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Rugged IC Market By Level Application, and End Use: Global Opportunity Analysis and Industry Forecast, 2021-2030

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    Report

  • 271 Pages
  • November 2021
  • Region: Global
  • Allied Market Research
  • ID: 5533724
The global rugged IC market was valued at $811.0 million in 2020, and is projected to reach $1,551.8 million by 2030, registering a CAGR of 6.9% from 2021 to 2030. Rugged ICs are created by using silicon carbide since this semiconducting material can withstand high voltage and possess high thermal conductivity. Rugged ICs are far superior to usual ICs, in terms of built quality and design, thus they provide better performance to electrical devices. These advanced ICs improve efficiency of analog and digital circuits and are extensively used in different sectors such as electronics, power generation, automobile, and aerospace.



The scope of the report discusses potential opportunities for the market players to enter the global rugged IC market. This report also provides in-depth analysis of the market, outlining current trends, key driving factors, and key areas of investment. The report includes Porter’s five forces analysis to understand the competitive scenario of the industry and role of each stakeholder in the value chain. The report features strategies adopted by key market players to maintain their foothold in the market.

The rugged IC market is analyzed by level, application, end use, and region. By level, the market is divided into semi-rugged, fully-rugged, and ultra-rugged. By application, it is classified into mobile phones, tablets, scanners, and others. By end use, it is categorized into consumer electronics, automotive, healthcare, industrial, manufacturing, and others. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

The key players profiled in the report include General Dynamics Corporation, Crystal Group, Richtek Technology Corporation, Qualcomm, Honeywell International Inc., Infineon Technologies AG, Analog Devices Inc., NXP Semiconductors N.V., Texas Instruments Inc., and ST Microelectronics. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, regional expansion, and collaboration to enhance their market penetration.

KEY BENEFITS FOR STAKEHOLDERS

  • This study includes analytical depiction of the rugged IC market forecast along with current trends and future estimations to determine the imminent investment pockets.
  • The report presents information regarding key drivers, restraints, and opportunities in the rugged IC market analysis.
  • The rugged IC market trends are quantitatively analyzed from 2020 to 2028 to highlight the financial competency of the industry.
  • Porter’s five forces analysis illustrates the potency of buyers and suppliers in the industry.

Rugged IC Market Key Segments


By Level

  • Semi-Rugged
  • Fully-Rugged
  • Ultra-Rugged

By Application

  • Mobile Phones
  • Tablets
  • Scanners
  • Others

By End Use

  • Automotive
  • Consumer Electronics
  • Healthcare
  • Industrial
  • Manufacturing
  • Others

By Region

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Rest of Europe
  • Asia-Pacific
  • China
  • Japan
  • South Korea
  • Rest of Asia-Pacific
  • LAMEA
  • Latin America
  • Middle East
  • Africa

Key Market Players

  • General Dynamics Corporation
  • Crystal Group
  • Richtek Technology Corporation
  • Qualcomm
  • Honeywell International Inc.
  • Infineon Technologies AG
  • Analog Devices Inc.
  • NXP Semiconductors N.V.
  • Texas Instruments Inc.
  • STMicroelectronics

 

