The North America Rugged IC Market is expected to witness market growth of 5.3% CAGR during the forecast period (2021-2027).
Silicon carbide is used to make rugged ICs since this semiconducting material can sustain high voltage and has a high thermal conductivity. Rugged ICs are considerably superior than standard ICs in terms of design and build quality, and hence deliver higher performance to electrical equipment. These advanced integrated circuits increase analogue and digital circuit efficiency and are widely employed in industries such as electronics, power generation, automobiles, and aerospace.
With modest investments in development, research, and testing, the Rugged IC sector is likely to provide moderate cash production in the next years. The rugged IC market, on the other hand, is nearing maturity and should provide modest revenue for important key market players in the future.
Several manufacturing companies across this region need to manage their factories and warehouses. These warehouses hold a wide range of valuable objects, parts, and raw materials that can be utilised in a variety of industrial processes, as well as machine maintenance and distribution. These, together with the finished goods, must be preserved in a well-organized manner at all times, with sufficient responsibility. Owing to this, the demand and growth of rugged IC market is expected to witness a surge in the coming years.
The US market dominated the North America Rugged IC Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $262.3 million by 2027. The Canada market is expected to witness a CAGR of 7.7% during (2021 - 2027). Additionally, The Mexico market is expected to experience a CAGR of 6.7% during (2021 - 2027).
Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.
Silicon carbide is used to make rugged ICs since this semiconducting material can sustain high voltage and has a high thermal conductivity. Rugged ICs are considerably superior than standard ICs in terms of design and build quality, and hence deliver higher performance to electrical equipment. These advanced integrated circuits increase analogue and digital circuit efficiency and are widely employed in industries such as electronics, power generation, automobiles, and aerospace.
With modest investments in development, research, and testing, the Rugged IC sector is likely to provide moderate cash production in the next years. The rugged IC market, on the other hand, is nearing maturity and should provide modest revenue for important key market players in the future.
Several manufacturing companies across this region need to manage their factories and warehouses. These warehouses hold a wide range of valuable objects, parts, and raw materials that can be utilised in a variety of industrial processes, as well as machine maintenance and distribution. These, together with the finished goods, must be preserved in a well-organized manner at all times, with sufficient responsibility. Owing to this, the demand and growth of rugged IC market is expected to witness a surge in the coming years.
The US market dominated the North America Rugged IC Market by Country 2020, and is expected to continue to be a dominant market till 2027; thereby, achieving a market value of $262.3 million by 2027. The Canada market is expected to witness a CAGR of 7.7% during (2021 - 2027). Additionally, The Mexico market is expected to experience a CAGR of 6.7% during (2021 - 2027).
Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Level
- Fully Rugged
- Semi Rugged and
- Others
By End Use
- Consumer Electronics
- Manufacturing
- Healthcare
- Industrial
- Automotive and
- Others
By Application
- Mobile Phones
- Tablets
- Scanners and
- Others
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Crystal Group, Inc.
- NXP Semiconductors N.V.
- Qualcomm, Inc.
- Honeywell International, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- MediaTek, Inc.
- General Dynamics Corporation
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- Exhaustive coverage
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Competition Analysis - Global
Chapter 4. North America Rugged IC Market by Level
Chapter 5. North America Rugged IC Market by End Use
Chapter 6. North America Rugged IC Market by Application
Chapter 7. North America Rugged IC Market by Country
Chapter 8. Company Profiles
Companies Mentioned
- Crystal Group, Inc.
- NXP Semiconductors N.V.
- Qualcomm, Inc.
- Honeywell International, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- MediaTek, Inc.
- General Dynamics Corporation
Methodology
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