The Sensor Technology Opportunity Engine issue for November 2021 covers innovations in occupancy sensors, ultrasonic sensors, image sensors, and sensor fusion. Some of the innovations profiled include AI-based occupancy sensor for workspace management, collision avoidance using 3D ultrasonic echolocation sensors, RGBC sensors for smartphone cameras, LiDAR for ADAS applications, AI-based sound recognition for homeland security, AI-powered runway monitoring in airports, and fiber optic sensor technology for industrial applications among others.
Sensor Technology Opportunity Engine (TOE) captures global sensor-related innovations and developments on a monthly basis. Innovations are directed toward developing smart and intelligent sensors with functionalities beyond sensing. Research focus areas include: low power sensors (energy harvesting), industrial automation sensors (M2M, vision sensor), ubiquitous sensor (WSN, sensor fusion), smart sensors (wearables, quantified self), high sensitivity and smaller size (MEMS, nanosensors), and improved security (CBRNE, terahertz). The need for low power, smaller, lighter sensors with enhanced performance attributes and minimal false alarms is driving innovations in the sensors space.
The Sensors and Instrumentation cluster covers innovations pertaining to technologies such as wireless sensors and networks, energy harvesting, haptics and touch, MEMS and nanosensors, Terahertz, ubiquitous/smart sensors, CBRNE, quantified-self, sensor fusion, M2M communications, and drones.
Table of Contents
Innovations in Sensor Technologies
- AI-Based Occupancy Sensor for Workspace Management
- Value Proposition of Density
- Density - Investor Dashboard
- 3D Ultrasonic Echolocation Sensor for Avoiding Collision
- Value Proposition of Toposens
- Toposens - Investor Dashboard
- Rgbc Sensor for Smartphone Cameras
- Value Proposition of Omnivision Technologies
- Omnivision Technologies - Investor Dashboard
- Camera-Lidar Sensor Fusion for Adas Applications
- Value Proposition of Kyocera Corporation
- Kyocera Corporation - Investor Dashboard
- Novel Spad Depth Sensor for Automotive Lidar Application
- Value Proposition of Sony Semiconductor Solutions Corporation
- Sony Semiconductor Solutions Corporation - Investor Dashboard
- AI Sound Recognition Technology for Home and Security
- AI-Powered Runway Monitoring Solution for Airports
- Fiber Optic Sensor Technology for MRI and Industrial Applications
- Sensor Technology to Measure Stem Water Potential in Agriculture
- Novel Sensor Technology to Monitor Shelf Life and Freshness of Perishable Food
Industry Contacts
- Legal Disclaimer
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Density
- Kyocera Corporation
- Omnivision Technologies
- Sony Semiconductor Solutions Corporation
- Toposens