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Table of Contents

CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings
2.1.1. Top impacting factors
2.1.2. Top investment pockets
2.2. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Porter’s five forces analysis
3.3. Patent analysis
3.3.1. By region (2020–2030)
3.3.2. By applicant
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Growth in development of smart cities
3.4.1.2. Growing Adoption of ruggedized computers.
3.4.1.3. Increase in demand and growth of rugged loT
3.4.2. Restraint
3.4.2.1. High production cost of rugged electronics
3.4.3. Opportunity
3.4.3.1. Growth in demand from military & aerospace
3.5. COVID Impact
3.5.1. Impact on market size
3.5.2. End user trends, preferences, and budget impact
3.5.3. End user trends, preferences, and budget impact
3.5.4. Parent industry impact
3.5.5. Key player strategies to tackle negative impact
3.5.5.1. Limited cuts to R&D expense
3.5.5.2. Focus on next-generation products
3.5.5.3. Shift toward agile supply chain model
3.5.6. Opportunity window
CHAPTER 4: RUGGED IC MARKET, LEVEL
4.1. Overview
4.2. Semi-Rugged
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Fully-Rugged
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
4.4. Ultra-Rugged
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis, by country
CHAPTER 5: RUGGED IC MARKET, BY APPLICATION
5.1. Overview
5.2. Mobile Phones
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Tablets
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Scanners
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Others
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
CHAPTER 6: RUGGED IC MARKET, BY END USE
6.1. Overview
6.2. Consumer Electronics
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. Automotive
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Healthcare
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
6.5. Industrial
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by region
6.5.3. Market analysis, by country
6.6. Manufacturing
6.6.1. Key market trends, growth factors, and opportunities
6.6.2. Market size and forecast, by region
6.6.3. Market analysis, by country
6.7. Others
6.7.1. Key market trends, growth factors, and opportunities
6.7.2. Market size and forecast, by region
6.7.3. Market analysis, by country
CHAPTER 7: RUGGED IC MARKET, BY REGION
7.1. Overview
7.2. North America
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by level
7.2.3. Market size and forecast, by application
7.2.4. Market size and forecast, by end use
7.2.5. Market analysis, by country
7.2.5.1. U.S.
7.2.5.1.1. Market size and forecast, by level
7.2.5.1.2. Market size and forecast, by application
7.2.5.1.3. Market size and forecast, by end use
7.2.5.2. Canada
7.2.5.2.1. Market size and forecast, by level
7.2.5.2.2. Market size and forecast, by application
7.2.5.2.3. Market size and forecast, by end use
7.2.5.3. Mexico
7.2.5.3.1. Market size and forecast, by level
7.2.5.3.2. Market size and forecast, by application
7.2.5.3.3. Market size and forecast, by end use
7.3. Europe
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by level
7.3.3. Market size and forecast, by application
7.3.4. Market size and forecast, by end use
7.3.5. Market analysis, by country
7.3.5.1. UK
7.3.5.1.1. Market size and forecast, by level
7.3.5.1.2. Market size and forecast, by application
7.3.5.1.3. Market size and forecast, by end use
7.3.5.2. Germany
7.3.5.2.1. Market size and forecast, by level
7.3.5.2.2. Market size and forecast, by application
7.3.5.2.3. Market size and forecast, by end use
7.3.5.3. France
7.3.5.3.1. Market size and forecast, by level
7.3.5.3.2. Market size and forecast, by application
7.3.5.3.3. Market size and forecast, by end use
7.3.5.4. Rest of Europe
7.3.5.4.1. Market size and forecast, by level
7.3.5.4.2. Market size and forecast, by application
7.3.5.4.3. Market size and forecast, by end use
7.4. Asia-Pacific
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by level
7.4.3. Market size and forecast, by application
7.4.4. Market size and forecast, by end use
7.4.5. Market analysis, by country
7.4.5.1. China
7.4.5.1.1. Market size and forecast, by level
7.4.5.1.2. Market size and forecast, by application
7.4.5.1.3. Market size and forecast, by end use
7.4.5.2. Japan
7.4.5.2.1. Market size and forecast, by level
7.4.5.2.2. Market size and forecast, by application
7.4.5.2.3. Market size and forecast, by end use
7.4.5.3. India
7.4.5.3.1. Market size and forecast, by level
7.4.5.3.2. Market size and forecast, by application
7.4.5.3.3. Market size and forecast, by end use
7.4.5.4. South Korea
7.4.5.4.1. Market size and forecast, by level
7.4.5.4.2. Market size and forecast, by application
7.4.5.4.3. Market size and forecast, by end use
7.4.5.5. Rest of Asia-Pacific
7.4.5.5.1. Market size and forecast, by level
7.4.5.5.2. Market size and forecast, by application
7.4.5.5.3. Market size and forecast, by end use
7.5. LAMEA
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by level
7.5.3. Market size and forecast, by application
7.5.4. Market size and forecast, by end use
7.5.5. Market analysis, by country
7.5.5.1. Latin America
7.5.5.1.1. Market size and forecast, by level
