ICT Role in Smart Grid Development: Technologies, Standards, Markets

1.1 General
1.1.1 Smart Grid Definition
1.2 Issues
1.3 Vision: SG ICT
1.3.1 Neural Grid
1.4 U.S.
1.4.1 Objectives
1.4.2 Statistics
1.4.3 Conceptual Model
1.4.4 Plans and Current Situation
1.5 England
1.6 Italy
1.7 China
1.8 Scope
1.9 Research Methodology
1.10 Target Audience

2.1 Main Organizations - Functionalities
2.2 Structure
2.2.1 SG Layers
2.2.1.1 ETSI Layering
2.2.2 ETSI Subnetworks Architecture
2.3 Requirements: SG Networking
2.3.1 View: SG ICT Layers
2.4 Industry and User Groups Projects
2.4.1 ETSI
2.4.1.1 Major Items
2.4.1.2 M490
2.4.1.3 ETSI Documents
2.4.2 IEC
2.4.3 IEEE
2.4.4 Global Intelligent Utility Network Coalition
2.4.5 Smart Networks Council (SNC)
2.4.6 U-SNAP Alliance
2.4.6.1 Specification and HAN
2.4.6.2 Merge
2.4.6.3 Further Development
2.4.7 ESMIG
2.4.8 Demand Response and Smart Grid Coalition (DRSG)
2.4.9 EPRI (Electrical Power Research Institute)
2.4.10 ZigBee and Wi-Fi Alliances
2.4.11 NIST
2.4.12 OpenHAN
2.4.13 Federal Smart Grid Task Force
2.4.14 Open Smart Grid Users Group (OSGUG)
2.4.15 ITU
2.4.16 OpenADR
2.4.17 Comments

3.1 Function and Structure: SG ICT
3.2 Current Status
3.3 Current Objectives
3.4 Choices
3.5 Smart Meters
3.5.1 Objectives
3.5.2 Details
3.5.3 Functions
3.5.4 Components
3.5.4.1 Communications
3.6 Security
3.6.1 AMI Security Task Force
3.6.2 NIST Contributions
3.7 Market
3.7.1 Market Drivers
3.7.2 Market Projections: Smart Meters
3.8 Industry

• Aclara (Software and Systems, BPL)
• Aeris (Wireless Network Provider)
• Connected Energy (Software Platform)
• Carlson Wireless (Radio Platforms)
• Cisco (IP-based Infrastructure)
• Eaton (Cooper Power Systems)
• GridPoint (Network Platform)
• Honeywell (Connectivity, SM)
• Itron (Intelligent Metering)
• Nokia (Infrastructure)
• Oracle (Software)
• Landis+Gyr (Metering Devices)
• Sensus (Data Collection and Metering)
• Siemens (Software, Hardware)
• Spinwave (Building Control, HAN)
• Tantalus (Networking and Devices)
• TransData (Wireless AMI/AMR Meter)
• TI
• Trilliant (Intelligent Metering)
• Uplight

4.1 IEEE
4.1.1 IEEE 2030
4.1.1.1 Scope
4.1.1.2 Purpose
4.1.2 IEEE 1901-2020
4.1.3 802.15.4g-Smart Utility Networks
4.1.3.1 General
4.1.3.2 Purpose
4.1.3.3 Need
4.1.3.4 Value
4.1.3.5 Overview - PHY
4.1.3.6 Regions
4.1.3.6.1 Frequencies Allocations
4.1.3.7 Details
4.1.3.7.1 Requirements: Major Characteristics
4.1.3.7.2 Considerations
4.1.3.7.3 PHY/MAC Modifications
4.1.3.8 Summary
4.1.3.9 Wi-SUN
4.1.4 Cognitive Radio: IEEE 802.22
4.1.4.1 General
4.1.4.2 Group
4.1.4.2.1 IEEE 802.22
4.1.4.2.1.1 802.22-2011
4.1.4.2.1.2 802.22-2019
4.1.4.2.2 IEEE 802.22.1
4.1.4.2.3 IEEE 802.22.2-2012
4.1.4.2.4 IEEE 802.22a-2014
4.1.4.2.5 IEEE 802.22b-2015
4.1.4.3 Developments
4.1.4.4 IEEE 802.22 Overview
4.1.4.5 Major Characteristics - 802.22
4.1.4.6 IEEE 802.22 Details
4.1.4.6.1 Physical Layer - Major Characteristics
4.1.4.6.2 MAC Layer
4.1.4.7 Cognitive Functions
4.1.4.8 IEEE 802.22 - Marketing Considerations
4.1.4.9 Major Applications
4.1.4.10 Summary
4.1.4.11 802.22 and Smart Grid
4.1.4.12 Usage Models
4.1.4.13 Benefits
4.2 3GPP LTE and SG
4.2.1 3GPP
4.2.2 LTE Objectives
4.2.3 Key Features of LTE
4.2.3.1 Evolved Packet Core (EPC)
4.2.3.2 LTE Advanced
4.2.4 Benefits
4.2.5 Market
4.2.5.1 Drivers
4.2.5.2 LTE Market Projections
4.2.6 Industry
4.2.6.1 Trends
4.2.6.2 Vendors

