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Asia Pacific Power Electronics Market By Application, By Device type, By Material, By Country, Opportunity Analysis and Industry Forecast, 2021 - 2027

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    Report

  • 132 Pages
  • November 2021
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5514562

The Asia Pacific Power Electronics Market is expected to witness market growth of 4.5% CAGR during the forecast period (2021-2027).

There has been a significant rise in the usage and capability of power electronic devices from the last few years, the advanced power electronics are now used widely to perform numerous functions like amplification, rectification, control, and generation.

 There are certain medical devices that utilize power electronics including EEG (electroencephalograph) that is utilized to record the electrical activity of the brain, ECG (electrocardiograph) that is used to investigate the condition of a patient’s heart, EMG (electromyograph) that determine the activity of the muscles, X-ray machine which helps in taking pictures of internal bone structure.  Moreover, this device is also utilized in the treatment of certain diseases across the medical industry.

The presence of key market players in this region is one of the aspects propelling the growth of the regional power electronics market. In addition, China is among the leading countries that have a huge manufacturing sector for various electronic items. These electronic devices are majorly embedded with power electronic devices and thus, fueling the growth of the regional power electronics market in the coming years.

The Power IC market dominated the Asia Pacific Power Electronics Market by Device Type in 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $7,733.2 million by 2027. The Power Module market is anticipated to grow a CAGR of 4.3% during (2021 - 2027).

Based on application, the market is classified into consumer electronics, industrial, automotive & transportation, ICT, aerospace & defense, and others. Based on Device type, the market is segmented into power discrete, power module, and power IC. Based on Material the market is divided into silicon, silicon carbide, and gallium nitride. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.



The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include NXP Semiconductors N.V., Infineon Technologies AG, Texas Instruments, Inc., Toshiba Corporation, Renesas Electronics Corporation, ON Semiconductor Corporation, STMicroelectronics N.V., Mitsubishi Electric Corporation, Fuji Electric Co. Ltd. (Furukawa Group), and ABB Group.



Scope of the Study

Market Segments Covered in the Report:


By Application


  • Consumer Electronics
  • Industrial
  • Automotive & Transportation
  • ICT
  • Aerospace & Defense
  • Others

By Device type


  • Power discrete
  • Power module
  • Power IC

By Material


  • Silicon
  • Silicon Carbide
  • Gallium Nitride

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:


  • NXP Semiconductors N.V.
  • Infineon Technologies AG
  • Texas Instruments, Inc.
  • Toshiba Corporation
  • Renesas Electronics Corporation
  • ON Semiconductor Corporation
  • STMicroelectronics N.V.
  • Mitsubishi Electric Corporation
  • Fuji Electric Co. Ltd. (Furukawa Group)
  • ABB Group