7.5.5.1.2. Market size and forecast, by application
7.5.5.1.3. Market size and forecast, by end use
7.5.5.2. Middle East
7.5.5.2.1. Market size and forecast, by level
7.5.5.2.2. Market size and forecast, by application
7.5.5.2.3. Market size and forecast, by end use
7.5.5.3. Africa
7.5.5.3.1. Market size and forecast, by level
7.5.5.3.2. Market size and forecast, by application
7.5.5.3.3. Market size and forecast, by end use
CHAPTER 8: COMPETITIVE LANDSCAPE
8.1. Introduction
8.1.1. Market player positioning, 2019
8.2. Top winning strategies
8.2.1. Top winning strategies, by year
8.2.2. Top winning strategies, by development
8.2.3. Top winning strategies, by company
8.3. Competitive dashboard
8.4. Competitive heatmap
CHAPTER 9: COMPANY PROFILES
9.1. General Dynamics Corporation
9.1.1. Company overview
9.1.2. Key executives
9.1.3. Company snapshot
9.1.4. Operating business segments:
9.1.5. Product portfolio
9.1.6. Business performance
9.2. Crystal Group Inc.
9.2.1. Company overview
9.2.2. Key executives
9.2.3. Company snapshot
9.2.4. Operating business segments
9.2.5. Product portfolio
9.2.6. Key strategic moves and developments
9.3. Richtek Technology Corporation
9.3.1. Company overview
9.3.2. Key executives
9.3.3. Company snapshot
9.3.4. Operating business segments
9.3.5. Product portfolio
9.3.6. Key strategic moves and developments
9.4. Qualcomm Inc.
9.4.1. Company overview
9.4.2. Key executives
9.4.3. Company snapshot
9.4.4. Operating business segments
9.4.5. Product portfolio
9.4.6. Business performance
9.5. Honeywell International Inc.
9.5.1. Company overview
9.5.2. Key executives
9.5.3. Company snapshot
9.5.4. Operating business segments
9.5.5. Product portfolio
9.5.6. Business performance
9.6. Infineon Technologies AG
9.6.1. Company overview
9.6.2. Key executives
9.6.3. Company snapshot
9.6.4. Operating business segments
9.6.5. Product portfolio
9.6.6. R&D expenditure
9.6.7. Business performance
9.7. Analog Devices Inc.
9.7.1. Company overview
9.7.2. Key executives
9.7.3. Company snapshot
9.7.4. Operating business segments
9.7.5. Product portfolio
9.7.6. Business performance
9.8. NXP Semiconductors N.V.
9.8.1. Company overview
9.8.2. Key executives
9.8.3. Company snapshot
9.8.4. Operating business segments
9.8.5. Product portfolio
9.8.6. Business performance
9.9. Texas Instruments Inc.
9.9.1. Company overview
9.9.2. Key executives
9.9.3. Company snapshot
9.9.4. Operating business segments
9.9.5. Product portfolio
9.10. ST Microelectronics
9.10.1. Company overview
9.10.2. Company snapshot
9.10.3. Operating business segments
9.10.4. Product portfolio
9.10.5. R&D expenditure
List of Tables
RUGGED IC MARKET SHARE, BY LEVEL, 2020–2030 ($MILLION)
RUGGED IC MARKET SHARE FOR SEMI-RUGGED, BY REGION, 2020–2030 ($MILLION)
RUGGED IC MARKET SHARE FOR FULLY-RUGGED, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET SHARE FOR ULTRA-RUGGED, BY REGION 2020–2030 ($MILLION)
RUGGED IC SHARE FOR MOBILE PHONES, BY REGION, 2020–2030 ($MILLION)
RUGGED IC MARKET SHARE, FOR TABLETS, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET SHARE, FOR SCANNERS, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET SHARE, FOR OTHERS, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET SHARE, BY END USE, 2020–2030 ($MILLION)
RUGGED IC MARKET FOR CONSUMER ELECTRONICS, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET FOR AUTOMOTIVE, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET FOR HEALTHCARE, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET FOR INDUSTRIAL, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET FOR MANUFACTURING, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET FOR OTHERS, BY REGION 2020–2030 ($MILLION)
RUGGED IC MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
NORTH AMERICA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
NORTH AMERICA RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
NORTH AMERICA APPLICATION MARKET, BY END USE, 2020–2030 ($MILLION)
U.S. RUGGED IC, BY LEVEL, 2020–2030 ($MILLION)
U.S. RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
U.S. RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
CANADA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
CANADA RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
CANADA RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
MEXICO RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
MEXICO RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
MEXICO RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
EUROPE RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
EUROPE RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
EUROPE RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
UK RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
UK RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
UK RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
GERMANY RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
GERMANY RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
GERMANY RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
FRANCE RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
FRANCE RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
FRANCE RUGGED IC MARKET, BY END USE 2020–2030 ($MILLION)
