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Europe Rugged IC Market By Level, By End Use, By Application, By Country, Opportunity Analysis and Industry Forecast, 2021-2027

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    Report

  • 115 Pages
  • January 2022
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5552982
The Europe Rugged IC Market is expected to witness market growth of 5.4% CAGR during the forecast period (2021-2027).

Rugged devices are critical throughout the industrial value chain, from material gathering to incoming and outbound logistics, procurement, demand management, order fulfilment, manufacturing flow management, and product development to commercialization and last-mile delivery.

Every executive at all of these operational levels is outfitted with ruggedized portable devices that allow them to execute a wide range of tasks such as record keeping, inventory management, communication, client interaction, and payment processing, among others. So, the first advantage of a rugged gadget is its incredibly durable and tested built, which enables the devices to operate under harsh climatic and work conditions, as well as their resistance to physical stress, dampness, water, heat, and even sandstorms.

Germany is Europe's largest production and sales market by a long shot. The country's world-class research and development facilities, extensive industrial value chain integration, and highly qualified personnel offer an unrivalled automotive environment on the worldwide stage. It enables businesses to create cutting-edge technologies that perfectly answer the mobility needs of the future. Along with that, several manufacturers across this region are heavily investing in making their products more efficient and boosting their performance, and thus, they are using rugged IC.

The Germany market dominated the Europe Rugged IC Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $79.9 million by 2027. The UK market is expected to witness a CAGR of 4.7% during (2021 - 2027). Additionally, The France market is experiencing a CAGR of 6.2% during (2021 - 2027).

Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.

Scope of the Study


Market Segments Covered in the Report:


By Level

  • Fully Rugged
  • Semi Rugged and
  • Others

By End Use

  • Consumer Electronics
  • Manufacturing
  • Healthcare
  • Industrial
  • Automotive and
  • Others

By Application

  • Mobile Phones
  • Tablets
  • Scanners and
  • Others

By Country

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Key Market Players


List of Companies Profiled in the Report:

  • Crystal Group, Inc.
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Honeywell International, Inc.
  • Analog Devices, Inc.
  • Infineon Technologies AG
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • MediaTek, Inc.
  • General Dynamics Corporation

Unique Offerings from the Publisher

  • Exhaustive coverage
  • The highest number of market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Rugged IC Market, by Level
1.4.2 Europe Rugged IC Market, by End Use
1.4.3 Europe Rugged IC Market, by Application
1.4.4 Europe Rugged IC Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.2.4 Geographical Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions 2020, Jun - 2021, Aug) Leading Players
Chapter 4. Europe Rugged IC Market by Level
4.1 Europe Rugged IC Fully Rugged Market by Country
4.2 Europe Rugged IC Semi Rugged Market by Country
4.3 Europe Rugged IC Ultra Rugged Market by Country
Chapter 5. Europe Rugged IC Market by End Use
5.1 Europe Consumer Electronics Rugged IC Market by Country
5.2 Europe Manufacturing Rugged IC Market by Country
5.3 Europe Healthcare Rugged IC Market by Country
5.4 Europe Industrial Rugged IC Market by Country
5.5 Europe Automotive Rugged IC Market by Country
5.6 Europe Other End Use Rugged IC Market by Country
Chapter 6. Europe Rugged IC Market by Application
6.1 Europe Mobile Phones Rugged IC Market by Country
6.2 Europe Tablets Rugged IC Market by Country
6.3 Europe Scanners Rugged IC Market by Country
6.4 Europe Others Rugged IC Market by Country
Chapter 7. Europe Rugged IC Market by Country
7.1 Germany Rugged IC Market
7.1.1 Germany Rugged IC Market by Level
7.1.2 Germany Rugged IC Market by End Use
7.1.3 Germany Rugged IC Market by Application
7.2 UK Rugged IC Market
7.2.1 UK Rugged IC Market by Level
7.2.2 UK Rugged IC Market by End Use
7.2.3 UK Rugged IC Market by Application
7.3 France Rugged IC Market
7.3.1 France Rugged IC Market by Level
7.3.2 France Rugged IC Market by End Use
7.3.3 France Rugged IC Market by Application
7.4 Russia Rugged IC Market
7.4.1 Russia Rugged IC Market by Level
7.4.2 Russia Rugged IC Market by End Use
7.4.3 Russia Rugged IC Market by Application
7.5 Spain Rugged IC Market
7.5.1 Spain Rugged IC Market by Level
7.5.2 Spain Rugged IC Market by End Use
7.5.3 Spain Rugged IC Market by Application
7.6 Italy Rugged IC Market
7.6.1 Italy Rugged IC Market by Level
7.6.2 Italy Rugged IC Market by End Use
7.6.3 Italy Rugged IC Market by Application
7.7 Rest of Europe Rugged IC Market
7.7.1 Rest of Europe Rugged IC Market by Level
7.7.2 Rest of Europe Rugged IC Market by End Use
7.7.3 Rest of Europe Rugged IC Market by Application
Chapter 8. Company Profiles
8.1 Crystal Group, Inc.
8.1.1 Company Overview
8.2 NXP Semiconductors N.V.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments
8.2.5.1 Product Launches and Product Expansions
8.2.6 SWOT Analysis
8.3 Qualcomm, Inc.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 Honeywell International, Inc.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Regional & Segmental Analysis
8.4.4 Research & Development Expenses
8.4.5 SWOT Analysis
8.5 Analog Devices, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 Recent strategies and developments
8.5.5.1 Geographical Expansions
8.5.6 SWOT Analysis
8.6 Infineon Technologies AG
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments
8.6.5.1 Partnerships, Collaborations, and Agreements
8.6.5.2 Product Launches and Product Expansions
8.6.5.3 Acquisitions and Mergers:
8.6.6 SWOT Analysis
8.7 STMicroelectronics N.V.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 Recent Strategies and Developments:
8.7.5.1 Partnerships, Collaborations and Agreements:
8.7.5.2 Product Launches and Product Expansions
8.7.6 SWOT Analysis
8.8 General Dynamics Corporation
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expense
8.8.5 SWOT Analysis
8.9 Texas Instruments, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 SWOT Analysis
8.10. MediaTek, Inc.
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Research & Development Expense
8.10.1 Recent strategies and developments
8.10.1.1 Partnerships, Collaborations, and Agreements
8.10.1.2 Acquisitions and Mergers:

Companies Mentioned

  • Crystal Group, Inc.
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Honeywell International, Inc.
  • Analog Devices, Inc.
  • Infineon Technologies AG
  • STMicroelectronics N.V.
  • Texas Instruments, Inc.
  • MediaTek, Inc.
  • General Dynamics Corporation

Methodology

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