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Power Electronics Market, by Application
1.4.2 Asia Pacific Power Electronics Market, by Device type
1.4.3 Asia Pacific Power Electronics Market, by Material
1.4.4 Asia Pacific Power Electronics Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.2.4 Geographical Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2017, Sep - 2021, Nov) Leading Players
Chapter 4. Asia Pacific Power Electronics Market by Application
4.1 Asia Pacific Consumer Electronics Market by Country
4.2 Asia Pacific Automotive & Transportation Market by Country
4.3 Asia Pacific Industrial Market by Country
4.4 Asia Pacific ICT Market by Country
4.5 Asia Pacific Aerospace & Defense Market by Country
4.6 Asia Pacific Other Application Market by Country
Chapter 5. Asia Pacific Power Electronics Market by Device Type
5.1 Asia Pacific Power IC Market by Country
5.2 Asia Pacific Power Module Market by Country
5.3 Asia Pacific Power Discrete Market by Country
Chapter 6. Asia Pacific Power Electronics Market by Material
6.1 Asia Pacific Silicon Market by Country
6.2 Asia Pacific Silicon Carbide Market by Country
6.3 Asia Pacific Gallium Nitride Market by Country
6.4 Asia Pacific Others Market by Country
Chapter 7. Asia Pacific Power Electronics Market by Country
7.1 China Power Electronics Market
7.1.1 China Power Electronics Market by Application
7.1.2 China Power Electronics Market by Device Type
7.1.3 China Power Electronics Market by Material
7.2 Japan Power Electronics Market
7.2.1 Japan Power Electronics Market by Application
7.2.2 Japan Power Electronics Market by Device Type
7.2.3 Japan Power Electronics Market by Material
7.3 India Power Electronics Market
7.3.1 India Power Electronics Market by Application
7.3.2 India Power Electronics Market by Device Type
7.3.3 India Power Electronics Market by Material
7.4 South Korea Power Electronics Market
7.4.1 South Korea Power Electronics Market by Application
7.4.2 South Korea Power Electronics Market by Device Type
7.4.3 South Korea Power Electronics Market by Material
7.5 Singapore Power Electronics Market
7.5.1 Singapore Power Electronics Market by Application
7.5.2 Singapore Power Electronics Market by Device Type
7.5.3 Singapore Power Electronics Market by Material
7.6 Malaysia Power Electronics Market
7.6.1 Malaysia Power Electronics Market by Application
7.6.2 Malaysia Power Electronics Market by Device Type
7.6.3 Malaysia Power Electronics Market by Material
7.7 Rest of Asia Pacific Power Electronics Market
7.7.1 Rest of Asia Pacific Power Electronics Market by Application
7.7.2 Rest of Asia Pacific Power Electronics Market by Device Type
7.7.3 Rest of Asia Pacific Power Electronics Market by Material
Chapter 8. Company Profiles
8.1 NXP Semiconductors N.V.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Partnerships, Collaborations, and Agreements:
8.1.6 SWOT Analysis
8.2 Infineon Technologies AG
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments:
8.2.5.1 Partnerships, Collaborations, and Agreements:
8.2.5.2 Acquisitions and Mergers:
8.2.5.3 Product Launches and Product Expansions:
8.2.5.4 Geographical Expansions:
8.2.6 SWOT Analysis
8.3 Texas Instruments, Inc.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expense
8.3.5 Recent strategies and developments:
8.3.5.1 Partnerships, Collaborations, and Agreements:
8.3.5.2 Acquisitions and Mergers:
8.3.5.3 Product Launches and Product Expansions:
8.3.5.4 Geographical Expansions:
8.3.6 SWOT Analysis
8.4 Toshiba Corporation
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research and Development Expense
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.4.5.2 Geographical Expansions:
8.4.6 SWOT Analysis
8.5 Renesas Electronics Corporation
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments:
8.5.5.1 Partnerships, Collaborations, and Agreements:
8.5.5.2 Acquisition and Mergers:
8.5.5.3 Product Launches and Product Expansions:
8.6 ON Semiconductor Corporation
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments:
8.6.5.1 Partnerships, Collaborations, and Agreements:
8.6.5.2 Acquisitions and Mergers:
8.6.5.3 Product Launches and Product Expansions:
8.7 STMicroelectronics N.V.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 Recent strategies and developments:
8.7.5.1 Partnerships, Collaborations, and Agreements:
8.7.5.2 Acquisitions and Mergers:
8.7.5.3 Product Launches and Product Expansions:
8.7.6 SWOT Analysis
8.8 Mitsubishi Electric Corporation
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 Recent Strategies and Developments:
8.8.5.1 Acquisitions and Mergers:
8.8.5.2 Product Launches and Product Expansions:
8.8.6 SWOT Analysis
8.9 Fuji Electric Co. Ltd. (Furukawa Group)
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 Recent strategies and developments:
8.9.5.1 Acquisitions and Mergers:
8.9.5.2 Product Launches and Product Expansions:
8.1 ABB Group
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Segmental and Regional Analysis
8.10.4 Research & Development Expense
8.10.5 Recent strategies and developments:
8.10.5.1 Acquisitions and Mergers:
8.10.5.2 Product Launches and Product Expansions:
8.10.5.3 Geographical Expansions:
8.10.6 SWOT Analysis

Companies Mentioned

  • NXP Semiconductors N.V.
  • Infineon Technologies AG
  • Texas Instruments, Inc.
  • Toshiba Corporation
  • Renesas Electronics Corporation
  • ON Semiconductor Corporation
  • STMicroelectronics N.V.
  • Mitsubishi Electric Corporation
  • Fuji Electric Co. Ltd. (Furukawa Group)
  • ABB Group

Methodology

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