REST OF EUROPE RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
REST OF EUROPE RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
REST OF EUROPE RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
ASIA-PACIFIC RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
ASIA-PACIFIC RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
ASIA-PACIFIC RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
CHINA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
CHINA RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
CHINA RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
JAPAN RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
JAPAN RUGGED IC MARKET, BY APPLICATION, 2020–2028 ($MILLION)
JAPAN RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
INDIA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
INDIA RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
INDIA RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
SOUTH KOREA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
SOUTH KOREA RUGGED IC MARKET, BY APPLICATIONL, 2020–2030 ($MILLION)
SOUTH KOREA RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
REST OF ASIA-PACIFIC RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
REST OF ASIA-PACIFIC RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
REST OF ASIA-PACIFIC RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
LAMEA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
LAMEA RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
LAMEA RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
LATIN AMERICA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
LATIN AMERICA RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
LATIN AMERICA RUGGED IC MARKET, BY USE, 2020–2030 ($MILLION)
MIDDLE EAST RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
MIDDLE EAST RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
MIDDLE EAST RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
AFRICA RUGGED IC MARKET, BY LEVEL, 2020–2030 ($MILLION)
AFRICA RUGGED IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
AFRICA RUGGED IC MARKET, BY END USE, 2020–2030 ($MILLION)
GENERAL DYNAMICS CORPORATION:KEY EXECUTIVES
GENERAL DYNAMICS CORPORATION: COMPANY SNAPSHOT
GENERAL DYNAMICS CORPORATION: OPERATING SEGMENTS
GENERAL DYNAMICS CORPORATION: PRODUCT PORTFOLIO
CABASSE GROUP: KEY STRATEGIC MOVES AND DEVELOPMENTS
CRYSTAL GROUP INC.:KEY EXECUTIVES
CRYSTAL GROUP INC.: COMPANY SNAPSHOT
CRYSTAL GROUP INC.: OPERATING SEGMENTS
EVE SYSTEMS: PRODUCT PORTFOLIO
CRYSTAL GROUP INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
RICHTEK TECHNOLOGY CORPORATION.:KEY EXECUTIVES
RICHTEK TECHNOLOGY CORPORATION: COMPANY SNAPSHOT
RICHTEK TECHNOLOGY CORPORATION.: OPERATING SEGMENTS
RICHTEK TECHNOLOGY CORPORATION: PRODUCT PORTFOLIO
RICHTEK TECHNOLOGY CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 01. QUALCOMM INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 02. HONEYWELL INTERNATIONAL INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 01. INFINEON TECHNOLOGIES AG: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 02. ANALOG DEVICES INC.: KEY EXECUTIVES
TABLE 03. ANALOG DEVICES INC.: COMPANY SNAPSHOT
TABLE 04. ANALOG DEVICES INC.: OPERATING SEGMENTS
TABLE 05. ANALOG DEVICES INC.: PRODUCT PORTFOLIO
TABLE 06. ANALOG DEVICES INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 07. NXP SEMICONDUCTORS N.V.: KEY EXECUTIVES
TABLE 08. NXP SEMICONDUCTORS N.V.: COMPANY SNAPSHOT
TABLE 09. NXP SEMICONDUCTORS N.V.: OPERATING SEGMENTS
TABLE 10. NXP SEMICONDUCTORS N.V.: PRODUCT PORTFOLIO
TABLE 01. NXP SEMICONDUCTORS N.V.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 01. TEXAS INSTRUMENTS INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 01. ST MICROELECTRONICS: KEY STRATEGIC MOVES AND DEVELOPMENTS
List of Figures
FIGURE 01. KEY MARKET SEGMENTS
FIGURE 02. EXECUTIVE SUMMARY, BY SEGMENTATION
FIGURE 03. EXECUTIVE SUMMARY, BY REGION
FIGURE 04. TOP IMPACTING FACTORS
FIGURE 05. TOP INVESTMENT POCKETS
FIGURE 06. MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 07. HIGH THREAT OF NEW ENTRANTS
FIGURE 08. MODERATE TO HIGH THREAT OF SUBSTITUTES
FIGURE 09. MODERATE TO HIGH INTENSITY OF RIVALRY
FIGURE 10. MODERATE BARGAINING POWER OF BUYERS
FIGURE 11. PATENT ANALYSIS, BY COUNTRY
FIGURE 12. PATENT ANALYSIS, BY APPLICANT
FIGURE 13. RUGGED IC MARKET SHARE, BY LEVEL, 2020–2030 (%)
FIGURE 14. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET SHARE FOR SEMI-RUGGED, BY COUNTRY, 2020 & 2030 (%)
FIGURE 15. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET SHARE FOR FULLY-RUGGED, BY COUNTRY, 2020 & 2030 (%)
FIGURE 16. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET SHARE FOR ULTRA-RUGGED, BY COUNTRY, 2020 & 2030 (%)
FIGURE 17. RUGGED IC MARKET SHARE, BY APPLICATION, 2020–2028 (%)
FIGURE 18. RUGGED IC SHARE, BY APPLICATION, 2020–2030 ($MILLION)
FIGURE 19. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET FOR MOBILE PHONES, BY COUNTRY, 2020 & 2030 (%)
FIGURE 20. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET SHARE, FOR TABLETS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 21. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET SHARE, FOR SCANNERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 22. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET SHARE, FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 23. RUGGED IC MARKET SHARE, BY END USE, 2020–2030 (%)
