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Asia Pacific Embedded Security Market Size, Share & Industry Trends Analysis Report By Application, By Offering (Software, Hardware, and Services), By Security Type, By Country and Growth Forecast, 2022-2028

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    Report

  • 120 Pages
  • April 2022
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5600794
The Asia Pacific Embedded Security Market is expected to witness market growth of 6.3% CAGR during the forecast period (2022-2028).

Many embedded systems carry out mission-essential or safety-critical operations that are critical to the system's actual purposes and environment. Embedded system security affects a wide range of industries, from aerospace and defense to consumer electronics. The Internet of Things (IoT) is starting to connect modern embedded devices, which opens up fresh attack vectors. The most secured embedded system is one that is switched off, followed by one that is entirely isolated. Embedded software security was less essential when embedded systems were isolated technological islands with little data. Embedded systems are increasingly connected to a communications network, exposing them to a wider range of threat actors.

Traditional cybersecurity solutions are difficult to deploy on IoT devices and integrate them into an organization's security deployment due to their resource limitations. This problem can be solved using firmware-level security in embedded devices, which allows for easier device monitoring and administration. These factors are constantly propelling the demand for embedded security solutions and hence, the embedded security market is anticipated to observe several significant growth prospects throughout the forecast period.

The use of such security solutions has become necessary due to an increase in the number of attacks on every connected mobile device. In addition, the growing number of mobile subscriptions in this region propels the demand for embedded security solutions all over the world. The continuous trend of government-mandated digitalization in developing countries is driving up demand for secure IoT as well as embedded device infrastructure. The market for embedded security systems is projected to be fueled by new businesses from China and Japan developing innovative solutions in the embedded security area. The growing number of mobile subscriptions across the region is expected to boost growth even more.

The China market dominated the Asia Pacific Embedded Security Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $976.6 million by 2028. The Japan market is anticipated to grow at a CAGR of 5.7% during (2022-2028). Additionally, The India market is expected to showcase a CAGR of 7% during (2022-2028).

Based on Application, the market is segmented into Payment Processing & Card, Smart Identity Cards, Industrial, Smartphones, Wearables, Automotive, and Others. Based on Offering, the market is segmented into Software, Hardware, and Services. Based on Security Type, the market is segmented into Payment, Authentication & Access Management, and Content Protection. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Renesas Electronics Corporation, STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Texas Instruments, Inc., Samsung Electronics Co., Ltd. (Samsung Group), Thales Group S.A., IDEMIA SAS (Advent International, Inc.), Qualcomm, Inc., and Microchip Technology, Inc.

Scope of the Study


Market Segments Covered in the Report:


By Application
  • Payment Processing & Card
  • Smart Identity Cards
  • Industrial
  • Smartphones
  • Wearables
  • Automotive
  • Others
By Offering
  • Software
  • Hardware
  • Services
By Security Type
  • Payment
  • Authentication & Access Management
  • Content Protection

By Country
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players


List of Companies Profiled in the Report:

  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Texas Instruments, Inc.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Thales Group S.A.
  • IDEMIA SAS (Advent International, Inc.)
  • Qualcomm, Inc.
  • Microchip Technology, Inc.

