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Analysis of Ericsson ERS Baseband 6648

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    Report

  • 64 Pages
  • October 2021
  • Region: Global
  • EJL Wireless Research
  • ID: 5459159

This report provides a comprehensive analysis of the Ericsson Baseband 6648 system. This product is a 5G NR digital baseband unit and supports single mode LTE, single mode 5G NR, and mixed mode LTE+5G NR. 


Features

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
    • Heat Fins

  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB

  • High Level Bill of Materials
    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type

  • Excludes analysis of passive chip resistors, capacitors, and inductors

Important Note: There is NO component pricing contained within the report.

 


Table of Contents

EXECUTIVE SUMMARY 


  • Active/Passive Component Summary 

CHAPTER 1: ERICSSON 5G BBU 


  • Overview of Baseband Unit 

CHAPTER 2: MECHANICAL ANALYSIS 


  • Chassis-Top Cover 
  • Chassis/ Heat Sink 
  • Plastic Bottom Cover 

CHAPTER 3: FAN TRAY UNIT 


  • Fan Unit 

CHAPTER 4: BASEBAND 6648 PCB 


  • Main PCB 
  • Main PCB Top Active Component Analysis 
  • Main PCB Top Passive Component Analysis 
  • Main PCB Bottom Active Component Analysis 
  • Main PCB Bottom Passive Component Analysis 
  • Auxiliary PCB 

CHAPTER 5: SOC HEAT SINKS 


  • L1 Modem/Fronthaul Heat Sink 
  • L2/L2 Processor Heat Sink 

APPENDIX A COMPONENT ANALYSIS 
APPENDIX B COMPONENTS BY SYSTEM AREA 
APPENDIX C ACTIVE COMPONENTS BY SUPPLIER 
APPENDIX D PASSIVE COMPONENTS BY SUPPLIER 

TABLES 
Table 1: Environmental Data 
Table 2: DC Power Supply Requirements 
Table 3: Power Consumption 
Table 4: Main PCB Top Active Bill of Materials 
Table 5: Main PCB Top Active Bill of Materials (con’t) 
Table 6: Main PCB Top Passive Only Bill of Materials 
Table 7: Main PCB Bottom Active Bill of Materials 
Table 8: Main PCB Bottom Passive Only Bill of Materials 
Table 9: Auxiliary PCB Top Component Bill of Materials 
Table 10: Auxiliary PCB Bottom Component Bill of Materials 
Table 11: Baseband 6648 System Unit PCB by Component Type 
Table 12: Baseband 6648 System Unit PCBs by Active Component Vendor 
Table 13: Baseband 6648 System Unit PCBs by Passive/Connector/Other Component Vendor 

EXHIBITS 
Exhibit 1: Simplified Block Diagram of Baseband System 
Exhibit 2: Ericsson 5G NR BBU Solution Example 
Exhibit 3: Baseband 6648 Hardware Architecture Block Diagram 
Exhibit 4: Baseband 6648, Front View 
Exhibit 5: Baseband 6648, Rear View with Fan Tray 
Exhibit 6: Baseband 6648, Rear View without Fan Tray 
Exhibit 7: Baseband 6648, Top View 
Exhibit 8: Baseband 6648, Bottom View 
Exhibit 9: Baseband 6648, Left Side View 
Exhibit 10: Baseband 6648, Right Side View 
Exhibit 11: Chassis Top Cover, Front Panel 
Exhibit 12: Chassis Top Cover, External View 
Exhibit 13: Chassis Top Cover, Internal View 
Exhibit 14: Chassis/Heat Sink, External View 
Exhibit 15: Chassis/Heat Sink, Internal View, Mechanical 
Exhibit 16: Chassis/Heat Sink, Internal View, Thermal 
Exhibit 17: Chassis/Heat Sink, External View, Front 
Exhibit 18: Chassis/Heat Sink, External View, Rear 
Exhibit 19: Chassis/Heat Sink, Right Side View 
Exhibit 20: Chassis/Heat Sink, Left Side View 
Exhibit 21: Chassis/Heat Sink, Heat Transfer Fin Dimensions 
Exhibit 22: Chassis/Heat Sink, Heat Transfer Fin Types 
Exhibit 23: Chassis/Heat Sink, Heat Transfer Fin Type Details 
Exhibit 24: Chassis/Heat Sink, Fan Tray Locking Clips 
Exhibit 25: Plastic Bottom Cover, Front View 
Exhibit 26: Plastic Bottom Cover, External View 
Exhibit 27: Plastic Bottom Cover, Internal View 
Exhibit 28: Fan Tray Supplier Product Label 
Exhibit 29: Fan Tray External View 
Exhibit 30: Fan Tray Internal View 
Exhibit 31: Fan Tray Top View 
Exhibit 32: Fan Tray Bottom View 
Exhibit 33: Fan Tray Side View 
Exhibit 34: Fan Tray, Major Components 
Exhibit 35: PCB Top View 
Exhibit 36: PCB Bottom View 
Exhibit 37: Fan Unit Marking 
Exhibit 38: Fan Unit Wiring Harness 
Exhibit 39: Fan Unit Material Type 
Exhibit 40: Fan Unit Foam Spacer 
Exhibit 41: Fan Unit Mounting Location 
Exhibit 42: Fan Tray DC Power Connector 
Exhibit 43: DC Power Connector Supplier Part Number 
Exhibit 44: Baseband 6648 PCB, Top (Left) and Bottom (Right) Views 
Exhibit 45: Main PCB Top Active Component Diagram 
Exhibit 46: Main PCB Top Passive Only Component Diagram 
Exhibit 47: Main PCB Bottom Active Component Diagram 
Exhibit 48: Main PCB Bottom Passive Only Component Diagram 
Exhibit 49: Baseband LED Status Indicator Lights 
Exhibit 50: Auxiliary PCB, Top Component Diagram 
Exhibit 51: Auxiliary PCB, Bottom Component Diagram 
Exhibit 52: Main PCB-Auxiliary PCB Connector 
Exhibit 53: L1 Modem/Fronthaul Heat Sink, External View 
Exhibit 54: L1 Modem/Fronthaul Heat Sink, Internal View 
Exhibit 55: L2/L2 Processor Heat Sink, External View 
Exhibit 56: L2/L2 Processor Heat Sink, Internal View 
Exhibit 57: Component Market Share by Type 
Exhibit 58: Active Semiconductor Market Share by Vendor 
Exhibit 59: Active Semiconductor Market Share by Vendor, 64+ Pin 
Exhibit 60: Passive/Connector/Other Component Market Share by Vendor 
Exhibit 61: Passive/Connector/Other Component Market Share by Country of Origin 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


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