FIGURE 24. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 25. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET FOR AUTOMOTIVE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 26. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET FOR HEALTHCARE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 27. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET FOR INDUSTRIAL, BY COUNTRY, 2020 & 2030 (%)
FIGURE 28. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET FOR MANUFACTURING BY COUNTRY, 2020 & 2030 (%)
FIGURE 29. COMPARATIVE SHARE ANALYSIS RUGGED IC MARKET FOR OTHER, BY COUNTRY, 2020 & 2030 (%)
FIGURE 30. RUGGED IC MARKET, BY REGION, 2020–2030 (%)
FIGURE 31. COMPARATIVE SHARE ANALYSIS OF NORTH AMERICA RUGGED IC MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 32. U.S. RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 33. CANADA RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 34. MEXICO RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 35. COMPARATIVE SHARE ANALYSIS OF EUROPE RUGGED IC MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 36. UK RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 37. GERMANY RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 38. FRANCE RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 39. REST OF EUROPE RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 40. COMPARATIVE SHARE ANALYSIS OF ASIA-PACIFIC RUGGED IC MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 41. CHINA RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 42. JAPAN RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 43. INDIA RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 44. SOUTH KOREA RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 45. REST OF ASIA-PACIFIC RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 46. COMPARATIVE SHARE ANALYSIS OF LAMEA RUGGED IC MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 47. LATIN AMERICA RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 48. MIDDLE EAST RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 49. AFRICA RUGGED IC MARKET, 2020–2030 ($MILLION)
FIGURE 50. MARKET PLAYER POSITIONING, 2019
FIGURE 51. TOP WTOP WINNING STRATEGIES, BY YEAR, 2019–2021
FIGURE 52. TOP WINNING STRATEGIES, BY DEVELOPMENT, 2019–2021 (%)
FIGURE 53. TOP WINNING STRATEGIES, BY COMPANY, 2019–2021
FIGURE 54. COMPETITIVE DASHBOARD
FIGURE 55. COMPETITIVE HEATMAP OF KEY PLAYERS
FIGURE 56. GENERAL DYNAMICS CORPORATION: REVENUE, 2018–2020 ($MILLION)
FIGURE 01. GENERAL DYNAMICS CORPORATION: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 02. GENERAL DYNAMICS CORPORATION: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 03. QUALCOMM INC: REVENUE, 2018–2020 ($MILLION)
FIGURE 04. QUALCOMM INC: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 05. HONEYWELL INTERNATIONAL INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 06. HONEYWELL INTERNATIONAL INC.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 07. INFINEON TECHNOLOGIES AG: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 08. INFINEON TECHNOLOGIES AG: REVENUE, 2018–2020 ($MILLION)
FIGURE 09. INFINEON TECHNOLOGIES AG: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 10. INFINEON TECHNOLOGIES AG: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 11. ANALOG DEVICES INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 01. ANALOG DEVICES INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 02. NXP SEMICONDUCTORS N.V.: REVENUE, 2018–2020 ($MILLION)
FIGURE 03. NXP SEMICONDUCTORS N.V.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 04. NXP SEMICONDUCTORS N.V.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 05. TEXAS INSTRUMENTS INC. : REVENUE, 2018–2020 ($MILLION)
FIGURE 06. TEXAS INSTRUMENTS INC.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 01. TEXAS INSTRUMENTS INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 02. ST MICROELECTRONICS: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 03. ST MICROELECTRONICS : REVENUE, 2018–2020 ($MILLION)
FIGURE 04. ST MICROELECTRONICS: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 05. ST MICROELECTRONICS: REVENUE SHARE, BY REGION, 2020 (%)

Companies Mentioned

  • General Dynamics Corporation
  • Crystal Group
  • Richtek Technology Corporation
  • Qualcomm
  • Honeywell International Inc.
  • Infineon Technologies AG
  • Analog Devices Inc.
  • NXP Semiconductors N.V.
  • Texas Instruments Inc.
  • STMicroelectronics

Methodology

The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.

They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.

They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:

  • Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
  • Scientific and technical writings for product information and related preemptions
  • Regional government and statistical databases for macro analysis
  • Authentic news articles and other related releases for market evaluation
  • Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast

Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.

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