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Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Embedded Security Market, by Application
1.4.2 Asia Pacific Embedded Security Market, by Offering
1.4.3 Asia Pacific Embedded Security Market, by Security Type
1.4.4 Asia Pacific Embedded Security Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.1 Market Share Analysis, 2020
3.2 Top Winning Strategies
3.2.1 Key Leading Strategies: Percentage Distribution (2018-2022)
3.2.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements: 2018, Apr - 2022, Jan) Leading Players
Chapter 4. Asia Pacific Embedded Security Market by Application
4.1 Asia Pacific Payment Processing & Card Market by Country
4.2 Asia Pacific Smart Identity Cards Market by Country
4.3 Asia Pacific Industrial Market by Country
4.4 Asia Pacific Smartphones Market by Country
4.5 Asia Pacific Wearables Market by Country
4.6 Asia Pacific Automotive Market by Country
4.7 Asia Pacific Others Market by Country
Chapter 5. Asia Pacific Embedded Security Market by Offering
5.1 Asia Pacific Software Market by Country
5.2 Asia Pacific Hardware Market by Country
5.3 Asia Pacific Services Market by Country
Chapter 6. Asia Pacific Embedded Security Market by Security Type
6.1 Asia Pacific Payment Market by Country
6.2 Asia Pacific Authentication & Access Management Market by Country
6.3 Asia Pacific Content Protection Market by Country
Chapter 7. Asia Pacific Embedded Security Market by Country
7.1 China Embedded Security Market
7.1.1 China Embedded Security Market by Application
7.1.2 China Embedded Security Market by Offering
7.1.3 China Embedded Security Market by Security Type
7.2 Japan Embedded Security Market
7.2.1 Japan Embedded Security Market by Application
7.2.2 Japan Embedded Security Market by Offering
7.2.3 Japan Embedded Security Market by Security Type
7.3 India Embedded Security Market
7.3.1 India Embedded Security Market by Application
7.3.2 India Embedded Security Market by Offering
7.3.3 India Embedded Security Market by Security Type
7.4 South Korea Embedded Security Market
7.4.1 South Korea Embedded Security Market by Application
7.4.2 South Korea Embedded Security Market by Offering
7.4.3 South Korea Embedded Security Market by Security Type
7.5 Singapore Embedded Security Market
7.5.1 Singapore Embedded Security Market by Application
7.5.2 Singapore Embedded Security Market by Offering
7.5.3 Singapore Embedded Security Market by Security Type
7.6 Malaysia Embedded Security Market
7.6.1 Malaysia Embedded Security Market by Application
7.6.2 Malaysia Embedded Security Market by Offering
7.6.3 Malaysia Embedded Security Market by Security Type
7.7 Rest of Asia Pacific Embedded Security Market
7.7.1 Rest of Asia Pacific Embedded Security Market by Application
7.7.2 Rest of Asia Pacific Embedded Security Market by Offering
7.7.3 Rest of Asia Pacific Embedded Security Market by Security Type
Chapter 8. Company Profiles
8.1 Renesas Electronics Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Partnerships, Collaborations, and Agreements:
8.1.5.2 Product Launches and Product Expansions:
8.1.5.3 Acquisition and Mergers:
8.2 STMicroelectronics N.V.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments:
8.2.5.1 Partnerships, Collaborations, and Agreements:
8.2.5.2 Acquisition and Mergers:
8.2.6 SWOT Analysis
8.3 Infineon Technologies AG
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expense
8.3.5 Recent strategies and developments:
8.3.5.1 Partnerships, Collaborations, and Agreements:
8.3.5.2 Product Launches and Product Expansions:
8.3.5.3 Acquisition and Mergers:
8.3.6 SWOT Analysis
8.4 NXP Semiconductors N.V.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Regional Analysis
8.4.4 Research & Development Expense
8.4.5 Recent strategies and developments:
8.4.5.1 Partnerships, Collaborations, and Agreements:
8.4.5.2 Product Launches and Product Expansions:
8.4.5.3 Acquisition and Mergers:
8.4.6 SWOT Analysis
8.5 Texas Instruments, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments:
8.5.5.1 Partnerships, Collaborations, and Agreements:
8.5.5.2 Product Launches and Product Expansions:
8.5.6 SWOT Analysis
8.6 Samsung Electronics Co., Ltd. (Samsung Group)
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.6.5 Recent strategies and developments:
8.6.5.1 Partnerships, Collaborations, and Agreements:
8.6.5.2 Product Launches and Product Expansions:
8.6.6 SWOT Analysis
8.7 Thales Group S.A.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research and Development Expense
8.7.5 Recent strategies and developments:
8.7.5.1 Acquisition and Mergers:
8.8 IDEMIA SAS (Advent International, Inc.)
8.8.1 Company Overview
8.8.2 Recent strategies and developments:
8.8.2.1 Partnerships, Collaborations, and Agreements:
8.9 Qualcomm, Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 Recent strategies and developments:
8.9.5.1 Partnerships, Collaborations, and Agreements:
8.9.5.2 Acquisition and Mergers:
8.9.6 SWOT Analysis
8.10. Microchip Technology, Inc.
8.10.1 Company overview
8.10.2 Financial Analysis
8.10.3 Segmental and Regional Analysis
8.10.4 Research & Development Expenses
8.10.5 Recent strategies and developments:
8.10.5.1 Partnerships, Collaborations, and Agreements:
8.10.5.2 Product Launches and Product Expansions:
8.10.5.3 Acquisition and Mergers:

Companies Mentioned

  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • Texas Instruments, Inc.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Thales Group S.A.
  • IDEMIA SAS (Advent International, Inc.)
  • Qualcomm, Inc.
  • Microchip Technology, Inc.

Methodology

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