• Die on die

By Application

• MEMS
• Storage Device
• Sensors
• Others

By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• UK
• Germany
• France
• Italy
• Others
• Middle East and Africa
• Israel
• Saudi Arabia
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Taiwan
• Thailand
• Indonesia
• Others