• Bittium
• Cisco
• CommAgility
• Ericsson
• Fujitsu
• Huawei
• Motorola Solutions
• Nokia
• Qualcomm
• Sequans
• TI
• u-blox
• ZTE

4.2.7 Role of LTE in Smart Grid Development
4.2.7.1 General
4.2.7.2 Examples
4.2.7.2.1 Ericsson
4.2.7.2.2 Cisco
4.2.7.2.3 Nokia and Tantalus
4.2.7.3 Details
4.2.7.3.1 Scalable LTE IoT Platform and SG
4.2.7.3.2 Smart Metering Specifics - LTE
4.2.7.3.2.1 Choices
4.2.7.3.2.2 Reasons
4.2.7.4 Summary
4.3 Wireline ICT - SG
4.3.1 IEEE 1901.2
4.3.1.1 Choices - ITU
4.3.1.1.1 G3 PLC
4.3.1.1.1.1 Maxim-G3 PLC
4.3.1.1.1.2 G3 PLC Alliance
4.3.1.1.1.3 Approval
4.3.1.1.1.4 Details
4.3.1.1.1.4.1 PHY Layer
4.3.1.1.1.4.2 MAC Layer
4.3.1.1.1.4.3 Network and Transport Layers
4.3.1.1.1.4.4 Application Layer
4.3.1.1.2 PRIME
4.3.1.1.2.1 PRIME Alliance
4.3.1.1.2.2 Benefits
4.3.1.1.2.3 Specification
4.3.1.1.2.4 PRIME Industry

5.1 Weightless Technologies
5.1.1 Weightless Alliance
5.1.2 Common Features
5.1.2.1 Protocol Details
5.1.3 Weightless-W
5.1.3.1 White Spaces Communications - Principles
5.1.3.2 Definition
5.1.3.3 Rational
5.1.3.3.1 Ecosystem and Use Cases
5.1.3.3.2 Weightless-W Details
5.1.4 Changes
5.1.5 Weightless-N
5.1.5.1 General
5.1.5.2 Open Standard
5.1.5.3 Nwave
5.1.5.3.1 NWave - Current Position
5.1.6 Weightless-P
5.1.6.1 General
5.1.6.2 Details
5.1.7 Comparison of Weightless Technologies
5.1.8 Example
5.2 RPMA
5.2.1 Major Features
5.2.2 Expansion
5.2.3 Components and Structure
5.2.4 Use Cases
5.3 LoRa
5.3.1 Alliance
5.3.1.1 Open Protocol
5.3.2 Technology Building Blocks
5.3.2.1 Layered Structure
5.3.2.2 Modulation
5.3.2.3 Long Range
5.3.2.4 Applications
5.3.2.5 Network Architecture
5.3.2.6 Classes
5.3.2.7 LoRaWAN
5.3.2.8 Major Characteristics
5.3.3 Industry

• Actility
• Advantech
• Cisco
• Embit
• LORIOT.io
• Microchip Technology
• MultiTech
• Murata
• Sagemcom
• Semtech
• STMicroelectronics
• Tektelic

5.4 SigFox
5.4.1 Company
5.4.2 Technology - Details
5.4.2.1 Uplink
5.4.2.2 Downlink
5.4.2.3 SmartLNB
5.4.3 Coverage
5.4.4 Use Cases
5.4.5 Industry

• Adeunis RF
• Innocomm
• Microchip
• On Semiconductor
• Telit
• TI

5.5 The G3-PLC Hybrid and SG

Appendix I: IEEE802.15.4g Characteristics
Appendix II: Regulations - TVWS
Appendix III: Survey of 802.22-related Patents (2018-2022)
Appendix IV: Survey of SigFox-related Patents (2018-2022)
Appendix V: Survey of LoRa-related Patents (2018-2022)